The XC7A75T-1FTG256I is a member of AMD Xilinx’s Artix-7 FPGA family, designed to deliver high-performance logic, DSP, and serial connectivity in a remarkably small footprint. Manufactured on a 28nm HPL (High-Performance, Low-Power) process, this device combines low static power consumption with strong signal-processing throughput, making it a popular choice for space-constrained embedded designs in industrial sensors, portable medical devices, IoT gateways, automotive ADAS modules, and compact machine vision cameras.
Key Features and Benefits
The XC7A75T-1FTG256I offers 75,520 logic cells, 3,780 Kb of Block RAM, and 180 DSP48E1 slices — enough resources to run complex algorithms such as FIR filtering, FFT, image preprocessing, and motor control loops. The FTG256 package (a 17 mm × 17 mm fine-pitch thin BGA with 256 balls) makes it ideal for boards where PCB real estate is tight. With the -1 speed grade and Industrial (I) temperature rating of −40 °C to +100 °C, this part is engineered for reliable, long-life deployment in factory floors, outdoor enclosures, and automotive cabins.
This FPGA is part of the broader Xilinx FPGA lineup and is fully supported by the Vivado Design Suite, which provides synthesis, simulation, IP integration, and bitstream generation in a unified environment.
Technical Specifications
Core Logic Resources
| Parameter |
Specification |
| Family |
Artix-7 |
| Logic Cells |
75,520 |
| Configurable Logic Blocks (CLBs) |
11,800 |
| Slices |
11,800 |
| Maximum Distributed RAM |
892 Kb |
| Block RAM (36 Kb blocks) |
105 (3,780 Kb total) |
| DSP Slices (DSP48E1) |
180 |
| Clock Management Tiles (CMTs) |
6 |
I/O, Transceivers, and Package
| Parameter |
Specification |
| Package |
FTG256 (Fine-Pitch Thin BGA, 256-ball) |
| Package Dimensions |
17 mm × 17 mm |
| Ball Pitch |
1.0 mm |
| Maximum User I/O |
170 |
| GTP Transceivers |
0 (not bonded out in this package) |
| Integrated PCIe Blocks |
Not available in FTG256 |
| XADC (12-bit ADC) |
Yes, dual channel |
Electrical and Environmental
| Parameter |
Specification |
| Speed Grade |
-1 |
| Temperature Range |
−40 °C to +100 °C (Industrial) |
| Core Voltage (V<sub>CCINT</sub>) |
1.0 V |
| Auxiliary Voltage (V<sub>CCAUX</sub>) |
1.8 V |
| Process Technology |
28 nm HPL |
| Configuration Modes |
JTAG, Master/Slave SPI, BPI, Slave SelectMAP |
Typical Applications
The XC7A75T-1FTG256I is well-suited for compact, cost-sensitive embedded designs that still demand serious processing power. Common deployments include industrial I/O modules, smart sensors, portable ultrasound front-ends, LiDAR controllers, drone flight controllers, network appliances, and edge AI accelerators. Its small package and industrial-grade reliability make it especially attractive for products that operate in vibration-prone, temperature-variable environments.
Why Source the XC7A75T-1FTG256I from Us
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