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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC7A75T-2CSG324C: Xilinx Artix-7 FPGA in CSG324 Commercial Package

Product Details

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Product Description (≈485 words)

XC7A75T-2CSG324C: Xilinx Artix-7 FPGA in CSG324 Commercial Package

The XC7A75T-2CSG324C is a high-performance, low-power FPGA from the AMD Xilinx Artix-7 family, designed for cost-optimized embedded systems that require strong DSP performance, serial connectivity, and a compact footprint. Built on a 28nm HPL (High-Performance, Low-Power) process, this device delivers an excellent balance of logic density, transceiver bandwidth, and energy efficiency. Its small CSG324 chip-scale package makes it especially attractive for space-constrained applications such as portable test equipment, IP cameras, drones, software-defined radio, and consumer electronics.

Key Features and Benefits

The XC7A75T-2CSG324C offers 75,520 logic cells, 3,780 Kb of Block RAM, and 180 DSP48E1 slices, providing substantial computational headroom for digital signal processing, motor control, machine vision, and real-time control loops. Integrated GTP transceivers support line rates up to 6.6 Gb/s, enabling protocols like PCIe Gen2, Gigabit Ethernet, and SATA without the cost of external SerDes chips. The -2 speed grade delivers strong timing performance, while the C (Commercial) temperature rating of 0 °C to +85 °C suits indoor and consumer-class deployments.

This FPGA is part of the comprehensive Xilinx FPGA lineup and is fully supported by the AMD Vivado Design Suite, giving engineers access to high-level synthesis, IP integration, and advanced timing closure tools.

Technical Specifications

Core Logic Resources

Parameter Specification
Family Artix-7
Logic Cells 75,520
Configurable Logic Blocks (CLBs) 11,800
Slices 11,800
Maximum Distributed RAM 892 Kb
Block RAM (36 Kb blocks) 105 (3,780 Kb total)
DSP Slices (DSP48E1) 180
Clock Management Tiles (CMTs) 6

I/O, Transceivers, and Package

Parameter Specification
Package CSG324 (CSBGA, 324-ball)
Package Dimensions 15 mm × 15 mm
Ball Pitch 0.8 mm
Maximum User I/O 210
GTP Transceivers 2 (up to 6.6 Gb/s)
Integrated PCIe Blocks 1 (Gen2 x4)
XADC (12-bit ADC) Yes, dual channel

Electrical and Environmental

Parameter Specification
Speed Grade -2
Temperature Range 0 °C to +85 °C (Commercial)
Core Voltage (V<sub>CCINT</sub>) 1.0 V
Auxiliary Voltage (V<sub>CCAUX</sub>) 1.8 V
Process Technology 28 nm HPL
Configuration Modes JTAG, SPI, BPI, Slave SelectMAP

Typical Applications

The XC7A75T-2CSG324C is widely adopted in portable instrumentation, industrial IoT gateways, consumer video equipment, automotive driver-assistance prototypes, machine vision cameras, drone flight controllers, and software-defined radio platforms. Its compact 15 mm × 15 mm footprint, integrated PCIe block, and low static power consumption make it especially well suited to handheld and battery-powered designs where board space and thermal budget are tight.

Why Source the XC7A75T-2CSG324C from Us

We supply authentic, traceable XC7A75T-2CSG324C devices with original AMD Xilinx packaging, transparent date codes, MSL-compliant moisture handling, and worldwide express shipping. Whether you need single units for prototyping or reel quantities for full-scale production, our inventory ships fast and is backed by full quality documentation.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.