The XC6VHX250T-3FFG1154C is a premium Xilinx FPGA from the Virtex-6 HXT family, manufactured by AMD (formerly Xilinx). This high-performance field-programmable gate array delivers exceptional serial connectivity and processing power for demanding applications in telecommunications, data centers, and high-speed networking.
XC6VHX250T-3FFG1154C Key Features and Benefits
The XC6VHX250T-3FFG1154C stands out as a top-tier FPGA solution with its advanced 40nm CMOS process technology and comprehensive feature set. Engineers choose this device for applications requiring maximum bandwidth and reliable high-speed serial communication.
Advanced Logic Architecture
The Virtex-6 HXT XC6VHX250T-3FFG1154C utilizes third-generation ASMBL (Advanced Silicon Modular Block) column-based architecture. This design enables logic designers to build the highest levels of performance and functionality into their FPGA-based systems.
High-Speed GTX Transceivers
One of the standout features of the XC6VHX250T-3FFG1154C is its GTX transceivers supporting data rates up to 6.6 Gb/s. These transceivers enable Out-of-Band (OOB) signaling, benefiting PCI Express and SATA/SAS applications.
XC6VHX250T-3FFG1154C Technical Specifications
| Parameter |
Specification |
| Manufacturer |
AMD (Xilinx) |
| Product Family |
Virtex-6 HXT |
| Part Number |
XC6VHX250T-3FFG1154C |
| Logic Cells |
251,904 |
| User I/O |
320 |
| Package Type |
1156-FCBGA |
| Number of Pins |
1154 |
| Speed Grade |
-3 (Highest Performance) |
| Process Technology |
40nm CMOS |
| Core Voltage |
1.0V |
| Temperature Grade |
Commercial (C) |
| Operating Temperature |
0°C to +85°C (TJ) |
| Mounting Type |
Surface Mount |
| RoHS Status |
Compliant (Pb-Free) |
XC6VHX250T-3FFG1154C Logic and Memory Resources
| Resource Type |
Specification |
| CLB Slices |
39,360 |
| Logic Cells |
251,904 |
| LUT (6-Input) |
Real 6-input LUT Technology |
| Flip-Flops |
8 per CLB |
| Distributed RAM |
64-bit per 6-input LUT |
| Block RAM |
36 Kb (Dual 18 Kb Option) |
| Configuration Bits |
26 Mb – 177 Mb |
DSP and Signal Processing Capabilities
The XC6VHX250T-3FFG1154C integrates advanced DSP48E1 slices designed for high-performance signal processing applications.
| DSP Feature |
Description |
| Multiplier |
25 × 18 Two’s Complement |
| Accumulator |
Integrated |
| Pre-Adder |
Optional (Assists Filtering) |
| Pipelining |
Optional |
| Logic Functionality |
Bitwise Operations |
| Cascade Connections |
Dedicated |
Connectivity and Interface Features
GTX Transceiver Specifications
| Feature |
Specification |
| Maximum Data Rate |
6.6 Gb/s |
| Minimum Data Rate |
480 Mb/s |
| Lower Rates |
Supported via Oversampling |
| OOB Signaling |
Supported |
| PLL |
Programmable (4x to 25x) |
PCI Express Integration
| PCIe Feature |
Specification |
| Compliance |
PCI Express Base Specification 2.0 |
| Gen1 Support |
2.5 Gb/s |
| Gen2 Support |
5.0 Gb/s |
| Lane Support |
x1, x2, x4, x8 |
| Capability |
Endpoint and Root Port |
Ethernet MAC Features
| Ethernet Feature |
Specification |
| Speed Support |
10/100/1000 Mb/s |
| 2500 Mb/s |
Available |
| Standards |
1000BASE-X PCS/PMA, SGMII |
| Interface |
MII, GMII, RGMII |
| IEEE Compliance |
802.3-2005 |
Clock Management and I/O Features
Mixed-Mode Clock Manager (MMCM)
The XC6VHX250T-3FFG1154C features powerful MMCM blocks providing:
- Zero-delay buffering
- Frequency synthesis
- Clock-phase shifting
- Input jitter filtering
- Phase-matched clock division
- VCO frequency minimum: 600 MHz
SelectIO Technology
| I/O Feature |
Specification |
| Voltage Range |
1.2V to 2.5V |
| DCI |
Active Termination |
| I/O Banking |
Fine-Grained Flexible |
| Memory Interface |
Write-Leveling Support |
| ChipSync |
Source-Synchronous |
Supported I/O Standards
The XC6VHX250T-3FFG1154C supports multiple I/O standards including: LVCMOS (1.2V-2.5V), HSTL I/II/III, LVDS, Extended LVDS, RSDS, Bus LVDS, LVPECL, and SSTL I/II.
Security and Configuration Features
Configuration Options
| Feature |
Description |
| Storage Type |
SRAM (Volatile) |
| Configuration Interface |
SPI, Parallel Flash |
| Bus Width Detection |
Automatic |
| Multi-Bitstream |
Supported |
| Fallback Logic |
Dedicated |
| Partial Reconfiguration |
Supported (Active) |
Security Features
| Security Feature |
Specification |
| Bitstream Encryption |
AES-256 |
| Key Storage |
Battery Backup / Non-Volatile |
| Readback |
Supported |
Part Number Decoder: XC6VHX250T-3FFG1154C
Understanding the XC6VHX250T-3FFG1154C part number helps identify its exact specifications:
| Code |
Meaning |
| XC6V |
Virtex-6 Family |
| HX |
High-Speed Transceiver Optimized |
| 250T |
Device Size (251,904 Logic Cells) |
| -3 |
Speed Grade (Fastest) |
| FF |
Flip-Chip Package |
| G |
Pb-Free (RoHS Compliant) |
| 1154 |
Pin Count |
| C |
Commercial Temperature (0°C to +85°C) |
XC6VHX250T-3FFG1154C Applications
The XC6VHX250T-3FFG1154C excels in demanding applications including:
- Telecommunications Infrastructure: Base stations, network switches, routers
- Data Center Equipment: High-speed networking, storage systems
- Broadcast and Video: 4K video processing, broadcast equipment
- Test and Measurement: Protocol analyzers, signal generators
- Medical Imaging: MRI, CT scanners, ultrasound systems
- Aerospace and Defense: Radar systems, secure communications
- High-Frequency Trading: Low-latency financial applications
Why Choose the Virtex-6 HXT XC6VHX250T-3FFG1154C?
The XC6VHX250T-3FFG1154C offers several advantages for high-performance designs:
- Maximum Speed Grade (-3): Delivers the highest performance available in the Virtex-6 HXT family
- Extensive Serial Connectivity: GTX transceivers up to 6.6 Gb/s for demanding bandwidth requirements
- Proven 40nm Technology: Mature, reliable process for production-ready designs
- Comprehensive Protocol Support: PCI Express Gen2, Ethernet, SATA/SAS compatibility
- Flexible I/O Options: 320 user I/O with multiple voltage and standard support
- RoHS Compliant: Pb-free packaging meets environmental regulations
Development Tools and Support
Designers working with the XC6VHX250T-3FFG1154C can leverage:
- ISE Design Suite for synthesis and implementation
- Vivado Design Suite compatibility
- CORE Generator for IP integration
- System Monitor for thermal and voltage monitoring
- JTAG access for debugging and monitoring
Package Information
| Package Detail |
Specification |
| Package Style |
Flip-Chip Ball Grid Array |
| Ball Pitch |
1.0 mm |
| Package Size |
35 mm × 35 mm |
| Lead-Free |
Yes (FFG) |
| Moisture Sensitivity |
Level 3 |
Ordering Information
When ordering the XC6VHX250T-3FFG1154C, verify the complete part number to ensure you receive the correct speed grade, package type, and temperature range for your application requirements.
