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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC7VX485T-2FF1927I: Xilinx Virtex-7 Industrial FPGA Specs & Datasheet

Product Details

XC7VX485T-2FF1927I: Xilinx Virtex-7 Industrial FPGA Specs & Datasheet

Meta Description: XC7VX485T-2FF1927I is an AMD Xilinx Virtex-7 XT industrial-grade FPGA with 485,760 logic cells in an FCBGA-1927 package. Explore specs, features, and applications.


Introduction to the XC7VX485T-2FF1927I FPGA

The XC7VX485T-2FF1927I is an industrial-grade, high-performance field-programmable gate array (FPGA) from the AMD Virtex-7 XT family, originally branded as Xilinx. Built on 28nm high-k metal gate (HKMG) process technology, this device combines 485,760 logic cells, high-speed GTH transceivers, and powerful DSP resources in a 1927-ball flip-chip BGA package. The industrial temperature rating makes it ideal for harsh-environment deployments such as outdoor radar, automotive test equipment, industrial imaging, and telecom infrastructure.

What Makes the XC7VX485T-2FF1927I Unique?

The distinguishing feature of this variant is its industrial temperature grade (suffix “I”), which supports a junction temperature range of −40°C to 100°C — significantly wider than the commercial “C” equivalents. The “FF” package code denotes a leaded (Sn-Pb) flip-chip BGA, preferred in some legacy aerospace, defense, and high-reliability programs where lead-free solder joints are not acceptable. The “-2” speed grade delivers a strong balance of timing performance and cost for production designs.

Key Features at a Glance

  • 28nm HKMG HPL process delivering up to 50% lower power than prior generations
  • DSP48E1 slices with 25×18 multiplier, 48-bit accumulator, and pre-adder
  • GTH transceivers running up to 13.1 Gb/s for SerDes-heavy protocols
  • Integrated PCIe hard IP (x8 Gen 2 support)
  • 256-bit AES bitstream encryption with HMAC/SHA-256 authentication
  • Built-in SEU detection and correction for mission-critical reliability

XC7VX485T-2FF1927I Technical Specifications

Logic, Memory, and DSP Resources

Parameter Specification
Logic Cells 485,760
CLB Flip-Flops 607,200
Block RAM (BRAM) 37,080 Kb (1,030 × 36 Kb)
Distributed RAM 8,175 Kb
DSP48E1 Slices 2,800
Clock Management Tiles 14 (MMCM + PLL)
Maximum Fabric Clock 710 MHz

I/O, Transceivers, and Interfaces

Parameter Specification
Maximum User I/O 600
GTH Transceivers 56 (up to 13.1 Gb/s)
PCIe Hard IP 4 × Gen 2 x8
Memory Interface DDR3-1866
I/O Standards LVCMOS, LVDS, HSTL, SSTL

Package and Environmental Data

Parameter Specification
Package FCBGA-1927 (Flip-Chip, Leaded Sn-Pb)
Ball Count 1,927
Ball Pitch 1.0 mm
Body Size 45 × 45 mm
Core Voltage (VCCINT) 0.97 V – 1.03 V
Operating Temperature −40°C to 100°C (Industrial, TJ)
Speed Grade -2

Typical Applications of the XC7VX485T-2FF1927I

The industrial temperature range and high transceiver count make this device well suited for:

  • Aerospace and defense — airborne radar, electronic warfare, SIGINT platforms
  • Telecom infrastructure — outdoor 10G/40G/100G line cards and base stations
  • Industrial automation — machine vision, motor control, and factory networking
  • Automotive test equipment — in-vehicle data acquisition and ADAS validation
  • Medical imaging — MRI, CT, and ultrasound signal front ends

Design Tools and Development Support

The XC7VX485T-2FF1927I is fully supported by the AMD Vivado Design Suite, which covers synthesis, place-and-route, timing closure, and secure bitstream generation for all 7 Series devices. Engineers also benefit from a mature ecosystem of AXI IP cores, reference designs, and board-level constraint files. Typical companion components include DDR3 SDRAM, QSPI configuration flash, and GTH-rated connectors for PCIe, SFP+, or backplane interconnects.

Sourcing the XC7VX485T-2FF1927I

Because this leaded, industrial-grade variant targets long-lifecycle programs, counterfeit risk is a real concern for procurement teams. Always purchase from authorized distributors or established stocking partners offering full traceability, X-ray inspection, and verified date codes. For bulk procurement, date-code matching, or hard-to-find leaded packages, you can check live inventory from a trusted Xilinx FPGA supplier that specializes in AMD programmable logic devices.


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Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.