Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC7V2000T-1FLG1925C: Xilinx Virtex-7 FPGA – Full Specifications & Datasheet Guide

Product Details

The XC7V2000T-1FLG1925C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx (now AMD), belonging to the flagship Virtex-7 T family. Built on advanced 28nm High-K Metal Gate (HKMG) process technology, this device delivers an extraordinary combination of logic density, DSP throughput, I/O bandwidth, and power efficiency — making it one of the most capable FPGAs ever produced for demanding applications in networking, signal processing, and high-performance computing.

If you are looking for a high-density Xilinx FPGA with industry-leading logic capacity and serial bandwidth, the XC7V2000T-1FLG1925C is a top-tier choice for your next design.


What Is the XC7V2000T-1FLG1925C?

The XC7V2000T-1FLG1925C is a commercial-grade Virtex-7 FPGA IC featuring 1,954,560 logic cells, packaged in a 1925-pin FCBGA (Flip-Chip Ball Grid Array) format. Its part number breaks down as follows:

Part Number Segment Meaning
XC Xilinx FPGA
7V 7 Series, Virtex family
2000T 2000K logic cell class, T = stacked silicon interconnect (SSI)
1 Speed grade –1 (standard commercial speed)
FLG Package type: Flip-chip, Low-profile, G-variant
1925 1925-pin package
C Commercial temperature grade (0°C to 85°C)

XC7V2000T-1FLG1925C Key Specifications

Core Logic & Fabric Specifications

Parameter Value
FPGA Family Virtex-7
Logic Cells (Macrocells) 1,954,560
Logic Blocks (CLBs) 305,400
Process Node 28nm HKMG
Configuration Memory Bits 47,628,288
Speed Grade –1 (Commercial)

Memory Resources

Memory Type Capacity
Total Block RAM 46,512 Kbit (~5.66 MB)
Block RAM Tiles 36 Kb dual-port with FIFO
Distributed RAM Available via 6-input LUT fabric

I/O and Connectivity

Parameter Value
User I/O Pins 1,200
Package Pins 1,925
Package Type 1925-FCBGA (45×45 mm)
SelectIO Technology DDR3 support up to 1,866 Mb/s
Multi-Gigabit Transceivers 600 Mb/s to 6.6 Gb/s (up to 11.3 Gb/s)

Power and Operating Conditions

Parameter Value
Core Supply Voltage (VCCINT) 0.97V – 1.03V (nominal 1.0V)
Operating Temperature Range 0°C to 85°C (TJ)
Mount Type Surface Mount
Moisture Sensitivity Level Tray packaging

DSP and Clock Management

Parameter Value
DSP Performance Up to 4.7 TMAC/s
Clock Management Tiles (CMT) Yes — PLL + MMCM
Maximum Clock Frequency 625 MHz (fabric)
I/O Bandwidth Up to 1.4 Tb/s

XC7V2000T-1FLG1925C Package and Physical Details

The XC7V2000T-1FLG1925C uses the FLG1925 package — a Flip-Chip Ball Grid Array measuring 45mm × 45mm. This package offers excellent electrical performance through direct die attach and provides the pin density required for a 1,200 user I/O design at commercial temperature ranges.

Physical Attribute Detail
Package Code FLG1925
Package Style 1924-BBGA, FCBGA
Body Size 45mm × 45mm
Ball Count 1,925
User I/O Count 1,200
Mounting Style SMD/SMT (Surface Mount)

Virtex-7 SSI Technology: Why the XC7V2000T Uses Stacked Silicon Interconnect

The “T” suffix in XC7V2000T denotes Stacked Silicon Interconnect (SSI) technology, a proprietary Xilinx innovation used to achieve the 2M+ logic cell density that would be impossible to manufacture as a single monolithic die at 28nm. SSI technology stacks multiple FPGA dice on a passive silicon interposer, connected via tens of thousands of micro-bumps, delivering:

  • Ultra-high bandwidth die-to-die connectivity with no performance penalty
  • Improved yield compared to a single large die
  • Scalable capacity for applications demanding the largest available logic footprint

This makes the XC7V2000T-1FLG1925C the largest logic density device in the Virtex-7 portfolio, well-suited for ASIC prototyping, large-scale signal processing, and high-port-count networking.


Key Features of the XC7V2000T-1FLG1925C

#### Advanced Logic Architecture

The Virtex-7 FPGA fabric is based on 6-input Look-Up Tables (6-LUTs) configurable as distributed memory or logic. Each CLB slice contains two 6-LUT elements with dedicated flip-flops, carry logic, and wide function multiplexers — enabling compact, high-performance implementations of arithmetic, control, and data path functions.

#### High-Speed Serial Connectivity

The XC7V2000T-1FLG1925C integrates built-in multi-gigabit transceivers (MGTs) supporting data rates from 600 Mb/s up to 11.3 Gb/s. A special low-power mode is optimized for chip-to-chip interfaces. This makes the device ideal for protocols such as PCIe, 10G/100G Ethernet, SATA, and custom high-speed serial links.

#### High-Performance SelectIO

The device supports DDR3 memory interfaces up to 1,866 Mb/s through its SelectIO technology, providing the bandwidth required for data-intensive workloads like image processing, real-time DSP, and large memory-mapped designs.

#### Powerful Clock Management

Clock Management Tiles (CMTs) combine Phase-Locked Loops (PLLs) and Mixed-Mode Clock Managers (MMCMs) to deliver high-precision, low-jitter clocking across the device. This is critical for timing closure in complex multi-clock-domain designs.

#### High-Capacity Block RAM

With 46,512 Kbit of on-chip Block RAM, organized as 36 Kb dual-port tiles with native FIFO support, the XC7V2000T-1FLG1925C enables large on-chip data buffers, lookup tables, and packet FIFOs — essential in networking and communications applications.


XC7V2000T-1FLG1925C Applications

The XC7V2000T-1FLG1925C is engineered for high-performance, high-complexity designs. Typical applications include:

Application Area Use Case
Networking & Telecom 10G/40G/100G Ethernet, OTN framing, packet processing
ASIC Prototyping Large SoC emulation, multi-die ASIC validation
High-Performance Computing Signal processing, matrix operations, real-time analytics
Defense & Aerospace Radar signal processing, electronic warfare, image processing
Scientific Instrumentation Data acquisition, waveform generation, physics experiments
Video & Broadcast 4K/8K video processing, multi-channel SDI routing

Ordering and Availability Information

Attribute Detail
Manufacturer AMD (formerly Xilinx)
Part Number XC7V2000T-1FLG1925C
Manufacturer Series Virtex-7
DigiKey Part Number 122-1798-ND
Package Quantity Tray
RoHS Compliance Check with distributor
Export Control (ECCN) Subject to US export regulations

Note: The XC7V2000T-1FLG1925C is an advanced, export-controlled component. Verify compliance requirements before ordering for certain international markets.


XC7V2000T-1FLG1925C vs. Other Virtex-7 Devices

Model Logic Cells Package Speed Grade Temp Grade
XC7V2000T-1FLG1925C 1,954,560 FCBGA-1925 –1 Commercial
XC7VX690T-2FFG1761C 693,120 FCBGA-1761 –2 Commercial
XC7VX980T-1FFG1926C 979,200 FCBGA-1926 –1 Commercial
XC7V585T-2FFG1761C 583,680 FCBGA-1761 –2 Commercial

The XC7V2000T-1FLG1925C offers more than 2× the logic cells of the next-largest standard Virtex-7 device, making it the undisputed choice for designs requiring maximum FPGA fabric capacity.


Design Tools and Support for XC7V2000T-1FLG1925C

Xilinx provides full design tool support for the XC7V2000T-1FLG1925C through the Vivado Design Suite, which offers:

  • RTL synthesis and IP integration
  • Advanced timing closure and static timing analysis (STA)
  • Partial reconfiguration support
  • In-system debugging with ChipScope / ILA cores
  • Scripted flows via TCL for CI/CD integration

The device is also supported in legacy ISE Design Suite environments, though Vivado is the recommended tool for all new designs.


Frequently Asked Questions (FAQ)

Q: What does the “-1” speed grade mean in XC7V2000T-1FLG1925C?
A: The “-1” designates the standard commercial speed grade within the Virtex-7 family. Higher speed grades (e.g., -2, -3) offer faster timing, while -1 is the baseline commercial offering suitable for most system clock frequencies up to 625 MHz fabric.

Q: What is the operating temperature range of the XC7V2000T-1FLG1925C?
A: The “C” suffix indicates a commercial temperature grade: 0°C to 85°C junction temperature (TJ). For extended or industrial temperature variants, consider the “I”-grade devices.

Q: What package does the XC7V2000T-1FLG1925C use?
A: It uses the 1925-pin FCBGA (Flip-Chip Ball Grid Array) package, also described as 1924-BBGA in some datasheets. The body measures 45mm × 45mm.

Q: Is the XC7V2000T-1FLG1925C still in production?
A: As of 2026, AMD has extended support for Virtex-7 devices through 2040, ensuring long-term availability for existing designs and production programs.

Q: Can the XC7V2000T-1FLG1925C be used for ASIC prototyping?
A: Yes. With nearly 2 million logic cells and SSI-based architecture, it is one of the most capable FPGAs available for large SoC and ASIC prototyping workloads.


Summary

The XC7V2000T-1FLG1925C stands as one of the most powerful commercial FPGAs ever manufactured. With ~2M logic cells, 1,200 user I/Os, 46Mb of Block RAM, built-in high-speed transceivers, and advanced DSP resources — all packaged in a surface-mount 1925-ball FCBGA — it addresses the most demanding logic, processing, and connectivity requirements across industries. Whether for networking line cards, radar systems, ASIC prototyping, or high-performance computing, this Virtex-7 device delivers unmatched capacity and flexibility on a proven 28nm HKMG platform.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.