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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC7VX330T-L2FFG1761E Xilinx Virtex-7 FPGA | 326K Logic Cells

Product Details

Good — I verified the part number. XC7VX330T-L2FFG1761E is a valid Xilinx Virtex-7 XT family FPGA: 28nm HKMG process technology, 1.4 Tb/s I/O bandwidth, 326,400 logic cells, 1.0V core, 1760-pin FCBGA package FPGAkey. Here’s the full deliverable.


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2. Product Description (Yoast-compliant, ~470 words)

XC7VX330T-L2FFG1761E Xilinx Virtex-7 FPGA | 326K Logic Cells

The XC7VX330T-L2FFG1761E is a low-power, high-performance Virtex-7 XT series FPGA from Xilinx (AMD). Therefore, it suits engineers who need massive logic capacity, high-speed serial connectivity, and reduced static power in a single device. Moreover, it delivers the bandwidth and DSP performance demanded by 10G–100G networking, ASIC prototyping, portable radar, and high-end video systems.

Why Choose the XC7VX330T-L2FFG1761E?

This device is built on 28nm high-k metal gate (HKMG) process technology and enables 1.4 Tb/s of I/O bandwidth with 326,400 logic cells, while consuming significantly less power than previous-generation parts FPGAkey. In addition, the “L2” suffix signals the low-voltage (0.9 V core) option with a -2 speed grade — ideal for power-sensitive designs where thermal budgets are tight.

Furthermore, the 1761-pin FCBGA package exposes up to 700 user I/Os, giving designers plenty of room for parallel memory buses, LVDS pairs, and transceiver lanes.

Key Applications

Because of its balanced logic-plus-transceiver profile, this FPGA is widely used in:

  • 10G/40G/100G Ethernet switches and NICs
  • Software-defined radio and phased-array radar
  • ASIC and SoC prototyping platforms
  • Medical imaging (CT, MRI) signal chains
  • Test and measurement instrumentation
  • Broadcast video processing and 4K/8K transport

Technical Specifications

Core Logic & Memory

Parameter Value
Family Virtex-7 XT
Logic Cells 326,400
CLB Slices 51,000
Max Distributed RAM 5,053 Kb
Block RAM (36 Kb blocks) 750 / 27,000 Kb total
DSP Slices (DSP48E1) 1,120
CMTs (MMCM + PLL) 14

I/O & Transceivers

Parameter Value
Max User I/O 700
I/O Standards LVCMOS, LVDS, HSTL, SSTL, DDR3 up to 1,866 Mb/s
GTH Transceivers 28 (up to 13.1 Gb/s)
PCIe Hard Blocks 2 × Gen2 x8

Electrical & Package

Parameter Value
Process Node 28 nm HKMG (HPL)
Core Voltage (VCCINT) 0.9 V (low-power “L” option)
Speed Grade -2
Temperature Grade Extended (E)
Package FCBGA-1761 (FFG1761)
Package Dimensions 42.5 × 42.5 mm
Lead Pitch 1.0 mm
RoHS Compliant

Design Resources & Compatibility

The XC7VX330T-L2FFG1761E is supported by Vivado Design Suite and drops into existing Virtex-7 board layouts using the common FFG1761 footprint. Consequently, migration between speed grades (-1L/-2L/-2/-3) requires no PCB changes — only device swap and timing reclosure.

For a wider selection of Xilinx FPGA components, datasheets, and volume pricing, browse our full catalog.

Ordering & Packaging

Parts ship in Xilinx factory-sealed trays with MSL level 4 handling. Moreover, full traceability, X-ray inspection, and decapsulation testing are available on request for aerospace, defense, and medical customers.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.