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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC7A75T-1FGG676I: Xilinx Artix-7 FPGA in FBGA-676 Industrial Grade

Product Details

The XC7A75T-1FGG676I is a member of AMD Xilinx’s cost-optimized Artix-7 FPGA family, delivering high-bandwidth serial connectivity, powerful DSP performance, and low power consumption in a generous 676-pin flip-chip BGA package. Manufactured on a 28nm HPL process, this device is engineered for designers who need maximum I/O availability and dependable industrial-grade operation in applications such as machine vision, software-defined radio, automotive driver assistance, medical imaging, and high-channel-count industrial control systems.

Key Features and Benefits

The XC7A75T-1FGG676I provides 75,520 logic cells, 3,780 Kb of Block RAM, and 180 DSP48E1 slices, giving designers ample resources for parallel signal processing, motor control loops, and protocol bridging. Its integrated GTP transceivers deliver line rates up to 6.6 Gb/s, supporting PCIe Gen2, Gigabit Ethernet, and SATA without external PHYs. The -1 speed grade is the standard performance tier — well-suited to mainstream designs where a balance of timing margin and cost matters — while the I (Industrial) temperature rating guarantees reliable operation from −40 °C to +100 °C, making the device dependable in factory floors, outdoor enclosures, and automotive cabins.

The larger FGG676 package stands out as the differentiator: with up to 300 user I/O pins, it offers significantly more interfacing capability than smaller Artix-7 packages, making it ideal for systems requiring multiple memory interfaces, high-pin-count sensors, or wide parallel buses. This part is part of the broader Xilinx FPGA portfolio and is fully supported by the Vivado Design Suite.

Technical Specifications

Core Logic Resources

Parameter Specification
Family Artix-7
Logic Cells 75,520
Configurable Logic Blocks (CLBs) 11,800
Slices 11,800
Maximum Distributed RAM 892 Kb
Block RAM (36 Kb blocks) 105 (3,780 Kb total)
DSP Slices (DSP48E1) 180
Clock Management Tiles (CMTs) 6

I/O, Transceivers, and Package

Parameter Specification
Package FGG676 (FBGA, 676-pin, lead-free)
Package Dimensions 27 mm × 27 mm
Ball Pitch 1.0 mm
Maximum User I/O 300
GTP Transceivers 8 (up to 6.6 Gb/s)
Integrated PCIe Blocks 1 (Gen2 x4)
XADC (12-bit ADC) Yes, dual channel

Electrical and Environmental

Parameter Specification
Speed Grade -1
Temperature Range −40 °C to +100 °C (Industrial, T<sub>j</sub>)
Core Voltage (V<sub>CCINT</sub>) 1.0 V
Auxiliary Voltage (V<sub>CCAUX</sub>) 1.8 V
Process Technology 28 nm HPL
Configuration Modes JTAG, Master/Slave SPI, BPI, SelectMAP

Typical Applications

The XC7A75T-1FGG676I is well suited to multi-camera machine vision systems, 4K/UHD video bridging, LTE/5G small-cell baseband, LiDAR signal processing, ultrasound front-ends, industrial Ethernet aggregation, and motor drives requiring multiple encoder interfaces. Designers also choose it for FMC-based prototyping platforms where the high I/O count of the FGG676 package is essential.

Why Source the XC7A75T-1FGG676I from Us

We supply authentic, factory-traceable XC7A75T-1FGG676I devices with original AMD Xilinx markings, transparent date codes, and full MSL handling. Quantities range from single prototyping units to full reels for production builds, all backed by responsive technical support and rapid global shipping.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.