The XC7VX980T-L2FFG1930E is a high-performance Xilinx FPGA from the AMD Xilinx Virtex-7 XT family. Designed for demanding applications that require maximum logic density, ultra-fast serial connectivity, and exceptional DSP throughput, this device stands as one of the most powerful FPGAs in the 28nm generation. Whether you are building advanced signal processing systems, high-bandwidth networking equipment, or compute-intensive prototyping platforms, the XC7VX980T-L2FFG1930E delivers the performance and flexibility required to meet the most stringent design goals.

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What Is the XC7VX980T-L2FFG1930E?

The XC7VX980T-L2FFG1930E is a member of the Xilinx Virtex-7 XT series — AMD’s flagship 7-series FPGA family optimized for high-performance serial connectivity and DSP-intensive workloads. It is built on a 28nm High-K Metal Gate (HKMG) process technology, which delivers a best-in-class balance of performance per watt. The “L2” designation in the part number indicates a low-power speed grade (-2L), while the “FFG1930” refers to the 1930-pin Flip-Chip Ball Grid Array (FCBGA) package, and “E” denotes an extended temperature / defense-grade variant, compliant with industrial and extended-reliability requirements.

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XC7VX980T-L2FFG1930E Key Specifications

General Identification

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Logic & Fabric Resources

The Virtex-7 XT fabric uses true 6-input LUT (LUT6) technology, configurable as distributed memory for maximum design flexibility. This architecture enables designers to implement deeply pipelined, high-frequency logic without the area penalty associated with older LUT structures.

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Memory Resources

Each 36 Kb BRAM block supports true dual-port access and integrates built-in FIFO logic, making on-chip data buffering straightforward without consuming additional logic resources.

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DSP Resources

The XC7VX980T includes 3,600 DSP48E1 slices, enabling up to 4.7 TMAC/s of peak fixed-point DSP performance. This makes it highly suitable for applications such as radar signal processing, software-defined radio (SDR), image processing pipelines, and high-frequency trading (HFT) logic engines.

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I/O & Package Specifications

The 900 user I/Os in a 1930-pin FCBGA package provide exceptional routing flexibility. High-Performance (HP) I/O banks support high-speed memory interfaces, while High-Range (HR) I/O banks accommodate a broader range of I/O voltages for peripheral connectivity.

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Serial Connectivity (GTH / GTX Transceivers)

The XC7VX980T integrates 80 GTH transceivers capable of serial data rates from 600 Mb/s up to 13.1 Gb/s, enabling aggregate serial bandwidth of over 1 Tb/s. A dedicated low-power mode is available for short-reach chip-to-chip links, significantly reducing dynamic power in backplane and board-to-board applications.

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PCIe Integration

The on-chip PCIe Gen3 x8 hard IP block reduces resource consumption and simplifies compliance, making the XC7VX980T-L2FFG1930E a natural fit for PCIe-attached acceleration cards, FPGA-as-a-service (FaaS) platforms, and data center applications.

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Electrical & Operating Conditions

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Part Number Decoder

Understanding the part number helps engineers verify the correct variant for their design:

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Virtex-7 XT Family Comparison

The XC7VX980T occupies the upper tier of the Virtex-7 XT family, offering the highest Block RAM density among devices in the 80-transceiver tier and the largest logic capacity below the XC7VX1140T.

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Key Features of the XC7VX980T-L2FFG1930E

High-Performance 28nm HKMG Fabric

Built on AMD’s 28nm High-K Metal Gate (HKMG) process, the Virtex-7 XT delivers substantially lower static and dynamic power compared to the previous 40nm Virtex-6 generation — while simultaneously improving performance. The -2L speed grade is specifically optimized to reduce leakage current while maintaining competitive timing closure for most designs.

Massive DSP Throughput for Compute-Intensive Applications

With 3,600 DSP48E1 slices delivering up to 4.7 TMAC/s, the XC7VX980T-L2FFG1930E excels in applications such as:

• Wideband digital signal processing (DSP)
• Fast Fourier Transform (FFT) engines
• Matrix multiplication for machine learning inference
• Digital pre-distortion (DPD) for wireless infrastructure
• Video processing pipelines (4K/8K, multi-channel)

Ultra-High-Speed Serial Connectivity

The 80 GTH transceivers operating up to 13.1 Gb/s make this FPGA suitable for multi-protocol serial designs including 100G Ethernet, OTN switching, CPRI fronthaul in 5G networks, and high-speed data acquisition systems requiring JESD204B interfaces.

Extended Temperature Grade for Harsh Environments

The “E” temperature grade certification allows operation across –40°C to +100°C junction temperature, qualifying this device for industrial, defense, aerospace, and telecommunications infrastructure applications where commercial-grade parts are not acceptable.

Large On-Chip Memory for Data-Intensive Designs

With 54,000 Kb (54 Mb) of Block RAM, the XC7VX980T-L2FFG1930E can buffer and process large data sets entirely on-chip, minimizing off-chip memory accesses and reducing system latency — critical for packet processing, image buffering, and real-time analytics.

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Typical Applications for the XC7VX980T-L2FFG1930E

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Supported Development Tools

The XC7VX980T-L2FFG1930E is fully supported by AMD’s design toolchains:

The recommended minimum Vivado version for full XC7VX980T support is Vivado 2013.4 or later. Using a recent Vivado release (2022 or 2023) is strongly recommended to access the latest IP cores, timing models, and DRC checks.

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Power Considerations

The -2L (low-power) speed grade of the XC7VX980T-L2FFG1930E is engineered to provide significantly reduced static power compared to the standard -2 grade, consuming up to 50% less power than the equivalent 40nm-generation device. Key supply rails include:

For accurate power estimation, use the Xilinx Power Estimator (XPE) spreadsheet or the Vivado Power Analysis tool with actual design activity factors.

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Ordering & Availability Information

Note: The XC7VX980T-L2FFG1930E is a high-density, defense-grade FPGA. Lead times may vary depending on market conditions. Contacting an authorized AMD distributor or franchised stocking partner is recommended to confirm current inventory and pricing.

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Frequently Asked Questions (FAQ)

What does “L2” mean in the part number XC7VX980T-L2FFG1930E?

The “L2” designates the low-power speed grade (-2L). This grade is optimized for reduced static (leakage) power while maintaining strong timing performance. It is different from the standard -2 and slower -1 speed grades.

What is the difference between the XC7VX980T-L2FFG1930E and the XC7VX980T-2FFG1930C?

The key differences are temperature grade and qualification level. The -L2FFG1930E is an Extended/Defense-grade variant rated for –40°C to +100°C, while the -2FFG1930C is a Commercial-grade variant rated for 0°C to +85°C. Both devices share the same silicon die and logic capacity.

Is the XC7VX980T-L2FFG1930E pin-compatible with other Virtex-7 XT devices in the 1930-pin package?

Yes. AMD Xilinx designed the Virtex-7 family with migration paths in mind. Several XC7VX-family devices share the FFG1930 footprint, enabling PCB-level migration between logic density variants. Always verify pin compatibility using the official AMD Virtex-7 Migration Guide before finalizing your PCB layout.

What programming file format does this FPGA use?

The XC7VX980T-L2FFG1930E uses .bit (bitstream) and .bin files generated by Vivado for configuration. The device supports JTAG, SPI, BPI (parallel NOR flash), and SelectMAP configuration modes.

Does this device support partial reconfiguration?

Yes. The Virtex-7 XT family supports Partial Reconfiguration (PR), allowing regions of the FPGA fabric to be reprogrammed at runtime without interrupting the rest of the design. This capability is valuable for adaptive hardware systems and long-running applications requiring dynamic function updates.

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Summary

The XC7VX980T-L2FFG1930E is one of AMD Xilinx’s most capable 7-series FPGAs, combining nearly 1 million logic cells, 3,600 DSP slices, 54 Mb of Block RAM, 80 high-speed GTH transceivers up to 13.1 Gb/s, and 900 user I/Os — all in an extended-temperature, low-power package. Its combination of raw compute capacity, high-bandwidth serial I/O, and rugged temperature qualification makes it a go-to solution for advanced wireless infrastructure, defense electronics, high-performance networking, and data center acceleration designs. Backed by the full AMD Vivado design ecosystem, engineers can take full advantage of this device’s capabilities from initial RTL development through to silicon bring-up and production deployment.