The XC7S100-1FGGA676I is a high-density, low-power Field Programmable Gate Array (FPGA) belonging to the AMD Xilinx FPGA Spartan-7 family. Built on a cutting-edge 28nm High-Performance Low-Power (HPL) process with high-k metal gate (HKMG) technology, this programmable logic device offers an optimized balance of cost, power efficiency, and processing capability. It is specifically engineered to handle complex processing tasks in a compact form factor, making it ideal for multi-layered printed circuit board assemblies.
Engineered with 102,400 logic cells and 400 user I/Os, this industrial-grade chip excels in edge computing, hardware acceleration, and system-level connectivity.
Key Features of the XC7S100-1FGGA676I
High Logic Capacity and Embedded Memory
The chip features 102,400 logic elements and 16,000 slices, enabling the development of complex custom logic circuits. It includes 4,320 kbit of embedded Block RAM alongside 1,100 kbit of distributed RAM. This memory subsystem ensures ultra-low latency data buffering and processing, which is highly beneficial for high-bandwidth applications like video processing and sensor fusion.
Flexible I/O and Advanced Processing
With 400 user I/O pins housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package, the component supports multi-voltage interfaces ranging from 1.2V to 3.3V. Developers can easily deploy embedded processing units using the soft-core MicroBlaze processor, which delivers over 200 DMIPs. It also integrates a dual 12-bit Analog-to-Digital Converter (XADC) subsystem featuring on-chip thermal and voltage tracking sensors.
Robust Clock and Security Management
This semiconductor device includes 8 Clock Management Tiles (CMTs). Each tile combines a Phase-Locked Loop (PLL) and a Mixed-Mode Clock Manager (MMCM) to deliver precise, low-jitter clock distribution. For security-sensitive industries, the chip integrates hardware-level 256-bit AES encryption with HMAC/SHA-256 authentication and built-in Single Event Upset (SEU) detection.
Technical Specifications
The following table provides the comprehensive technical specifications for the industrial-grade component:
| Product Attribute |
Specification Value |
| Manufacturer |
AMD / Xilinx |
| Part Number |
XC7S100-1FGGA676I |
| Family Series |
Spartan-7 |
| Logic Cells |
102,400 |
| Number of CLB Slices |
16,000 |
| Total Block RAM |
4,320 kbit (120 blocks of 36 Kb) |
| Distributed RAM |
1,100 kbit |
| Number of User I/Os |
400 |
| Package / Case |
676-FBGA (27×27 mm) |
| Speed Grade |
-1 |
| Operating Temperature (Tj) |
-40°C to +100°C (Industrial Grade) |
| Core Supply Voltage |
0.95V to 1.05V (1.0V Nominal) |
| DSP Slices |
160 |
Target Applications
The processing capability and wide I/O density make this component highly suitable for:
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Industrial Automation: Machine vision systems, motor control units, and programmable logic controllers (PLCs).
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Automotive Systems: Advanced driver-assistance systems (ADAS), infotainment display interfaces, and sensor processing hubs.
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Consumer Electronics: Smart displays, high-resolution cameras, and embedded multi-media rendering devices.
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Telecommunications: Network bridge controllers, wireless data links, and multi-protocol conversion routers.
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