Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC7VX485T-1FF1157I: High-Performance Xilinx FPGA for Advanced Applications

Product Details

The XC7VX485T-1FF1157I is a high-capacity Field Programmable Gate Array (FPGA) designed by Xilinx to meet the needs of complex digital designs and high-speed processing. This device is widely used in applications such as automotive electronics, industrial automation, telecommunications, and data-intensive computing systems.

With advanced architecture and high logic density, this Xilinx FPGA offers exceptional performance, flexibility, and reliability, making it a preferred choice for engineers and designers working on sophisticated electronic systems.


Key Features of XC7VX485T-1FF1157I

Feature Specification
Logic Cells 485,000
Block RAM 32.63 Mb
DSP Slices 1,920
Package Type FF1157I (Flip-Chip Fine-Pitch BGA)
Speed Grade -1
Operating Temperature -40°C to +100°C
Configuration SRAM-based
I/O Pins 780

This FPGA supports high-speed signal processing and parallel computation, making it suitable for applications where performance and timing precision are critical.


Why Choose XC7VX485T-1FF1157I?

High Logic Density and Scalability

The XC7VX485T provides over 485,000 logic cells, enabling complex designs without compromising speed or efficiency. Its scalable architecture supports large-scale implementations and multi-functional systems.

Optimized for High-Speed Performance

With 1,920 DSP slices and low-latency block RAM, this FPGA ensures fast computation for signal processing, artificial intelligence, and real-time data applications.

Reliable Industrial-Grade Operation

The operating temperature range of -40°C to +100°C ensures consistent performance in harsh environments. This makes it ideal for automotive electronics, industrial automation, and outdoor applications.

Flexible I/O Options

With 780 I/O pins, the XC7VX485T provides extensive connectivity options for interfacing with sensors, memory modules, communication devices, and other peripherals.


Technical Specifications Overview

Specification Details
Logic Cells 485,000
DSP Slices 1,920
Block RAM 32.63 Mb
Max I/O Pins 780
Package FF1157I
Speed Grade -1
Temperature Range -40°C to +100°C
Configuration SRAM-based
Manufacturer Xilinx

Applications of XC7VX485T-1FF1157I

  • Automotive electronics and ADAS systems
  • Industrial automation and robotics
  • High-performance computing and AI accelerators
  • Telecommunications and 5G infrastructure
  • Data acquisition and real-time signal processing

This FPGA provides engineers with the flexibility to implement custom logic designs while maintaining high performance and reliability across various industries.

 

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.