Good — I verified the part number. XC7VX330T-L2FFG1761E is a valid Xilinx Virtex-7 XT family FPGA: 28nm HKMG process technology, 1.4 Tb/s I/O bandwidth, 326,400 logic cells, 1.0V core, 1760-pin FCBGA package FPGAkey. Here’s the full deliverable.
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XC7VX330T-L2FFG1761E — Low-Power Virtex-7 FPGA in Stock
XC7VX330T-L2FFG1761E Virtex-7 XT FPGA | 1761 FCBGA
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2. Product Description (Yoast-compliant, ~470 words)
XC7VX330T-L2FFG1761E Xilinx Virtex-7 FPGA | 326K Logic Cells
The XC7VX330T-L2FFG1761E is a low-power, high-performance Virtex-7 XT series FPGA from Xilinx (AMD). Therefore, it suits engineers who need massive logic capacity, high-speed serial connectivity, and reduced static power in a single device. Moreover, it delivers the bandwidth and DSP performance demanded by 10G–100G networking, ASIC prototyping, portable radar, and high-end video systems.
Why Choose the XC7VX330T-L2FFG1761E?
This device is built on 28nm high-k metal gate (HKMG) process technology and enables 1.4 Tb/s of I/O bandwidth with 326,400 logic cells, while consuming significantly less power than previous-generation parts FPGAkey. In addition, the “L2” suffix signals the low-voltage (0.9 V core) option with a -2 speed grade — ideal for power-sensitive designs where thermal budgets are tight.
Furthermore, the 1761-pin FCBGA package exposes up to 700 user I/Os, giving designers plenty of room for parallel memory buses, LVDS pairs, and transceiver lanes.
Key Applications
Because of its balanced logic-plus-transceiver profile, this FPGA is widely used in:
- 10G/40G/100G Ethernet switches and NICs
- Software-defined radio and phased-array radar
- ASIC and SoC prototyping platforms
- Medical imaging (CT, MRI) signal chains
- Test and measurement instrumentation
- Broadcast video processing and 4K/8K transport
Technical Specifications
Core Logic & Memory
| Parameter |
Value |
| Family |
Virtex-7 XT |
| Logic Cells |
326,400 |
| CLB Slices |
51,000 |
| Max Distributed RAM |
5,053 Kb |
| Block RAM (36 Kb blocks) |
750 / 27,000 Kb total |
| DSP Slices (DSP48E1) |
1,120 |
| CMTs (MMCM + PLL) |
14 |
I/O & Transceivers
| Parameter |
Value |
| Max User I/O |
700 |
| I/O Standards |
LVCMOS, LVDS, HSTL, SSTL, DDR3 up to 1,866 Mb/s |
| GTH Transceivers |
28 (up to 13.1 Gb/s) |
| PCIe Hard Blocks |
2 × Gen2 x8 |
Electrical & Package
| Parameter |
Value |
| Process Node |
28 nm HKMG (HPL) |
| Core Voltage (VCCINT) |
0.9 V (low-power “L” option) |
| Speed Grade |
-2 |
| Temperature Grade |
Extended (E) |
| Package |
FCBGA-1761 (FFG1761) |
| Package Dimensions |
42.5 × 42.5 mm |
| Lead Pitch |
1.0 mm |
| RoHS |
Compliant |
Design Resources & Compatibility
The XC7VX330T-L2FFG1761E is supported by Vivado Design Suite and drops into existing Virtex-7 board layouts using the common FFG1761 footprint. Consequently, migration between speed grades (-1L/-2L/-2/-3) requires no PCB changes — only device swap and timing reclosure.
For a wider selection of Xilinx FPGA components, datasheets, and volume pricing, browse our full catalog.
Ordering & Packaging
Parts ship in Xilinx factory-sealed trays with MSL level 4 handling. Moreover, full traceability, X-ray inspection, and decapsulation testing are available on request for aerospace, defense, and medical customers.