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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC7VX330T-1FFG1761I – Xilinx Virtex-7 XT FPGA (700 I/O, FCBGA-1761)

Product Details

XC7VX330T-1FFG1761I Overview

The XC7VX330T-1FFG1761I is a high-performance Virtex-7 XT Field Programmable Gate Array (FPGA) from AMD Xilinx. Built on a 28 nm high-k metal gate (HKMG), high-performance low-power process, this industrial-grade device delivers massive parallel processing power for wired communication, high-end DSP, and ASIC prototyping. With 326,400 logic cells, 1,120 DSP48E1 slices, and 28 GTH transceivers, the XC7VX330T-1FFG1761I is engineered to handle the most bandwidth-intensive designs while consuming roughly 50 % less power than previous-generation devices.

Packaged in a 1,760-ball FCBGA (FFG1761), the device exposes up to 700 user I/O pins and operates across an industrial junction temperature range of –40 °C to +100 °C, making it ideal for harsh environments and long-life embedded systems.

Key Features and Benefits

  • High-speed GTH transceivers up to 13.1 Gb/s for 100G Ethernet, Interlaken, and PCIe® Gen3
  • 27,000 Kb of total block RAM with built-in FIFO logic for on-chip data buffering
  • 1,120 DSP48E1 slices with 25 × 18 multiplier, 48-bit accumulator, and pre-adder
  • 14 clock management tiles (CMTs) and 2 integrated PCIe Gen3 blocks
  • Fully supported by the AMD Vivado™ Design Suite for synthesis, implementation, and debug

XC7VX330T-1FFG1761I Technical Specifications

Logic and Memory Resources

Parameter Value
Family Virtex-7 XT
Logic Cells 326,400
CLB Slices 51,000
Max Distributed RAM 4,388 Kb
Block RAM (36 Kb blocks) 750 (27,000 Kb total)
DSP48E1 Slices 1,120
CMTs (MMCM + PLL) 14

Connectivity and I/O

Parameter Value
Max User I/O 700
I/O Banks 14
GTH Transceivers 28 (up to 13.1 Gb/s)
PCIe Gen3 Hard Blocks 2
XADC 1

Package, Power, and Temperature

Parameter Value
Package 1760-BBGA, FCBGA (FFG1761)
Speed Grade –1
Temperature Grade Industrial (I): –40 °C to +100 °C (TJ)
Core Voltage (VCCINT) 0.97 V – 1.03 V
Process Technology 28 nm HKMG HPL
RoHS Status Compliant (Pb-free)

Typical Applications

The XC7VX330T-1FFG1761I excels in wired communication line cards, OTN switching, radar and aerospace DSP, medical imaging, broadcast video infrastructure, and test-and-measurement equipment. It is also a popular choice for engineers prototyping next-generation ASICs thanks to its balanced mix of logic density, transceiver count, and DSP throughput.

Order the XC7VX330T-1FFG1761I Today

Ready to integrate the XC7VX330T-1FFG1761I into your next design? Browse our full catalog of authentic, factory-sealed devices through our trusted Xilinx FPGA supply channel for competitive pricing, fast global shipping, and dedicated engineering support.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.