Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC5215-BG352: High-Performance FPGA for Advanced Digital Design Applications

Product Details

Overview of the XC5215-BG352 Field Programmable Gate Array

The XC5215-BG352 is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned XC5200 family, designed to deliver exceptional performance and flexibility for complex digital design applications. This SRAM-based reprogrammable FPGA features 23,000 system gates, 1,936 logic cells, and operates at speeds up to 83MHz, making it an ideal choice for engineers and designers requiring robust programmable logic solutions.

Built on advanced 0.5µm three-layer metal CMOS process technology, the XC5215-BG352 combines cost-effectiveness with high functionality. The BG352 Ball Grid Array package provides superior thermal and electrical characteristics, ensuring reliable operation in demanding industrial environments.

Key Technical Specifications

Core Performance Parameters

Specification Value
Logic Cells 1,936 cells
System Gates 23,000 gates
Maximum Frequency 83 MHz
Technology Node 0.5µm CMOS
Operating Voltage 5V
Package Type BG352 Ball Grid Array
Total Pins 352 pins
I/O Pins Up to 244 user I/O signals

Advanced Architecture Features

Feature Description
VersaBlock Logic Module Optimized logic architecture for enhanced design flexibility
VersaRing I/O Interface High logic cell to I/O ratio with programmable interface
Interconnect Resources Rich hierarchy for optimized routing
Configuration SRAM-based reprogrammable architecture
Metal Layers Three-layer metal CMOS process

XC5215-BG352 Features and Benefits

Advanced Logic Architecture

The XC5215-BG352 incorporates Xilinx’s innovative VersaBlock logic module, which delivers superior design flexibility and implementation efficiency. This architecture allows designers to create complex digital systems with reduced development time while maintaining high performance standards.

Key Architectural Advantages:

  • 1,936 configurable logic cells providing exceptional design capacity
  • Register-rich architecture ideal for sequential logic designs
  • Zero flip-flop hold time for input registers, simplifying system timing analysis
  • Programmable output slew-rate control maximizing performance while reducing electromagnetic interference

I/O Capabilities and Connectivity

The BG352 package offers outstanding I/O capabilities, making the XC5215-BG352 suitable for high-pin-count applications requiring extensive connectivity.

I/O Interface Features:

  • Up to 244 user-programmable I/O pins for maximum flexibility
  • VersaRing I/O interface providing optimal logic-to-I/O ratio
  • Support for multiple voltage standards ensuring compatibility with various system interfaces
  • Programmable slew-rate control for signal integrity optimization
  • Compatible with standard TTL and CMOS logic levels

Application Areas for XC5215-BG352 FPGA

Industrial and Commercial Applications

Application Category Use Cases
Digital Signal Processing Signal filtering, data acquisition, real-time processing
Communications Systems Protocol converters, data encoders/decoders, interface controllers
Industrial Automation Control systems, motor control, sensor interfaces
Test & Measurement Logic analyzers, pattern generators, protocol analyzers
Embedded Systems Custom peripheral controllers, system integration

Design Implementation Flexibility

The XC5215-BG352 supports multiple design entry methods, enabling engineers to work with their preferred development tools:

  • VHDL and Verilog HDL synthesis for modern design flows
  • Schematic capture for visual design entry
  • ABEL for equation-based design description
  • Logic synthesis tools from major EDA vendors

Development and Design Tools

Xilinx Software Support

The XC5215-BG352 is fully supported by Xilinx’s comprehensive development environment, available on both workstation and PC platforms:

  • ISE Design Suite for legacy designs
  • XACTstep Timing Calculator for accurate timing analysis
  • XACT-Performance for design optimization and performance verification
  • Complete design verification and simulation tools

Programming and Configuration

Configuration Mode Features
Serial Mode Standard JTAG and serial programming
Express Mode High-speed configuration for faster boot times
Daisy-Chain Multiple device programming capability
Error Checking Built-in CRC error detection

Package Information: BG352 Ball Grid Array

Physical Characteristics

The BG352 Ball Grid Array package offers several advantages for high-performance applications:

  • Superior thermal management through efficient heat dissipation
  • Reduced inductance compared to traditional packages
  • Improved signal integrity for high-speed applications
  • Compact footprint maximizing board space utilization
  • Reliable solder connections suitable for demanding environments

Pin Configuration

With 352 total pins in the Ball Grid Array configuration, the XC5215-BG352 provides:

  • Dedicated power and ground pins for stable operation
  • Global clock distribution pins for synchronous designs
  • Configuration control pins for flexible programming
  • Maximum user I/O availability up to 244 pins

Performance Specifications and Timing

Operating Conditions

Parameter Minimum Typical Maximum Unit
Operating Voltage 4.75 5.0 5.25 V
Operating Temperature 0 25 70 °C
Maximum Frequency 83 MHz
Logic Cell Delay Speed grade dependent ns

Speed Grade Options

The XC5215-BG352 is available in multiple speed grades to meet different performance requirements:

  • -6 speed grade: Standard performance for cost-sensitive applications
  • -5 speed grade: Enhanced performance for demanding designs
  • -4 speed grade: Premium performance for high-speed applications

Reliability and Quality Standards

The XC5215-BG352 meets stringent quality and reliability standards:

  • Industrial temperature range support for harsh environments
  • Extensive quality testing ensuring long-term reliability
  • Compliance with industry standards for programmable logic devices
  • Long product lifecycle for sustained availability

Why Choose the XC5215-BG352 FPGA?

Competitive Advantages

  1. Proven Architecture: Built on Xilinx’s successful FPGA platform with years of field-proven reliability
  2. Cost-Effective Solution: Excellent price-to-performance ratio for medium-complexity designs
  3. Design Flexibility: SRAM-based reprogrammability enables rapid prototyping and field updates
  4. Comprehensive Support: Extensive documentation, design tools, and technical resources available
  5. Legacy Compatibility: Compatible with existing XC5200 family designs and infrastructure

Integration with Xilinx FPGA Ecosystem

The XC5215-BG352 seamlessly integrates into the broader Xilinx FPGA ecosystem, providing designers with access to a wealth of resources, IP cores, and development support. This integration ensures that your designs can leverage proven solutions while maintaining flexibility for custom implementations.

Comparison with Similar FPGA Solutions

XC5215 Package Options

Package Pins I/O Count Typical Applications
BG352 352 Up to 244 High I/O density applications
PQ240 240 Up to 193 Medium-density designs
PQ208 208 Up to 166 Compact implementations
HQ304 304 Up to 220 High-reliability applications

Family Comparison

Device Logic Cells System Gates Max I/O
XC5202 256 3,000 112
XC5204 484 6,000 148
XC5206 676 9,000 166
XC5210 1,024 12,000 196
XC5215 1,936 23,000 244

Design Considerations and Best Practices

Power Management

Effective power management is crucial for optimal XC5215-BG352 performance:

  • Implement proper decoupling capacitors near power pins
  • Use dedicated power planes for VCCINT and VCCIO
  • Consider clock gating techniques to reduce dynamic power
  • Monitor thermal performance in high-utilization designs

Signal Integrity Optimization

To ensure reliable operation at high frequencies:

  • Use controlled impedance traces for critical signals
  • Implement proper termination for high-speed interfaces
  • Minimize stub lengths on ball grid array connections
  • Follow length matching guidelines for parallel buses

Design Partitioning

Efficient design partitioning maximizes XC5215-BG352 utilization:

  • Leverage VersaBlock architecture for optimal logic placement
  • Use floorplanning to group related functions
  • Implement pipeline registers for high-speed data paths
  • Consider resource constraints during early design phases

Technical Support and Documentation

Available Resources

Comprehensive documentation and support materials are available for XC5215-BG352 development:

  • Complete datasheets with electrical and timing specifications
  • User guides covering architecture and implementation
  • Application notes for common design scenarios
  • Reference designs demonstrating best practices
  • Technical forums for community support

Getting Started

To begin working with the XC5215-BG352:

  1. Download the latest Xilinx ISE Design Suite
  2. Review the XC5200 family user guide and datasheets
  3. Install necessary cable drivers for programming
  4. Create your first design using provided templates
  5. Simulate and verify functionality before programming
  6. Program the device using JTAG or serial configuration

Ordering Information and Availability

Part Number Nomenclature

Understanding XC5215-BG352 part numbers:

  • XC5215: Device family and density
  • Speed Grade: -4, -5, or -6 (lower number = faster)
  • BG352: Package type (Ball Grid Array, 352 pins)
  • Temperature Grade: C (Commercial) or I (Industrial)

Common Part Numbers

Part Number Speed Grade Temperature Range
XC5215-6BG352C -6 (Standard) 0°C to 70°C
XC5215-6BG352I -6 (Standard) -40°C to 85°C
XC5215-5BG352C -5 (Enhanced) 0°C to 70°C
XC5215-4BG352C -4 (Premium) 0°C to 70°C

Frequently Asked Questions

What is the main difference between XC5215-BG352 and other XC5200 family members?

The XC5215 offers the highest logic capacity in the XC5200 family with 1,936 logic cells and 23,000 system gates. The BG352 package specifically provides maximum I/O count (up to 244 pins) for high-connectivity applications.

Is the XC5215-BG352 compatible with modern Xilinx development tools?

Yes, the XC5215-BG352 is supported by Xilinx ISE Design Suite and other legacy tools. While newer Vivado tools focus on current-generation FPGAs, ISE provides complete support for XC5200 family devices.

What programming methods are supported?

The XC5215-BG352 supports JTAG programming, serial configuration, and daisy-chain configuration modes. Both standard and Express mode programming are available for different application requirements.

Can the XC5215-BG352 be used in industrial applications?

Yes, industrial temperature range variants (I-grade) are available, operating from -40°C to 85°C, making them suitable for harsh industrial environments.

What is the typical power consumption?

Power consumption varies based on utilization, clock frequency, and I/O activity. Use Xilinx’s XPower tools to estimate power consumption for specific designs.

Conclusion: XC5215-BG352 for Your Next FPGA Project

The XC5215-BG352 represents an excellent balance of performance, capacity, and cost-effectiveness for medium-to-high complexity programmable logic applications. With its robust architecture, comprehensive development tool support, and proven reliability, this FPGA continues to serve designers requiring dependable solutions for industrial, commercial, and embedded system applications.

Whether you’re developing communication protocols, implementing digital signal processing algorithms, or creating custom control systems, the XC5215-BG352 provides the resources and flexibility needed for successful project completion. Its BG352 package offers maximum I/O capability while maintaining excellent thermal and electrical characteristics.

For engineers seeking a reliable, well-documented FPGA solution with strong industry support and extensive development resources, the XC5215-BG352 remains a compelling choice in the programmable logic landscape.


Additional Resources

  • Technical Support: Contact authorized Xilinx distributors for technical assistance
  • Development Boards: Various third-party evaluation boards available
  • Community Forums: Active user communities for design support
  • Application Notes: Extensive library of application-specific documentation
  • Training Materials: Online courses and tutorials for FPGA development

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.