Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC6VHX250T-2FFG1154C: High-Performance Virtex-6 HXT FPGA for Advanced Applications

Product Details

The XC6VHX250T-2FFG1154C is a high-performance Field Programmable Gate Array (FPGA) from AMD’s Virtex-6 HXT family. Engineered for demanding applications requiring ultra-high-speed serial connectivity, this Xilinx FPGA delivers exceptional processing power with 251,904 logic cells and advanced GTH transceivers capable of operating at speeds up to 11.18 Gbps.


XC6VHX250T-2FFG1154C Key Specifications

Parameter Specification
Manufacturer AMD (formerly Xilinx)
Part Number XC6VHX250T-2FFG1154C
Series Virtex-6 HXT
Logic Cells 251,904
Total RAM Bits 18,579,456
User I/O Pins 320
Package Type 1156-BBGA, FCBGA
Pin Count 1154
Process Technology 40nm CMOS
Core Voltage 1.0V
Speed Grade -2 (High Performance)

Technical Features of XC6VHX250T-2FFG1154C

High-Speed Serial Transceivers

The XC6VHX250T-2FFG1154C features both GTX and GTH transceiver technologies, making it ideal for next-generation optical communications:

Transceiver Type Maximum Data Rate Key Capability
GTX Transceivers 6.6 Gbps General high-speed connectivity
GTH Transceivers 11.18 Gbps Ultra-high-speed optical interfaces

The GTH transceivers deliver sub-500 fs RMS random jitter at 11.18 Gbps, enabling direct interfacing with SFP+, XFP, and CFP optical modules without external re-timer circuitry.

Memory and DSP Resources

Resource Type Quantity
Block RAM (36Kb blocks) 504
Total Block RAM 18,144 Kb
DSP48E1 Slices 576
Distributed RAM 3,926 Kb

Clock Management

Feature Specification
CMTs (Clock Management Tiles) 12
MMCMs 12
PLLs 6
VCO Frequency Range 600 MHz – 1,200 MHz

Package and Environmental Specifications

XC6VHX250T-2FFG1154C Package Details

Specification Value
Package Code FFG1154
Package Type Flip-Chip Fine-Pitch BGA
Ball Pitch 1.0 mm
Package Dimensions 35mm x 35mm
Mounting Type Surface Mount

Operating Conditions

Parameter Commercial Grade (C)
Operating Temperature (TJ) 0°C to +85°C
Storage Temperature -65°C to +150°C
Moisture Sensitivity Level MSL-4 (72 hours)

XC6VHX250T-2FFG1154C Applications

The Virtex-6 HXT FPGA excels in applications demanding high-bandwidth serial connectivity:

Telecommunications and Networking

  • 40 Gbps and 100 Gbps line card implementations
  • Flexible port configurations: 1x40G, 4x10G, 1x100G, 10x10G
  • Optical Transport Network (OTN) equipment
  • Ethernet switches and routers

Industrial and Scientific

  • High-performance computing systems
  • Medical imaging equipment (MRI, CT scanners)
  • Industrial automation and control systems
  • Video processing and broadcast equipment

Aerospace and Defense

  • Radar signal processing
  • Electronic warfare systems
  • Secure communications
  • Avionics systems

Protocol Support and Interfaces

The XC6VHX250T-2FFG1154C supports multiple industry-standard protocols:

Protocol Category Supported Standards
Ethernet 10GBASE-R, 40GbE, 100GbE
Optical Transport OC-48, OC-192, OTU-1, OTU-2, OTU-4
High-Speed Interfaces CAUI, XLAUI, Interlaken
Custom Protocols Aurora 64B/66B
System Interfaces PCI Express Gen2

Development Tools and Software Support

Design Software Compatibility

Tool Version
ISE Design Suite 12.3 and later
Vivado Design Suite Legacy support
GTH Transceiver Wizard v1.8+

Available IP Cores

  • LogiCORE IP for GTH transceiver configuration
  • Predefined protocol templates
  • Custom HDL wrapper generation
  • Comprehensive example designs and testbenches

Compliance and Quality Standards

Standard Status
RoHS Compliance RoHS3 Compliant
Lead-Free Yes
ECCN Code 3A991.D
Product Status Active
Manufacturer Lead Time 12 weeks (typical)

XC6VHX250T-2FFG1154C Part Number Breakdown

Understanding the part number nomenclature:

Segment Meaning
XC6V Virtex-6 FPGA Family
HX HXT Sub-family (High-speed transceiver optimized)
250T Device size (251,904 logic cells)
-2 Speed grade (-2 = high performance)
FF Flip-chip fine-pitch BGA package
G Lead-free (RoHS compliant)
1154 Pin count
C Commercial temperature grade

Related Virtex-6 HXT FPGA Variants

Part Number Logic Cells GTH Transceivers Package
XC6VHX250T-1FFG1154C 251,904 24 1156-FCBGA
XC6VHX380T-2FFG1924C 382,464 48 1924-FCBGA
XC6VHX565T-2FFG1924C 566,784 48 1924-FCBGA

Why Choose XC6VHX250T-2FFG1154C?

The XC6VHX250T-2FFG1154C offers significant advantages for high-performance system designs:

Superior Signal Integrity

The isolated package design provides 40 dB isolation between Tx and Rx paths and 30 dB isolation between channels, ensuring robust high-speed communications.

Power Efficiency

Operating at 1.0V core voltage with an available 0.9V low-power option, the device delivers 50% lower system power consumption compared to competitive 40nm offerings.

Cost Optimization

Direct optical module interfacing eliminates external re-timers, reducing bill-of-materials cost, power dissipation, and PCB real estate requirements.

Design Flexibility

The ASMBL (Advanced Silicon Modular Block) architecture enables rapid prototyping and in-field updates through partial reconfiguration capabilities.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.