The XCKU025-2FFVA1156I is a high-performance field programmable gate array (FPGA) from AMD Xilinx, part of the Kintex® UltraScale™ family. Built on a 20nm process node, this device delivers an exceptional balance of signal processing performance, transceiver bandwidth, and cost-efficiency — making it an ideal choice for mid-range embedded computing, wireless infrastructure, test and measurement, and data acquisition applications.
This guide covers complete specifications, key features, ordering information, and typical use cases for the XCKU025-2FFVA1156I to help engineers make informed design decisions.
What Is the XCKU025-2FFVA1156I?
The XCKU025-2FFVA1156I is a member of Xilinx’s Xilinx FPGA Kintex UltraScale series — a family specifically designed to offer the best price-to-performance ratio at the 20nm technology node. The “2” in the part number designates Speed Grade 2, the “-I” suffix indicates an Industrial temperature range (−40°C to +100°C junction temperature), and “FFVA1156” refers to the 1156-ball Fine-pitch Flip Chip Ball Grid Array (FC-BGA) package.
This device is suited for designs that require high DSP throughput, large on-chip memory, and multi-gigabit serial connectivity without the cost overhead of a full Virtex-class device.
XCKU025-2FFVA1156I Key Specifications at a Glance
| Parameter |
Value |
| Manufacturer |
AMD (Xilinx) |
| Part Number |
XCKU025-2FFVA1156I |
| FPGA Family |
Kintex UltraScale |
| Process Technology |
20nm |
| Package |
FCBGA-1156 (FFVA1156) |
| Package Ball Pitch |
1.0mm |
| Speed Grade |
-2 |
| Temperature Grade |
Industrial (–40°C to +100°C Tj) |
| Core Supply Voltage (VCCINT) |
0.922V – 0.979V (nominal 0.95V) |
| Logic Cells (Macrocells) |
318,150 |
| CLB LUTs |
145,440 |
| CLB Flip-Flops |
290,880 |
| CLBs |
18,180 |
| Maximum User I/O |
312 |
| Block RAM Capacity |
~13 Mb (360 × 36Kb BRAMs) |
| DSP48E2 Slices |
1,152 |
| GTH Transceivers |
12 (up to 16.3 Gb/s) |
| Transceiver Aggregate Bandwidth |
391 Gb/s |
| PCIe |
Gen3 ×8 (hard IP) |
| Clock Management Tiles (CMT) |
MMCM + PLL |
| RoHS Compliant |
Yes |
| Moisture Sensitivity Level |
MSL 4 – 72 hours |
XCKU025-2FFVA1156I Detailed Architecture & Features
Configurable Logic: CLBs and LUTs
The XCKU025 contains 18,180 Configurable Logic Blocks (CLBs), each comprising eight 6-input Look-Up Tables (LUTs) and associated flip-flops. This gives a total of 145,440 LUTs and 290,880 flip-flops, providing substantial capacity for complex digital logic, state machines, and custom data paths.
Each LUT can also be configured as a 32-bit distributed RAM or shift register, adding flexible on-fabric memory options beyond dedicated block RAM.
DSP48E2 Slices for High-Speed Signal Processing
The XCKU025-2FFVA1156I integrates 1,152 DSP48E2 slices, each featuring a 27×18 signed multiplier, 48-bit accumulator, pre-adder, and wide XOR function. At Speed Grade -2, DSP48E2 slices achieve a maximum operating frequency of 661 MHz, delivering up to 7,297 GMAC/s of peak multiply-accumulate performance. This makes the device well-suited for digital signal processing chains including FIR/IIR filters, FFTs, and forward error correction (FEC).
Block RAM and On-Chip Memory
| Memory Type |
Quantity |
Per-Block Capacity |
Total |
| 36Kb Block RAM (RAMB36) |
360 |
36 Kb |
~12.66 Mb |
| 18Kb Block RAM (RAMB18) |
720 (configurable) |
18 Kb |
~12.66 Mb |
| Distributed RAM |
LUT-based |
Varies |
~5.4 Mb (est.) |
Block RAMs support true dual-port operation, built-in FIFO logic, and optional ECC. At Speed Grade -2, block RAM operates at up to 585 MHz, supporting high-bandwidth data buffering, FIFOs, and lookup table acceleration.
GTH High-Speed Serial Transceivers
The XCKU025-2FFVA1156I provides 12 GTH transceivers supporting line rates from 500 Mb/s up to 16.3 Gb/s in the FFVA1156 package. These transceivers are arranged in groups of four (Quads), sharing a QPLL for low-jitter clock generation while each channel also includes a dedicated CPLL for flexibility.
The 12 GTH channels deliver a total aggregate bandwidth of 391 Gb/s (full duplex), supporting protocols such as PCIe Gen3, 10GbE, CPRI, JESD204B, and custom serial links.
Integrated Hard IP Blocks
| Hard IP Block |
Details |
| PCIe Gen3 |
×8 lane configuration, Gen1/2/3 backward compatible |
| 100G Ethernet MAC |
Not included (available in KU060 and above) |
| 150G Interlaken |
Not included (available in KU060 and above) |
| CMAC / ILKN |
Not included in XCKU025 |
Clock Management and I/O
Each Clock Management Tile (CMT) in the XCKU025 pairs one Mixed-Mode Clock Manager (MMCM) with one Phase-Locked Loop (PLL), enabling precise clock synthesis, phase shifting, and dynamic reconfiguration. The device includes 312 maximum user I/Os in the FFVA1156 package, organized into High-Performance (HP) banks supporting I/O voltages from 1.0V to 1.8V with differential I/O and Digitally Controlled Impedance (DCI).
Part Number Decoder: Understanding XCKU025-2FFVA1156I
Understanding the Xilinx part number syntax helps confirm the exact variant for your design:
| Field |
Value |
Meaning |
| XC |
XC |
Xilinx Commercial Product |
| Family |
KU |
Kintex UltraScale |
| Device |
025 |
Device size (smallest in Kintex UltraScale) |
| Speed Grade |
-2 |
Mid-range speed (range: -1L, -1, -2, -3) |
| Package |
FFVA |
Fine-pitch Flip Chip BGA |
| Ball Count |
1156 |
1156 solder balls |
| Temperature |
I |
Industrial grade (–40°C to +100°C) |
Operating Conditions and Electrical Characteristics
Recommended Operating Voltages
| Supply Rail |
Min (V) |
Typical (V) |
Max (V) |
Function |
| VCCINT |
0.922 |
0.950 |
0.979 |
Core logic supply |
| VCCAUX |
1.710 |
1.800 |
1.890 |
Auxiliary supply |
| VCCO (HP banks) |
1.00 |
1.0–1.8 |
1.890 |
I/O supply (HP) |
| VMGTAVCC |
0.922 |
0.950 |
0.979 |
GTH transceiver analog core |
| VMGTAVTT |
1.140 |
1.200 |
1.260 |
GTH transceiver termination |
| VMGTVCCAUX |
1.710 |
1.800 |
1.890 |
GTH transceiver auxiliary |
Temperature and Thermal Ratings
| Parameter |
Value |
| Operating Junction Temperature (Tj) |
–40°C to +100°C (Industrial) |
| Package |
FC-BGA with heat spreader lid |
| Thermal Management |
Active cooling recommended for designs >5W |
The FFVA1156 package includes a heat spreader lid that improves thermal transfer to external heatsinks, making thermal management more straightforward in high-utilization designs.
XCKU025-2FFVA1156I vs. Related Kintex UltraScale Devices
The XCKU025 is the entry-level device in the Kintex UltraScale family. The table below compares it with adjacent family members sharing the same FFVA1156 package for migration planning:
| Part Number |
LUTs |
DSP48E2 |
Block RAM |
GTH Transceivers |
Agg. BW |
| XCKU025-2FFVA1156I |
145,440 |
1,152 |
~13 Mb |
12 |
391 Gb/s |
| XCKU035-2FFVA1156I |
207,360 |
1,700 |
~19 Mb |
16 |
522 Gb/s |
| XCKU040-2FFVA1156I |
242,400 |
1,920 |
~21 Mb |
20 GTY |
652 Gb/s |
| XCKU060-2FFVA1156I |
331,680 |
2,760 |
~38 Mb |
32 GTY |
1,043 Gb/s |
Because the FFVA1156 package uses a common 1.0mm ball pitch footprint across multiple Kintex UltraScale devices, the XCKU025 PCB layout is pin-compatible with larger devices like the XCKU035 and XCKU040, enabling a straightforward design migration path without PCB respins.
Supported Development Tools
The XCKU025-2FFVA1156I is fully supported by AMD’s Vivado Design Suite, which provides synthesis, implementation, simulation, and in-system debugging capabilities. Because this device is not in the entry-level device tier, it requires Vivado Design Edition or Enterprise Edition — it is not supported by the free WebPACK license tier.
| Tool |
Purpose |
| Vivado Design Suite |
Synthesis, P&R, simulation, debug |
| Vitis |
High-level synthesis (HLS), embedded software |
| Xilinx Power Estimator (XPE) |
Pre-implementation power analysis |
| Signal Integrity Toolbox |
PCB channel simulation for GTH links |
| Vivado IP Integrator |
Block design for IP-centric workflows |
Typical Application Areas
The XCKU025-2FFVA1156I is deployed across a broad range of demanding applications:
- Wireless Infrastructure — Baseband processing for 4G/5G RRH and BBU designs using CPRI and JESD204B over GTH transceivers
- Test and Measurement — High-speed data acquisition, arbitrary waveform generation, and logic analysis instruments
- Video and Image Processing — Multi-channel 4K video pipeline processing with high LUT-to-DSP ratios
- Aerospace and Defense — Industrial temperature grade makes this device suitable for rugged embedded computing platforms
- Data Center Acceleration — PCIe Gen3 ×8 hard IP enables SmartNIC and data compression acceleration cards
- Medical Imaging — DSP-intensive reconstruction pipelines for ultrasound and CT imaging systems
- Communications — Backplane interconnect, optical transport, and forward error correction
Ordering Information
| Parameter |
Value |
| Manufacturer Part Number |
XCKU025-2FFVA1156I |
| Manufacturer |
AMD (formerly Xilinx) |
| DigiKey Part Number |
XCKU025-2FFVA1156I-ND |
| Package |
Tray (FC-BGA 1156-ball) |
| Series |
Kintex UltraScale |
| RoHS Status |
RoHS Compliant |
| Export Control (ECCN) |
Verify with distributor for current classification |
Frequently Asked Questions
Q: What is the difference between XCKU025-2FFVA1156I and XCKU025-2FFVA1156E? The “-I” suffix denotes Industrial temperature range (−40°C to +100°C junction temperature), while “-E” denotes Extended commercial range (0°C to +100°C). All other electrical specifications are identical.
Q: Is the XCKU025-2FFVA1156I pin-compatible with the XCKU040? Yes. Both devices share the FFVA1156 package footprint with 1.0mm ball pitch, allowing PCB-level migration between devices in this package sequence.
Q: What PCIe configuration does the XCKU025 support? The XCKU025 supports PCIe Gen3 ×8 via its integrated hard IP block, leveraging GTH transceivers for the physical interface.
Q: Which Vivado license is required? Kintex UltraScale devices require Vivado Design Edition or Enterprise Edition. The free WebPACK edition does not support this device family.
Q: What is the maximum GTH transceiver data rate in the FFVA1156 package? In the FFVA1156 package, GTH transceivers support line rates up to 16.3 Gb/s.
Summary
The XCKU025-2FFVA1156I is a capable, cost-effective mid-range FPGA that brings Xilinx’s proven UltraScale architecture to applications requiring high DSP throughput, multi-gigabit serial connectivity, and generous on-chip memory. Its 20nm process, Industrial temperature rating, and FFVA1156 package with a clear device migration path make it a compelling choice for engineers designing next-generation wireless, instrumentation, and embedded computing systems.