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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC7VX330T-2FFG1157C Xilinx Virtex-7 FPGA – 326K Logic Cells, FCBGA-1157

Product Details

The XC7VX330T-2FFG1157C is a high-performance Virtex-7 XT series FPGA from Xilinx (AMD), built on a 28 nm high-k metal gate (HKMG) process. With 326,400 logic cells, 1,120 DSP slices, and 27 Mb of block RAM, this device delivers the bandwidth, signal-processing muscle, and I/O density demanded by wired communications, ASIC prototyping, radar, and high-end test & measurement systems.

Moreover, the speed grade -2 combined with the FCBGA-1157 package makes this part a strong balance between throughput, thermal performance, and board footprint — ideal for engineers who need serious horsepower without jumping to the largest 1761- or 1930-ball packages.

Key Features of the XC7VX330T-2FFG1157C

Packed with 28 GTH transceivers running up to 13.1 Gb/s, 14 Clock Management Tiles (CMTs), and an integrated XADC block, the XC7VX330T-2FFG1157C supports line-rate protocols such as 10GBASE-KR, Interlaken, PCIe Gen2, and CPRI. In addition, its true 6-input LUT architecture and 36 Kb dual-port Block RAM with built-in FIFO logic accelerate data-path designs while keeping power roughly 50 % lower than previous-generation Virtex-6 devices.

Core Logic, Memory & DSP Resources

Parameter Value
Logic Cells 326,400
Configurable Logic Blocks (Slices) 51,000
Max Distributed RAM 4,388 Kb
DSP48E1 Slices 1,120
Block RAM – 36 Kb / 18 Kb 750 / 1,500
Total Block RAM 27,000 Kb (≈27 Mb)
Clock Management Tiles (CMTs) 14
XADC (12-bit, 1 MSPS ADC) 1

Package, I/O & Operating Conditions

Parameter Value
Package FCBGA-1157 (Pb-free, FFG)
Ball Pitch 1.0 mm
Maximum User I/O 600
I/O Banks 14
GTH Serial Transceivers 28 (up to 13.1 Gb/s)
PCI Express Hard Blocks 0
Core Voltage (VCCINT) 1.0 V
Speed Grade -2
Temperature Grade Commercial (0 °C to +85 °C Tj)
Process Technology 28 nm HKMG HPL
RoHS Compliant

Typical Applications

Thanks to its serial bandwidth and DSP density, the XC7VX330T-2FFG1157C is widely deployed in 100G/200G line cards, OTN switching, software-defined radio, phased-array radar, medical imaging back-ends, and 8K video processing. Furthermore, ASIC/SoC prototyping teams often select this part to emulate large designs before tape-out.

Why Buy the XC7VX330T-2FFG1157C From Us

We supply 100 % original, factory-sealed, traceable AMD Xilinx FPGA devices with full MSL handling, X-ray inspection, and a no-questions quality guarantee. Contact our sales team for live stock, dated-code confirmation, and volume pricing on the XC7VX330T-2FFG1157C today.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.