The XC7VX485T-2FFG1157I is a high-performance Field Programmable Gate Array (FPGA) from the Xilinx Virtex-7 XT family, now under AMD. Designed for demanding signal processing, networking, and defense-grade applications, this device delivers exceptional logic density, DSP throughput, and I/O bandwidth in a compact 1157-pin FCBGA package. Whether you are building 10G–100G networking equipment, portable radar systems, or ASIC prototypes, the XC7VX485T-2FFG1157I offers the programmable horsepower your design needs.
What Is the XC7VX485T-2FFG1157I?
The XC7VX485T-2FFG1157I is a member of the Xilinx Virtex-7 XT FPGA series, fabricated on a 28 nm high-performance, low-power (HPL) process using high-k metal gate (HKMG) technology. It belongs to the extended temperature industrial grade (“I” suffix), making it suitable for environments ranging from –40°C to +100°C junction temperature. For engineers sourcing a proven Xilinx FPGA for next-generation systems, this device balances logic capacity, memory bandwidth, and transceiver performance in a single IC.
Part Number Breakdown
Understanding the XC7VX485T-2FFG1157I part number helps confirm you have the exact device for your design:
| Segment |
Value |
Meaning |
| XC7V |
XC7V |
Xilinx 7 Series FPGA |
| X |
X |
Virtex-7 XT (extended transceiver) variant |
| 485T |
485T |
485,760 logic cells |
| -2 |
-2 |
Speed grade 2 (standard commercial speed) |
| FFG |
FFG |
Flip-chip fine-pitch ball grid array package |
| 1157 |
1157 |
1,157-pin package |
| I |
I |
Industrial temperature grade |
XC7VX485T-2FFG1157I Key Specifications
The table below summarizes the critical electrical and physical specifications for the XC7VX485T-2FFG1157I:
| Parameter |
Value |
| FPGA Family |
Virtex-7 XT |
| Logic Cells |
485,760 |
| Logic Blocks (CLBs) |
75,900 |
| Total RAM |
37,080 Kbits (4.5 MB) |
| DSP Slices |
2,800 |
| Maximum User I/Os |
600 |
| Package |
1157-pin FCBGA (FF1157) |
| Maximum Operating Frequency |
710 MHz |
| Core Supply Voltage (Vccint) |
0.97 V – 1.03 V |
| I/O Supply Voltage (Vcco) |
Up to 3.3 V |
| Process Technology |
28 nm HPL HKMG |
| Temperature Grade |
Industrial (–40°C to +100°C Tj) |
| Clock Management |
MMCM + PLL |
| Configuration Security |
256-bit AES with HMAC/SHA-256 |
| Packaging |
Tray |
| RoHS Compliance |
Refer to datasheet/distributor |
XC7VX485T-2FFG1157I Detailed Features
High-Density Logic Fabric
The XC7VX485T-2FFG1157I provides 485,760 logic cells organized into 75,900 Configurable Logic Blocks (CLBs). Each CLB contains look-up tables (LUTs), flip-flops, and carry logic, enabling efficient implementation of both random logic and arithmetic-intensive designs. The fabric’s interconnect architecture supports routing congestion management critical for high-utilization designs in ASIC prototyping and networking applications.
Advanced DSP Performance
With 2,800 DSP48E2 slices, the XC7VX485T-2FFG1157I is tailored for compute-intensive workloads. Each DSP slice features:
| DSP Feature |
Specification |
| Multiplier Width |
25 × 18 bits |
| Accumulator Width |
48-bit |
| Pre-Adder |
Yes |
| Cascade |
Yes |
| Symmetric Coefficient Filtering |
Optimized support |
This architecture delivers up to 4.7 TMAC/s of DSP throughput across the Virtex-7 XT family, making the XC7VX485T-2FFG1157I ideal for FIR filters, FFT engines, radar waveform generators, and machine learning inference.
Embedded Block RAM
The device integrates 37,080 Kbits (approximately 4.5 MB) of block RAM (BRAM), organized as 36 Kb dual-port BRAM primitives. Block RAM can be configured as FIFOs, shift registers, or lookup tables, providing on-chip storage for packet buffers, coefficient tables, and inter-module communication.
Clock Management Tiles (CMT)
The XC7VX485T-2FFG1157I includes mixed-mode clock manager (MMCM) and PLL blocks within clock management tiles (CMTs). These provide:
- Phase-locked loop (PLL) and MMCM for frequency synthesis and deskewing
- Low-jitter clock generation for high-speed serial interfaces
- Dynamic phase shifting for timing optimization
- Multiple output clocks per CMT
High-Speed Serial Transceivers
The Virtex-7 XT variant adds GTH (GigaTransceiver High-speed) serial transceivers operating at multi-gigabit rates, supporting industry standards including PCIe, 10GbE, CPRI, and JESD204B. The 1157-pin package exposes a subset of the full transceiver complement optimized for mid-density connectivity applications.
Integrated PCIe Block
An integrated hard PCIe block supports up to x8 Gen3 Endpoint and Root Port configurations, reducing resource usage compared to soft PCIe implementations and improving signal integrity through optimized silicon routing.
Configuration and Security
The XC7VX485T-2FFG1157I supports multiple configuration modes including:
| Configuration Feature |
Description |
| AES Encryption |
256-bit for bitstream protection |
| Authentication |
HMAC/SHA-256 |
| SEU Detection |
Built-in single-event upset detection and correction |
| Memory Interfaces |
Commodity flash, SPI, BPI |
| Partial Reconfiguration |
Supported |
The industrial-grade security features make this FPGA well suited for defense, aerospace, and secure communications applications.
XC7VX485T-2FFG1157I Package and Pinout
The XC7VX485T-2FFG1157I is housed in a 1157-ball flip-chip fine-pitch BGA (FCBGA) package, also commonly listed as FF1157. Key package attributes:
| Package Attribute |
Detail |
| Package Type |
FCBGA (Flip-Chip Ball Grid Array) |
| Total Ball Count |
1,157 |
| User I/Os Available |
600 |
| I/O Bank Organization |
Multiple HR and HP banks |
| Solderable Interface |
BGA surface-mount |
The flip-chip construction improves thermal performance and electrical characteristics compared to wire-bond packages, important at high clock frequencies and when driving high-speed differential I/Os.
Applications for the XC7VX485T-2FFG1157I
The combination of industrial temperature rating, high logic density, and DSP capability makes the XC7VX485T-2FFG1157I a strong fit for:
| Application Area |
How the XC7VX485T-2FFG1157I Helps |
| 10G/40G/100G Networking |
High transceiver count, PCIe Gen3, and MAC logic |
| Portable Radar / EW Systems |
DSP slices, industrial temp range, AES security |
| ASIC Prototyping |
Large logic cell count, partial reconfiguration |
| High-Performance Computing |
4.7 TMAC/s DSP, 1.4 Tb/s I/O bandwidth |
| Medical Imaging |
Signal processing, BRAM buffering |
| Scientific Instrumentation |
ADC/DAC interfacing, data processing pipelines |
| Defense & Aerospace |
–40°C to +100°C operation, AES/HMAC security |
| Financial Computing |
Ultra-low-latency logic acceleration |
XC7VX485T-2FFG1157I vs. Related Variants
Designers often compare the XC7VX485T-2FFG1157I against similar parts in the Virtex-7 XT lineup. The table below highlights key differences:
| Part Number |
Logic Cells |
I/Os |
Package |
Temp Grade |
Speed |
| XC7VX485T-2FFG1157I |
485,760 |
600 |
FF1157 |
Industrial |
-2 |
| XC7VX485T-1FFG1157I |
485,760 |
600 |
FF1157 |
Industrial |
-1 (slower) |
| XC7VX485T-2FFG1157C |
485,760 |
600 |
FF1157 |
Commercial |
-2 |
| XC7VX415T-2FFG1157I |
412,160 |
350 |
FF1157 |
Industrial |
-2 |
| XC7VX690T-2FFG1157I |
693,120 |
600 |
FF1157 |
Industrial |
-2 |
Choose the XC7VX485T-2FFG1157I when you need:
- Industrial temperature range in the 1157-pin form factor
- Speed grade -2 performance
- A balance between logic density and package size
Development Tools and Design Support
Xilinx Vivado Design Suite
The XC7VX485T-2FFG1157I is fully supported by the Vivado Design Suite from AMD (formerly Xilinx). Vivado provides:
- Synthesis and implementation for 7 Series FPGAs
- IP Integrator for block diagram design entry
- Integrated Logic Analyzer (ILA) for in-system debugging
- Timing constraint management via XDC files
- Partial reconfiguration flow support
Designers migrating from ISE should note that ISE is not recommended for new Virtex-7 projects; Vivado is the primary and fully supported toolchain.
Reference IP Cores
AMD offers a broad library of IP cores validated for Virtex-7 devices, including:
- AXI4 Interconnect and protocol bridges
- PCIe DMA subsystem
- 10G/25G Ethernet subsystem
- High-speed serial (GT) wizard-generated transceiver logic
Ordering Information
| Attribute |
Detail |
| Manufacturer |
AMD (formerly Xilinx) |
| Manufacturer Part Number |
XC7VX485T-2FFG1157I |
| DigiKey Part Number |
122-1688-ND |
| Packaging |
Tray |
| Minimum Order Quantity |
1 unit (distributor dependent) |
| Series |
Virtex-7 XT |
Always purchase from authorized distributors to ensure genuine, properly stored devices with full traceability.
Frequently Asked Questions (FAQ)
Q: What does the “I” suffix mean in XC7VX485T-2FFG1157I? The “I” designates the industrial temperature grade, specifying a junction temperature range of –40°C to +100°C, compared to the commercial grade (“C”) range of 0°C to +85°C.
Q: What is the difference between XC7VX485T-2FFG1157I and XC7VX485T-2FF1157I? The “FFG” variant is the standard tray-packaged device, while “FF” without the G may indicate a tube or alternative packaging. Electrically and functionally, both are identical. Always confirm package and packaging type with your distributor.
Q: Is the XC7VX485T-2FFG1157I still in production? As of 2026, the Virtex-7 XT family is in mature production. AMD has committed to extending support for 7 Series FPGAs through 2040. Inventory availability should be verified with authorized distributors.
Q: What programming tools are compatible with the XC7VX485T-2FFG1157I? The Vivado Design Suite (version 2013.1 and later) fully supports the XC7VX485T-2FFG1157I. The JTAG-compatible Xilinx Platform Cable USB II or compatible third-party cables can be used for programming and debugging.
Q: Does the XC7VX485T-2FFG1157I support partial reconfiguration? Yes. Partial reconfiguration allows portions of the FPGA fabric to be reprogrammed at runtime without disrupting active regions, enabling flexible and adaptive system designs.
Summary
The XC7VX485T-2FFG1157I is a proven, high-performance FPGA offering 485,760 logic cells, 600 user I/Os, 2,800 DSP slices, and 37,080 Kbits of block RAM in a 1157-pin FCBGA package — all rated for industrial temperatures. Its 28 nm HKMG process, integrated PCIe Gen3, AES-256 bitstream security, and comprehensive Vivado tool support make it a dependable choice for networking, defense, scientific computing, and ASIC emulation applications.
For engineers evaluating the broader range of high-density programmable logic solutions, exploring the full lineup of available Xilinx FPGA devices can help identify the optimal part for logic density, package, speed grade, and temperature requirements.