Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC7VX330T-2FFV1761C | Xilinx Virtex-7 XT FPGA, 1761-FCBGA

Product Details

XC7VX330T-2FFV1761C: Xilinx Virtex-7 XT FPGA for High-Bandwidth Designs

The XC7VX330T-2FFV1761C is a Virtex-7 XT Field Programmable Gate Array from Xilinx (now AMD), engineered for bandwidth-intensive communications, signal processing, and ASIC prototyping applications. Manufactured on a 28 nm high-performance, low-power (HPL) process with high-k metal gate (HKMG) technology, this device packs 326,400 logic cells, 1,120 DSP48E1 slices, and 28 GTH multi-gigabit transceivers into a compact 1761-pin FCBGA package — delivering outstanding performance-per-watt for next-generation embedded systems.

Overview of the XC7VX330T-2FFV1761C

This Virtex-7 XT device belongs to the unified 7 Series architecture shared across Artix-7, Kintex-7, and Virtex-7 families, enabling streamlined IP reuse. The -2 speed grade strikes a balance between performance and cost, while the C suffix denotes commercial-grade operation (0 °C to 85 °C junction). With real 6-input LUT logic, 36 Kb dual-port block RAM featuring built-in FIFO control, and DSP slices equipped with 25 × 18 multipliers, pre-adders, and 48-bit accumulators, the XC7VX330T-2FFV1761C is optimized for parallel DSP and high-throughput data-path designs.

Key Technical Specifications

Logic and Memory Resources

Parameter Value
FPGA Family Virtex-7 XT
Logic Cells 326,400
CLB Slices 51,000
Max Distributed RAM 4,388 Kb
36 Kb Block RAM Blocks 750
Total Block RAM 27,000 Kb
DSP48E1 Slices 1,120

Clocking, I/O, and Transceivers

Parameter Value
CMTs (MMCM + PLL) 14
GTH Transceivers (up to 13.1 Gb/s) 28
I/O Banks 14
Maximum User I/O 700
XADC Block 1
DDR3 Support (SelectIO) Up to 1,866 Mb/s

Package, Power, and Environment

Parameter Value
Process Technology 28 nm HPL HKMG
Package 1761-pin FCBGA (FFV1761)
Speed Grade -2
Temperature Grade Commercial (0 °C to 85 °C)
Core Voltage (VCCINT) 1.0 V (0.97 V – 1.03 V)
Configuration JTAG, SelectMAP, Serial

Typical Applications

The XC7VX330T-2FFV1761C thrives in designs that demand massive I/O throughput and deep parallel computation. Its 28 GTH transceivers natively support PCIe Gen3, Interlaken, SATA, and 10G/40G/100G Ethernet, making it a strong choice for:

Wired Communications and Data Center

Line cards, OTN transport switches, packet processors, and smart-NIC acceleration platforms.

Test, Measurement, and Aerospace

High-speed oscilloscopes, radar back-ends, software-defined radio, and ASIC/SoC emulation systems.

Imaging and Broadcast

4K/8K video processing, medical imaging back-ends, and professional broadcast infrastructure.

Why Choose This Xilinx FPGA

Compared with the previous 40 nm generation, the XC7VX330T family delivers up to 50% lower power at equivalent performance, along with roughly 2× system-level throughput. Engineers can design, synthesize, and verify targets using the Vivado Design Suite alongside the extensive IP catalog of the AMD Xilinx FPGA ecosystem. Order the XC7VX330T-2FFV1761C today to accelerate your next high-performance networking, DSP, or prototyping project with a proven, production-grade FPGA platform.


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Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.