Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC7VX330T-2FF1761C: Xilinx Virtex-7 FPGA – Specifications, Features & Applications

Product Details

The XC7VX330T-2FF1761C is a high-performance Virtex-7 FPGA manufactured by Xilinx (now AMD) on advanced 28nm HKMG process technology. Engineered for bandwidth-intensive and compute-heavy designs, this device delivers 326,400 logic cells, 28 high-speed GTH transceivers, and up to 710 MHz operation in a rugged FCBGA-1761 package. Whether you are prototyping an ASIC, building wireless infrastructure, or designing medical imaging systems, this Xilinx FPGA offers the density, speed, and I/O flexibility your project demands.

Overview of the XC7VX330T-2FF1761C

Built with high-k metal gate (HKMG) 28nm technology, the XC7VX330T-2FF1761C consumes up to 50% less power than previous generations while doubling system performance. Moreover, it supports DDR3 interfaces up to 1,866 Mb/s and offers PCIe Gen3 connectivity, making it ideal for next-generation networking and data-center acceleration.

Key Features

  • Advanced 6-input LUT logic, configurable as distributed memory
  • 36 Kb dual-port Block RAM with built-in FIFO logic
  • DSP48E1 slices with 25 × 18 multiplier and 48-bit accumulator
  • High-speed GTH transceivers up to 13.1 Gb/s
  • Integrated XADC for dual 12-bit analog monitoring
  • Commercial temperature grade (0°C to +85°C)

Technical Specifications

General Parameters

Parameter Value
Manufacturer Part No. XC7VX330T-2FF1761C
FPGA Family Virtex-7
Process Technology 28nm HKMG (HPL)
Speed Grade -2
Temperature Grade C (Commercial, 0°C to +85°C)
Package FCBGA-1761
RoHS Status Compliant

Logic & Memory Resources

Resource Quantity
Logic Cells 326,400
Configurable Logic Blocks (CLBs) / Slices 51,000
Max Distributed RAM 4,388 Kb
DSP48E1 Slices 1,120
Block RAM (36 Kb) 750
Block RAM (18 Kb) 1,500
Total Block RAM 27,000 Kb (27 Mb)

I/O, Clocking & Transceivers

Parameter Value
Max User I/Os 700
Total I/O Banks 14
GTH Transceivers (up to 13.1 Gb/s) 28
Clock Management Tiles (MMCM + PLL) 14
XADC Blocks 1

Electrical Characteristics

Parameter Min Max
Core Supply Voltage (VCCINT) 0.97 V 1.03 V
I/O Supply Voltage (VCCO) 3.3 V
Max Operating Frequency 710 MHz

Typical Applications

Thanks to its balanced mix of logic capacity, transceiver bandwidth, and DSP horsepower, the XC7VX330T-2FF1761C excels in:

  • Wired Communications — 10G/40G/100G line cards and OTN framers
  • Wireless Infrastructure — baseband processing and remote radio heads
  • ASIC Prototyping & Emulation
  • Medical Imaging — ultrasound, CT, and MRI signal processing
  • Military & Aerospace — radar and secure communications
  • High-Performance Computing — data-center acceleration and AI inference

Why Buy the XC7VX330T-2FF1761C from Us?

We ship 100% authentic, factory-sealed XC7VX330T-2FF1761C units with full traceability. In addition, we offer competitive pricing, worldwide shipping, and technical support from experienced FPGA engineers. Contact us today for a live quote and real-time stock availability.


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Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.