Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC7VX485T-1FFG1761C — Xilinx Virtex-7 XT FPGA (1761-Pin FCBGA)

Product Details

The XC7VX485T-1FFG1761C is a high-performance Field Programmable Gate Array from AMD’s Virtex-7 XT family, built on TSMC’s 28 nm HKMG (High-K Metal Gate) process. With 485,760 logic cells, 56 GTX multi-gigabit transceivers, and 700 user I/Os packed into a 1761-ball flip-chip BGA, the XC7VX485T-1FFG1761C is engineered for bandwidth-intensive designs in wired communications, radar, ASIC prototyping, and data-center acceleration.

Why Choose the XC7VX485T-1FFG1761C?

Virtex-7 XT devices are optimized for transceiver-heavy workloads, and the XC7VX485T-1FFG1761C delivers that balance of logic density, DSP throughput, and serial I/O that most -485T designs need. The “-1” speed grade and commercial temperature rating (0 °C to 85 °C) make it a cost-effective pick for lab, industrial, and production hardware where you still want the full pin-out of the 1761 package for maximum I/O and transceiver access.

Sourcing tip: for authorized stock, cross-reference, and PCB assembly support for this part, browse the full Xilinx FPGA catalog.

XC7VX485T-1FFG1761C Part Number Breakdown

Code Segment Meaning
XC Commercial product prefix
7V 7 Series Virtex family
X485T Virtex-7 XT, ~485K logic cells
-1 Speed grade 1 (standard)
FFG1761 Flip-chip fine-pitch BGA, 1761 balls, Pb-free
C Commercial temp range (0 °C to 85 °C)

Key Technical Specifications

Logic, Memory & DSP Resources

Parameter Value
Logic Cells 485,760
CLB Slices 75,900
CLB Flip-Flops 607,200
DSP48E1 Slices 2,800
Peak DSP Performance 2,800 GMAC/s
Block RAM (36 Kb blocks) 1,030
Total Block RAM 37,080 Kb
CMTs (MMCM + PLL) 14

High-Speed Serial & I/O

Parameter Value
GTX Transceivers 56 (up to 10.3125 Gb/s)
Integrated PCIe Blocks 4 × PCIe Gen2 x8
Maximum User I/O 700
I/O Standards HP 1.2 V–1.8 V, HR 1.2 V–3.3 V
Memory Interface Support DDR3 up to 1,866 Mb/s
XADC Dual 12-bit 1 MSPS ADC

Package, Process & Environment

Parameter Value
Process Technology 28 nm HKMG HPL
Package FCBGA-1761 (flip-chip, Pb-free)
Body Size 42.5 × 42.5 mm, 1.0 mm pitch
Core Voltage (VCCINT) 1.0 V
Operating Temperature 0 °C to +85 °C (Commercial)
Security 256-bit AES + HMAC/SHA-256, SEU detect & correct

Typical Applications of the XC7VX485T-1FFG1761C

Wired & Wireless Communications

Line cards, OTN framers, and 10G–40G packet processing that benefit from 56 GTX lanes and integrated PCIe Gen2 x8 host interfaces.

ASIC Prototyping & Emulation

The 485K-logic-cell capacity and 1761-pin break-out make the XC7VX485T-1FFG1761C a mainstay on emulation boards such as the VC707 reference platform.

Radar, SDR & Signal Processing

2,800 DSP48E1 slices with 25×18 multipliers and pre-adders accelerate FIR filters, FFTs, and beamforming pipelines.

Video, Imaging & Data Center Acceleration

High block-RAM count and wide I/O support real-time video processing, 4K transcoding, and PCIe-attached compute offload cards.

Design Tool Support

The XC7VX485T-1FFG1761C is fully supported by AMD Vivado Design Suite, with mature IP for PCIe, Ethernet, DDR3/DDR4, AXI, and Aurora. Legacy ISE flows are not supported on Virtex-7 XT.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.