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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
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XC7VX485T-2FFG1158C: AMD Xilinx Virtex-7 FPGA — Complete Product Guide

Product Details

The XC7VX485T-2FFG1158C is a high-performance field-programmable gate array (FPGA) from AMD Xilinx’s Virtex-7 XT family. Built on a 28nm process node, this device delivers exceptional logic density, transceiver bandwidth, and DSP throughput — making it one of the most capable Xilinx FPGA solutions available for demanding system-level designs. Whether you are working in 100G networking, aerospace, high-performance computing, or ASIC prototyping, the XC7VX485T-2FFG1158C offers the processing muscle and I/O flexibility your design demands.


What Is the XC7VX485T-2FFG1158C?

The XC7VX485T-2FFG1158C is part of Xilinx’s Virtex-7 XT subfamily, which is optimized specifically for serial connectivity and transceiver performance. The part number breaks down as follows:

Part Number Segment Meaning
XC Xilinx Commercial product
7V 7 Series (Virtex-7 family)
X XT subfamily (transceiver-optimized)
485T 485,760 logic cells
-2 Speed grade 2 (standard commercial)
FFG Flip-chip Fine-pitch Ball Grid Array
1158 1,158 total ball count
C Commercial temperature range (0°C to +85°C)

This device belongs to the commercial temperature grade, packaged in a 1158-pin FCBGA (Flip-Chip Ball Grid Array) format — a compact yet high-density footprint suitable for high-speed PCB designs.


XC7VX485T-2FFG1158C Key Specifications

Core Logic and Fabric

Parameter Value
FPGA Family Virtex-7 XT
Technology Node 28nm
Logic Cells (Macrocells) 485,760
Logic Blocks (CLBs) 75,900
Total RAM Bits 37,080 Kbit (~4.5 MB)
DSP Slices 2,800
Speed Grade -2 (Standard Commercial)

I/O and Connectivity

Parameter Value
User I/O Count 350
Maximum User I/O 700 (package-dependent)
GTX Transceivers 56
Transceiver Data Rate Up to 12.5 Gb/s (GTX)
Total Serial Bandwidth Up to 2.8 Tb/s (family-wide)
Memory Interface Support DDR3-1866
Clock Management MMCM (Mixed-Mode Clock Manager), PLL
Maximum Operating Frequency 710 MHz

Power and Package

Parameter Value
Core Supply Voltage (VCCINT) 0.97V – 1.03V (nominal 1.0V)
I/O Supply Voltage (VCCO) Up to 3.3V
Auxiliary Supply Voltage (VCCAUX) 1.8V
Package Type FC-BGA (Flip-Chip Ball Grid Array)
Package Designation FFG1158
Total Pin Count 1,158
Operating Temperature 0°C to +85°C (Commercial)
RoHS Compliant Yes
Lead-Free Yes

Design Tool Support

Tool Minimum Version
Xilinx Vivado Design Suite 2012.4 v1.08
Xilinx ISE Design Suite 14.2 v1.06

XC7VX485T-2FFG1158C Part Number Decoder

Understanding a Xilinx part number helps engineers quickly identify exactly what device they are ordering. The XC7VX485T-2FFG1158C encodes all critical attributes in a compact string:

  • XC — Xilinx commercial-grade device
  • 7V — 7 Series, Virtex product line
  • X — XT subfamily (transceiver-focused variant of the Virtex-7 family)
  • 485T — 485,760 equivalent logic cell count
  • -2 — Speed grade 2, the standard performance tier for commercial designs
  • FFG — Flip-Chip Fine-Pitch Ball Grid Array package
  • 1158 — Ball count in the package (1,158 total balls)
  • C — Commercial temperature range

Virtex-7 XT Family Overview

The XC7VX485T-2FFG1158C sits within Xilinx’s Virtex-7 XT subfamily. The XT designation indicates transceivers-optimized devices within the broader Virtex-7 portfolio. Below is a comparison of key Virtex-7 XT devices to help you choose the right part:

Virtex-7 XT Family Comparison

Device Logic Cells GTX Transceivers Max User I/O Package Options
XC7VX330T 326,400 28 700 FFG1157, FFG1761
XC7VX485T 485,760 56 700 FFG1157, FFG1158, FFG1761, FFG1927
XC7VX550T 554,240 80 600 FFG1158, FFG1927
XC7VX690T 693,120 80 1,000 FFG1157, FFG1158, FFG1761, FFG1927
XC7VX980T 979,200 72 1,200 FFG1926, FFG1930

The XC7VX485T strikes a favorable balance between transceiver count (56 GTX lanes), logic capacity (~485K cells), and package size — making it a popular mid-tier choice within the XT lineup.


Detailed Feature Breakdown

High-Capacity Block RAM

The XC7VX485T-2FFG1158C provides 37,080 Kbits of total block RAM, organized as 36Kb dual-port RAM blocks. This on-chip memory is essential for buffering high-speed data streams, implementing FIFOs, and storing lookup tables in signal-processing pipelines. With approximately 4.5MB of embedded RAM, designers can avoid costly off-chip memory accesses for many applications.

GTX High-Speed Transceivers

One of the defining features of the XT subfamily is its 56 GTX transceivers, capable of operating at up to 12.5 Gb/s per lane. These transceivers support a wide range of high-speed serial standards including PCIe Gen2/Gen3, 10GbE, CPRI, SRIO, and more. The integrated transceiver architecture simplifies PCB design by eliminating external serializer/deserializer components.

Advanced Clock Management

The FPGA integrates MMCM (Mixed-Mode Clock Manager) and PLL resources to support precise, low-jitter clock synthesis and distribution. These resources allow designs to generate multiple derived clocks from a single reference, implement dynamic clock gating, and meet tight timing closure requirements at frequencies up to 710 MHz.

DSP Performance

With 2,800 DSP48E1 slices, the XC7VX485T-2FFG1158C delivers significant fixed-point arithmetic throughput for signal-processing applications. Each DSP48E1 slice implements a 25×18 multiplier with accumulator, enabling efficient implementation of FIR filters, FFTs, matrix multiplications, and similar compute-intensive functions without consuming general-purpose fabric resources.

Flexible I/O Architecture

The device’s 350 user I/Os are distributed across High-Performance (HP) and High-Range (HR) I/O banks, supporting a wide range of single-ended and differential signaling standards. HP banks support voltages up to 1.8V with high-speed performance, while HR banks extend compatibility to 3.3V legacy interfaces.


Applications for the XC7VX485T-2FFG1158C

Thanks to its combination of high logic density, abundant GTX transceivers, and strong DSP performance, the XC7VX485T-2FFG1158C is well-suited for a diverse range of application domains:

Networking and Communications

  • 10G to 100G line cards — Multiple GTX lanes enable aggregation of high-speed Ethernet links
  • Packet processing engines — Large BRAM and fabric capacity support deep-packet inspection and QoS engines
  • CPRI/OBSAI fronthaul — Used in 4G/5G radio access network infrastructure

High-Performance Computing (HPC)

  • Hardware accelerators — Offload compute-intensive workloads from CPUs/GPUs
  • ASIC prototyping — Large logic capacity makes it ideal for pre-silicon validation of complex ASICs
  • Financial computing — Ultra-low-latency trading algorithms benefit from the FPGA’s deterministic execution

Aerospace and Defense

  • Portable radar systems — DSP slices and high-speed I/Os support waveform generation and processing
  • Software-defined radio (SDR) — Reconfigurable logic enables multi-mode radio implementations
  • Electronic warfare — Signal classification and jamming systems built on high-bandwidth fabric

Scientific and Industrial

  • Scientific instrumentation — Data acquisition at high sample rates with on-chip processing
  • Medical imaging — Real-time image reconstruction using DSP slices
  • Oil and gas — Seismic data processing pipelines

Ordering and Availability Information

Attribute Detail
Manufacturer AMD (formerly Xilinx)
Full Part Number XC7VX485T-2FFG1158C
DigiKey Part Number 122-1859-ND
Package 1158-BBGA, FCBGA
Status Active
RoHS Compliance RoHS Compliant
Temperature Grade Commercial (0°C to +85°C)
Lead Finish Lead-Free
Tray Quantity Tray

Note: The XC7VX485T-2FFG1158C is subject to export control regulations. Confirm export compliance requirements before placing orders for shipment to restricted destinations.


XC7VX485T-2FFG1158C vs. Similar Devices

Engineers evaluating this FPGA often compare it against related parts. The table below highlights the key differences between the XC7VX485T-2FFG1158C and closely related variants:

Part Number Speed Grade Package Balls Temp Grade Transceivers
XC7VX485T-1FFG1158C -1 (slower) FFG1158 1,158 Commercial 56 GTX
XC7VX485T-2FFG1158C -2 (standard) FFG1158 1,158 Commercial 56 GTX
XC7VX485T-2FFG1158I -2 FFG1158 1,158 Industrial 56 GTX
XC7VX485T-2FFG1157C -2 FFG1157 1,157 Commercial 56 GTX
XC7VX485T-2FFG1761C -2 FFG1761 1,761 Commercial 56 GTX

The primary differentiation between these variants is speed grade (performance), package footprint, and temperature rating. The -2FFG1158C is the standard commercial choice when the 1158-ball footprint is the PCB constraint.


Design Considerations and PCB Guidelines

Power Supply Requirements

The XC7VX485T-2FFG1158C requires multiple supply rails for proper operation. Designers must sequence these supplies carefully, as specified in the Virtex-7 power-on requirements:

Supply Rail Nominal Voltage Purpose
VCCINT 1.0V Core logic supply
VCCAUX 1.8V Auxiliary logic supply
VCCBRAM 1.0V Block RAM supply
VCCO (HP banks) 1.0V / 1.2V / 1.5V / 1.8V High-performance I/O supply
VCCO (HR banks) 1.2V / 1.5V / 1.8V / 2.5V / 3.3V High-range I/O supply
VCCAUX_IO 1.8V or 2.0V I/O auxiliary supply

Use the Xilinx Power Estimator (XPE) or Vivado Power Analysis to accurately estimate current demand for your specific design before selecting power management ICs.

Thermal Management

At speed grade -2 with all resources active, the XC7VX485T-2FFG1158C can dissipate significant power. Proper thermal design — including heatsinks, thermal interface materials, and airflow analysis — is essential to maintain junction temperature below the maximum rated value. Refer to the Xilinx packaging and thermal guidelines for the FFG1158 package thermal resistance (θJB and θJC) values.

PCB Design Tips

  • Route GTX transceiver differential pairs with matched length and controlled impedance (100Ω differential)
  • Place decoupling capacitors close to each power pin to minimize noise on VCCINT and VCCAUX rails
  • Use the Xilinx PCB Design Checklist for Virtex-7 devices to verify your layout before fabrication
  • Reference the FFG1158 package outline drawing for ball map, keepout zones, and recommended via structures

Supported Design Tools

The XC7VX485T-2FFG1158C is fully supported by AMD Xilinx’s development toolchains:

Tool Function
Vivado Design Suite RTL synthesis, implementation, timing closure
Xilinx ISE Design Suite (legacy) Older design flows (ISE 14.2+)
Xilinx Power Estimator (XPE) Pre-implementation power estimation
Vivado Simulator Functional and timing simulation
ChipScope Pro / ILA On-chip debug and signal probing
PetaLinux / Yocto Embedded Linux for MicroBlaze soft processors

Frequently Asked Questions (FAQ)

What is the XC7VX485T-2FFG1158C used for?

This FPGA is used in high-speed networking (10G–100G), ASIC prototyping, aerospace radar systems, scientific instrumentation, and HPC acceleration. Its 56 GTX transceivers and large logic fabric make it ideal for bandwidth-intensive, computation-heavy designs.

What is the difference between speed grade -1 and -2 in Xilinx FPGAs?

Speed grade is a relative performance rating. In Xilinx terminology, a higher absolute number indicates faster performance — so speed grade -2 is faster than -1 and slower than -3. The -2 grade represents the standard commercial performance tier for the XC7VX485T.

Is the XC7VX485T-2FFG1158C RoHS compliant?

Yes. This device is fully RoHS compliant and manufactured with a lead-free ball finish, meeting global environmental regulations for electronic components.

What design tools do I need for this FPGA?

You will need Xilinx Vivado Design Suite (version 2012.4 or later) or the legacy ISE Design Suite (version 14.2 or later). Vivado is strongly recommended for new designs as it provides better timing closure, power analysis, and support for the full Virtex-7 feature set.

Can the XC7VX485T-2FFG1158C be upgraded to a larger package?

The XC7VX485T die is also available in the FFG1157 (1,157-pin) and FFG1761 (1,761-pin) packages, which expose more user I/O. Package migration within the same die allows board redesign with minimal RTL changes.


Summary

The XC7VX485T-2FFG1158C is a production-proven, high-density FPGA that combines 485,760 logic cells, 56 GTX transceivers, 37,080 Kbits of block RAM, and 2,800 DSP slices in a compact 1158-pin FC-BGA package. Operating at commercial temperatures with a 1.0V core supply and a maximum clock frequency of 710 MHz, it is engineered for the most demanding digital design challenges in networking, defense, HPC, and scientific computing.

For engineers and procurement teams looking for a reliable, high-performance programmable logic device with robust tool support and a strong ecosystem, the XC7VX485T-2FFG1158C remains a compelling choice within the Virtex-7 product line.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.