The XC7VX485T-1FFG1761I is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx’s Virtex-7 XT family. Built on advanced 28 nm High-K Metal Gate (HKMG) process technology, this IC delivers exceptional logic density, DSP throughput, and I/O bandwidth — making it a top choice for engineers designing telecommunications systems, data centers, radar, and ASIC prototyping platforms.

If you are sourcing a Xilinx FPGA for high-speed or mission-critical applications, the XC7VX485T-1FFG1761I stands out as one of the most capable devices in the Virtex-7 lineup.

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What Is the XC7VX485T-1FFG1761I?

The XC7VX485T-1FFG1761I is a surface-mount FPGA IC in the Virtex-7 XT series manufactured by AMD (formerly Xilinx). The part number breaks down as follows:

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XC7VX485T-1FFG1761I Key Specifications

Core Device Parameters

Package & Mechanical Specifications

Environmental & Compliance

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XC7VX485T-1FFG1761I Architecture and Features

High-Density Programmable Logic Fabric

The XC7VX485T-1FFG1761I features 485,760 logic cells organized within 37,950 CLBs (Configurable Logic Blocks). Each CLB contains look-up tables (LUTs), flip-flops, and carry-chain logic, enabling complex control, arithmetic, and data-path functions to be implemented efficiently in reconfigurable hardware.

Advanced DSP Performance

The device integrates a large number of DSP48E1 slices, each featuring:

• 25 × 18 multiplier
• 48-bit accumulator
• Pre-adder for symmetric coefficient filtering

This architecture delivers multi-teraMAC/s (TMAC/s) DSP throughput, making the XC7VX485T-1FFG1761I ideal for radar signal processing, video encoding, software-defined radio (SDR), and financial computing workloads.

Embedded Block RAM (BRAM)

The XC7VX485T-1FFG1761I provides nearly 38 million total RAM bits through a distributed array of 36 Kb block RAMs. These can be configured as dual-port memories, FIFOs, or wide data buffers — critical for buffering high-bandwidth data streams.

High-Speed Serial Transceivers (GTH)

The Virtex-7 XT sub-family is specifically optimized for transceiver-heavy designs. The XC7VX485T-1FFG1761I includes multiple GTH transceivers capable of high-speed serial communication, supporting standards such as:

• 10GBASE-KR (100% electrical conformance verified)
• PCIe Gen3 (up to x8)
• SATA / SAS
• Interlaken
• OTU4 / 100G Ethernet

Integrated PCIe Block

An integrated hardened PCIe block supports up to x8 Gen3 Endpoint and Root Port operation — enabling seamless integration with host CPU systems and off-the-shelf PCIe boards without consuming programmable logic resources.

Clock Management Tiles (CMT)

The device includes multiple Clock Management Tiles, each combining:

• PLL (Phase-Locked Loop) for frequency synthesis
• MMCM (Mixed-Mode Clock Manager) for phase adjustment and jitter filtering

These enable complex clocking architectures required by multi-protocol, multi-domain FPGA designs.

Configuration and Security

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XC7VX485T-1FFG1761I Application Areas

The XC7VX485T-1FFG1761I is engineered for demanding, bandwidth-intensive applications across multiple industries:

Networking and Communications

Aerospace and Defense

The industrial temperature range (−40°C to +100°C) and built-in SEU correction make the XC7VX485T-1FFG1761I suitable for:

• Portable radar front-end processing
• Electronic warfare (EW) systems
• Secure communication platforms (AES-256 bitstream encryption)

Data Centers and High-Performance Computing

• ASIC prototyping and emulation
• Hardware accelerators for AI/ML inference
• PCIe-attached compute offload cards

Test and Measurement

• Protocol analyzers and logic analyzers
• Signal acquisition and generation equipment
• Automated test equipment (ATE)

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XC7VX485T-1FFG1761I vs. Similar Virtex-7 Devices

Note: The suffix “I” denotes the industrial temperature grade (−40°C to +100°C TJ), while “C” denotes commercial grade (0°C to +85°C TJ). Choose the “I” variant for environments with elevated thermal stress.

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Design Tools and Software Support

The XC7VX485T-1FFG1761I is fully supported by AMD’s Vivado Design Suite, which includes:

• Synthesis and implementation tools
• Vivado IP Integrator (block design environment)
• Built-in simulation support
• Vivado Hardware Manager for on-chip debug (ILA, VIO)

For legacy designs, the ISE Design Suite also supports the 7 Series architecture, though Vivado is recommended for new projects due to its superior optimization and ease of use.

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Ordering Information

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Frequently Asked Questions (FAQ)

What is the XC7VX485T-1FFG1761I used for?

It is used in high-performance applications including 100G networking, ASIC prototyping, radar processing, aerospace systems, and PCIe-based data center accelerators.

What is the supply voltage for the XC7VX485T-1FFG1761I?

The core supply voltage is 0.97 V to 1.03 V (nominal 1.0 V). I/O voltage varies by I/O standard used.

Can the XC7VX485T-1FFG1761I be reprogrammed after deployment?

Yes. Like all FPGAs, it can be reprogrammed an unlimited number of times. Configuration can be stored externally in SPI or BPI Flash memory and loaded at power-on.

What is the maximum operating temperature?

The industrial-grade “I” suffix supports junction temperatures from −40°C to +100°C (TJ), suitable for harsh environment deployments.

What security features are built in?

The device includes 256-bit AES encryption with HMAC/SHA-256 authentication for bitstream protection, along with built-in SEU detection and correction for reliability in radiation-susceptible environments.

What is the difference between XC7VX485T-1FFG1761I and XC7VX485T-2FFG1761I?

The only difference is the speed grade. The -1 variant is speed grade 1 (lower performance, lower power), while the -2 variant is speed grade 2 (higher performance). Both are industrial temperature grade.

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Summary

The XC7VX485T-1FFG1761I is a production-proven, industrial-grade FPGA that delivers a compelling combination of logic density, DSP bandwidth, and high-speed serial I/O within the mature and well-supported Virtex-7 XT platform. With 485,760 logic cells, 700 I/O, integrated PCIe Gen3, hardened transceiver support, and AES-256 security — all housed in a 42.5 × 42.5 mm flip-chip BGA — it remains a go-to choice for engineers building the most demanding digital systems in networking, defense, and data center markets.