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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
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Notes:
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XCKU025-2FFVA1156I: AMD Xilinx Kintex UltraScale FPGA – Full Specifications & Product Guide

Product Details

The XCKU025-2FFVA1156I is a high-performance field programmable gate array (FPGA) from AMD Xilinx, part of the Kintex® UltraScale™ family. Built on a 20nm process node, this device delivers an exceptional balance of signal processing performance, transceiver bandwidth, and cost-efficiency — making it an ideal choice for mid-range embedded computing, wireless infrastructure, test and measurement, and data acquisition applications.

This guide covers complete specifications, key features, ordering information, and typical use cases for the XCKU025-2FFVA1156I to help engineers make informed design decisions.


What Is the XCKU025-2FFVA1156I?

The XCKU025-2FFVA1156I is a member of Xilinx’s Xilinx FPGA Kintex UltraScale series — a family specifically designed to offer the best price-to-performance ratio at the 20nm technology node. The “2” in the part number designates Speed Grade 2, the “-I” suffix indicates an Industrial temperature range (−40°C to +100°C junction temperature), and “FFVA1156” refers to the 1156-ball Fine-pitch Flip Chip Ball Grid Array (FC-BGA) package.

This device is suited for designs that require high DSP throughput, large on-chip memory, and multi-gigabit serial connectivity without the cost overhead of a full Virtex-class device.


XCKU025-2FFVA1156I Key Specifications at a Glance

Parameter Value
Manufacturer AMD (Xilinx)
Part Number XCKU025-2FFVA1156I
FPGA Family Kintex UltraScale
Process Technology 20nm
Package FCBGA-1156 (FFVA1156)
Package Ball Pitch 1.0mm
Speed Grade -2
Temperature Grade Industrial (–40°C to +100°C Tj)
Core Supply Voltage (VCCINT) 0.922V – 0.979V (nominal 0.95V)
Logic Cells (Macrocells) 318,150
CLB LUTs 145,440
CLB Flip-Flops 290,880
CLBs 18,180
Maximum User I/O 312
Block RAM Capacity ~13 Mb (360 × 36Kb BRAMs)
DSP48E2 Slices 1,152
GTH Transceivers 12 (up to 16.3 Gb/s)
Transceiver Aggregate Bandwidth 391 Gb/s
PCIe Gen3 ×8 (hard IP)
Clock Management Tiles (CMT) MMCM + PLL
RoHS Compliant Yes
Moisture Sensitivity Level MSL 4 – 72 hours

XCKU025-2FFVA1156I Detailed Architecture & Features

Configurable Logic: CLBs and LUTs

The XCKU025 contains 18,180 Configurable Logic Blocks (CLBs), each comprising eight 6-input Look-Up Tables (LUTs) and associated flip-flops. This gives a total of 145,440 LUTs and 290,880 flip-flops, providing substantial capacity for complex digital logic, state machines, and custom data paths.

Each LUT can also be configured as a 32-bit distributed RAM or shift register, adding flexible on-fabric memory options beyond dedicated block RAM.

DSP48E2 Slices for High-Speed Signal Processing

The XCKU025-2FFVA1156I integrates 1,152 DSP48E2 slices, each featuring a 27×18 signed multiplier, 48-bit accumulator, pre-adder, and wide XOR function. At Speed Grade -2, DSP48E2 slices achieve a maximum operating frequency of 661 MHz, delivering up to 7,297 GMAC/s of peak multiply-accumulate performance. This makes the device well-suited for digital signal processing chains including FIR/IIR filters, FFTs, and forward error correction (FEC).

Block RAM and On-Chip Memory

Memory Type Quantity Per-Block Capacity Total
36Kb Block RAM (RAMB36) 360 36 Kb ~12.66 Mb
18Kb Block RAM (RAMB18) 720 (configurable) 18 Kb ~12.66 Mb
Distributed RAM LUT-based Varies ~5.4 Mb (est.)

Block RAMs support true dual-port operation, built-in FIFO logic, and optional ECC. At Speed Grade -2, block RAM operates at up to 585 MHz, supporting high-bandwidth data buffering, FIFOs, and lookup table acceleration.

GTH High-Speed Serial Transceivers

The XCKU025-2FFVA1156I provides 12 GTH transceivers supporting line rates from 500 Mb/s up to 16.3 Gb/s in the FFVA1156 package. These transceivers are arranged in groups of four (Quads), sharing a QPLL for low-jitter clock generation while each channel also includes a dedicated CPLL for flexibility.

The 12 GTH channels deliver a total aggregate bandwidth of 391 Gb/s (full duplex), supporting protocols such as PCIe Gen3, 10GbE, CPRI, JESD204B, and custom serial links.

Integrated Hard IP Blocks

Hard IP Block Details
PCIe Gen3 ×8 lane configuration, Gen1/2/3 backward compatible
100G Ethernet MAC Not included (available in KU060 and above)
150G Interlaken Not included (available in KU060 and above)
CMAC / ILKN Not included in XCKU025

Clock Management and I/O

Each Clock Management Tile (CMT) in the XCKU025 pairs one Mixed-Mode Clock Manager (MMCM) with one Phase-Locked Loop (PLL), enabling precise clock synthesis, phase shifting, and dynamic reconfiguration. The device includes 312 maximum user I/Os in the FFVA1156 package, organized into High-Performance (HP) banks supporting I/O voltages from 1.0V to 1.8V with differential I/O and Digitally Controlled Impedance (DCI).


Part Number Decoder: Understanding XCKU025-2FFVA1156I

Understanding the Xilinx part number syntax helps confirm the exact variant for your design:

Field Value Meaning
XC XC Xilinx Commercial Product
Family KU Kintex UltraScale
Device 025 Device size (smallest in Kintex UltraScale)
Speed Grade -2 Mid-range speed (range: -1L, -1, -2, -3)
Package FFVA Fine-pitch Flip Chip BGA
Ball Count 1156 1156 solder balls
Temperature I Industrial grade (–40°C to +100°C)

Operating Conditions and Electrical Characteristics

Recommended Operating Voltages

Supply Rail Min (V) Typical (V) Max (V) Function
VCCINT 0.922 0.950 0.979 Core logic supply
VCCAUX 1.710 1.800 1.890 Auxiliary supply
VCCO (HP banks) 1.00 1.0–1.8 1.890 I/O supply (HP)
VMGTAVCC 0.922 0.950 0.979 GTH transceiver analog core
VMGTAVTT 1.140 1.200 1.260 GTH transceiver termination
VMGTVCCAUX 1.710 1.800 1.890 GTH transceiver auxiliary

Temperature and Thermal Ratings

Parameter Value
Operating Junction Temperature (Tj) –40°C to +100°C (Industrial)
Package FC-BGA with heat spreader lid
Thermal Management Active cooling recommended for designs >5W

The FFVA1156 package includes a heat spreader lid that improves thermal transfer to external heatsinks, making thermal management more straightforward in high-utilization designs.


XCKU025-2FFVA1156I vs. Related Kintex UltraScale Devices

The XCKU025 is the entry-level device in the Kintex UltraScale family. The table below compares it with adjacent family members sharing the same FFVA1156 package for migration planning:

Part Number LUTs DSP48E2 Block RAM GTH Transceivers Agg. BW
XCKU025-2FFVA1156I 145,440 1,152 ~13 Mb 12 391 Gb/s
XCKU035-2FFVA1156I 207,360 1,700 ~19 Mb 16 522 Gb/s
XCKU040-2FFVA1156I 242,400 1,920 ~21 Mb 20 GTY 652 Gb/s
XCKU060-2FFVA1156I 331,680 2,760 ~38 Mb 32 GTY 1,043 Gb/s

Because the FFVA1156 package uses a common 1.0mm ball pitch footprint across multiple Kintex UltraScale devices, the XCKU025 PCB layout is pin-compatible with larger devices like the XCKU035 and XCKU040, enabling a straightforward design migration path without PCB respins.


Supported Development Tools

The XCKU025-2FFVA1156I is fully supported by AMD’s Vivado Design Suite, which provides synthesis, implementation, simulation, and in-system debugging capabilities. Because this device is not in the entry-level device tier, it requires Vivado Design Edition or Enterprise Edition — it is not supported by the free WebPACK license tier.

Tool Purpose
Vivado Design Suite Synthesis, P&R, simulation, debug
Vitis High-level synthesis (HLS), embedded software
Xilinx Power Estimator (XPE) Pre-implementation power analysis
Signal Integrity Toolbox PCB channel simulation for GTH links
Vivado IP Integrator Block design for IP-centric workflows

Typical Application Areas

The XCKU025-2FFVA1156I is deployed across a broad range of demanding applications:

  • Wireless Infrastructure — Baseband processing for 4G/5G RRH and BBU designs using CPRI and JESD204B over GTH transceivers
  • Test and Measurement — High-speed data acquisition, arbitrary waveform generation, and logic analysis instruments
  • Video and Image Processing — Multi-channel 4K video pipeline processing with high LUT-to-DSP ratios
  • Aerospace and Defense — Industrial temperature grade makes this device suitable for rugged embedded computing platforms
  • Data Center Acceleration — PCIe Gen3 ×8 hard IP enables SmartNIC and data compression acceleration cards
  • Medical Imaging — DSP-intensive reconstruction pipelines for ultrasound and CT imaging systems
  • Communications — Backplane interconnect, optical transport, and forward error correction

Ordering Information

Parameter Value
Manufacturer Part Number XCKU025-2FFVA1156I
Manufacturer AMD (formerly Xilinx)
DigiKey Part Number XCKU025-2FFVA1156I-ND
Package Tray (FC-BGA 1156-ball)
Series Kintex UltraScale
RoHS Status RoHS Compliant
Export Control (ECCN) Verify with distributor for current classification

Frequently Asked Questions

Q: What is the difference between XCKU025-2FFVA1156I and XCKU025-2FFVA1156E? The “-I” suffix denotes Industrial temperature range (−40°C to +100°C junction temperature), while “-E” denotes Extended commercial range (0°C to +100°C). All other electrical specifications are identical.

Q: Is the XCKU025-2FFVA1156I pin-compatible with the XCKU040? Yes. Both devices share the FFVA1156 package footprint with 1.0mm ball pitch, allowing PCB-level migration between devices in this package sequence.

Q: What PCIe configuration does the XCKU025 support? The XCKU025 supports PCIe Gen3 ×8 via its integrated hard IP block, leveraging GTH transceivers for the physical interface.

Q: Which Vivado license is required? Kintex UltraScale devices require Vivado Design Edition or Enterprise Edition. The free WebPACK edition does not support this device family.

Q: What is the maximum GTH transceiver data rate in the FFVA1156 package? In the FFVA1156 package, GTH transceivers support line rates up to 16.3 Gb/s.


Summary

The XCKU025-2FFVA1156I is a capable, cost-effective mid-range FPGA that brings Xilinx’s proven UltraScale architecture to applications requiring high DSP throughput, multi-gigabit serial connectivity, and generous on-chip memory. Its 20nm process, Industrial temperature rating, and FFVA1156 package with a clear device migration path make it a compelling choice for engineers designing next-generation wireless, instrumentation, and embedded computing systems.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.