Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC5215-6HQ240IO359: High-Performance FPGA Solution for Complex Digital Design

Product Details

Overview of XC5215-6HQ240IO359 Field Programmable Gate Array

The XC5215-6HQ240IO359 is a sophisticated field programmable gate array (FPGA) designed to deliver exceptional performance in demanding digital applications. Manufactured by Rochester Electronics LLC as part of the XC5200 series, this advanced programmable logic device offers engineers and designers a powerful solution for implementing complex digital circuits with remarkable flexibility and reliability.

Technical Specifications and Key Features

Core Performance Characteristics

Specification Value
Part Number XC5215-6HQ240IO359
Manufacturer Rochester Electronics LLC
Product Family XC5200 Series FPGA
Package Type 240-BQFP (Bumpered Quad Flat Pack)
Total I/O Count 359 I/O pins
Operating Temperature Industrial grade
Technology CMOS
Mounting Type Surface Mount

Detailed Product Specifications Table

Feature Description
Logic Elements High-density programmable logic cells
Speed Grade -6 (High performance)
Package Configuration HQ240 – 240-pin BQFP
I/O Standards Multiple voltage level support
Configuration Non-volatile or SRAM-based
Power Supply Multiple voltage rails supported
Application Areas Industrial control, telecommunications, embedded systems

Applications and Use Cases

Industrial Applications

The XC5215-6HQ240IO359 FPGA excels in various industrial control applications where programmable logic and high I/O counts are essential. Its robust design makes it ideal for:

  • Process Control Systems: Implementing complex control algorithms with real-time response requirements
  • Motor Control: Managing sophisticated motor drive systems with precision timing
  • Factory Automation: Coordinating multiple sensors and actuators in manufacturing environments
  • Data Acquisition: Processing multiple input channels simultaneously with high-speed data handling

Telecommunications and Networking

In telecommunications infrastructure, the XC5215-6HQ240IO359 provides the flexibility needed for:

  • Protocol conversion and bridging
  • Signal processing applications
  • Network interface implementations
  • Custom communication protocol development

Embedded System Development

Engineers working with Xilinx FPGA technology appreciate the XC5215-6HQ240IO359 for embedded system projects requiring:

  • Custom peripheral interfaces
  • Hardware acceleration modules
  • Real-time signal processing
  • Complex state machine implementations

Package and Pin Configuration

240-Pin BQFP Package Details

Package Attribute Specification
Package Type BQFP (Bumpered Quad Flat Pack)
Pin Count 240 pins
Pitch Fine pitch for high-density mounting
Mounting Surface mount technology (SMT)
Thermal Performance Enhanced heat dissipation capability
Lead-free Option RoHS compliant versions available

I/O Pin Distribution

The XC5215-6HQ240IO359 features an impressive 359 I/O pins, providing exceptional connectivity options:

  • Dedicated input pins
  • Dedicated output pins
  • Bidirectional I/O capabilities
  • Special function pins (clock, reset, configuration)
  • Power and ground distribution

Design Advantages and Benefits

Flexibility and Reconfigurability

One of the primary advantages of the XC5215-6HQ240IO359 is its programmable nature, allowing designers to:

  1. Rapid Prototyping: Test and validate designs quickly without custom silicon fabrication
  2. Design Iteration: Modify functionality through firmware updates rather than hardware changes
  3. Cost Efficiency: Single device supports multiple design variants
  4. Future-Proofing: Adapt to changing requirements through reconfiguration

Performance Characteristics

Performance Metric Benefit
Clock Speed High-frequency operation for demanding applications
Propagation Delay Low-latency signal processing
I/O Speed Fast interface capabilities
Power Efficiency Optimized for various power budgets

Development and Programming

Design Tools Compatibility

The XC5215-6HQ240IO359 integrates seamlessly with industry-standard FPGA development tools:

  • Hardware description language (HDL) support including VHDL and Verilog
  • Schematic capture tools for visual design entry
  • Simulation and verification platforms
  • Timing analysis and optimization tools
  • Programming and configuration software

Configuration Methods

Configuration Type Description
JTAG Industry-standard boundary scan interface
Parallel High-speed parallel configuration
Serial Compact serial programming interface
Master/Slave Multi-device configuration support

Electrical Characteristics

Power Requirements

Understanding the power specifications is crucial for system design:

  • Core voltage requirements for internal logic
  • I/O voltage levels supporting multiple standards
  • Power sequencing requirements
  • Estimated power consumption based on utilization

Signal Integrity Considerations

Parameter Specification
Input Voltage Levels TTL/CMOS compatible
Output Drive Strength Programmable drive capabilities
Slew Rate Control Configurable for EMI reduction
Termination On-chip termination options

Quality and Reliability

Manufacturing Standards

Rochester Electronics LLC maintains rigorous quality control standards:

  • ISO-certified manufacturing processes
  • Comprehensive testing protocols
  • Long-term availability commitments
  • Traceability and documentation

Environmental Ratings

Environmental Factor Rating
Operating Temperature Range Industrial grade extended range
Storage Temperature Wide temperature storage capability
Moisture Sensitivity MSL rating for storage and handling
ESD Protection Built-in protection on I/O pins

Comparison with Alternative FPGA Solutions

XC5200 Series Positioning

Model Logic Capacity I/O Count Package Options
XC5202 Entry-level Lower I/O Smaller packages
XC5210 Mid-range Moderate I/O Multiple options
XC5215 High-density 359 I/O 240-BQFP
XC5220 Maximum capacity Highest I/O Largest packages

Implementation Best Practices

Design Recommendations

To maximize the performance of the XC5215-6HQ240IO359:

  1. Power Distribution: Implement proper power plane design with adequate decoupling
  2. Clock Management: Use dedicated clock resources and follow synchronous design practices
  3. I/O Planning: Organize I/O assignments for optimal signal routing
  4. Thermal Management: Ensure adequate cooling based on power consumption analysis
  5. Configuration Strategy: Select appropriate configuration method for your application

PCB Layout Considerations

Layout Aspect Guideline
Component Placement Follow manufacturer spacing recommendations
Signal Routing Minimize trace lengths for high-speed signals
Power Planes Use solid planes with minimal discontinuities
Grounding Implement proper ground plane strategy
Thermal Vias Add thermal vias under package for heat dissipation

Supply Chain and Availability

Procurement Information

The XC5215-6HQ240IO359 is available through authorized distributors:

  • Standard lead times for volume production
  • Engineering samples available for evaluation
  • Long-term supply agreements for critical applications
  • Rochester Electronics’ commitment to product longevity

Package Marking and Identification

Understanding package markings ensures proper device identification:

  • Part number clearly marked on package top
  • Date code for manufacturing traceability
  • Lot code for quality control tracking
  • Country of origin marking

Support and Documentation

Available Resources

Designers working with the XC5215-6HQ240IO359 have access to:

  • Comprehensive datasheets with electrical specifications
  • Application notes for common implementation scenarios
  • Reference designs demonstrating best practices
  • Technical support from manufacturer and distributors
  • Online design communities and forums

Development Support

Resource Type Description
Datasheets Complete electrical and mechanical specifications
User Guides Detailed implementation instructions
Application Notes Specific use case examples
Errata Documents Known issues and workarounds
Software Updates Latest development tool versions

Conclusion

The XC5215-6HQ240IO359 represents a versatile and powerful FPGA solution for engineers requiring high I/O count and substantial logic capacity in a surface-mount package. Its combination of 359 I/O pins, robust 240-BQFP packaging, and comprehensive development tool support makes it an excellent choice for industrial control systems, telecommunications equipment, and complex embedded applications.

Whether you’re designing custom interfaces, implementing high-speed data processing, or developing sophisticated control systems, the XC5215-6HQ240IO359 provides the programmable logic resources and flexibility needed for successful implementation. Combined with Rochester Electronics’ commitment to quality and long-term availability, this FPGA offers a reliable foundation for mission-critical applications.

For designers already familiar with FPGA technology or those exploring programmable logic solutions for the first time, the XC5215-6HQ240IO359 delivers professional-grade performance with the reconfigurability that modern electronic systems demand.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.