Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC5215-6HQ208IO359: High-Performance Field Programmable Gate Array for Industrial Applications

Product Details

Overview of XC5215-6HQ208IO359 FPGA

The XC5215-6HQ208IO359 is a powerful Field Programmable Gate Array (FPGA) from the XC5200 family, originally manufactured by Xilinx (now AMD). This versatile programmable logic device delivers exceptional performance with 23,000 usable gates and 1,936 logic cells, making it an ideal solution for complex digital designs across telecommunications, industrial automation, and embedded systems applications.

As a member of the renowned Xilinx FPGA product line, the XC5215-6HQ208IO359 combines advanced SRAM-based reprogrammable architecture with robust features that have made it a trusted choice for engineers worldwide.

Key Technical Specifications

Core Features Table

Specification Details
Part Number XC5215-6HQ208IO359
Manufacturer Xilinx (AMD) / Rochester Electronics LLC
Product Family FPGA XC5200 Family
Logic Cells 1,936 Cells
Usable Gates 23,000 Gates
Operating Frequency 83 MHz
Process Technology 0.5µm Three-Layer Metal CMOS
Supply Voltage 5V
Package Type 208-Pin HSPQFP EP (Heat Sink Plastic Quad Flat Pack with Exposed Pad)
I/O Count 359 I/O Pins
Operating Temperature Range Commercial Grade (0°C to +70°C)

Performance Characteristics Table

Parameter Value
Architecture Type SRAM-Based Reprogrammable
Metal Layers 3 Metal Layers
Maximum Operating Speed 83 MHz
Logic Module VersaBlock™ Technology
I/O Interface VersaRing™ I/O Interface
Output Slew Rate Programmable
Flip-Flop Hold Time Zero Hold Time for Input Registers

What Makes the XC5215-6HQ208IO359 Stand Out?

Advanced VersaBlock™ Logic Architecture

The XC5215-6HQ208IO359 FPGA features Xilinx’s innovative VersaBlock™ logic module, which provides exceptional flexibility in implementing complex digital functions. This architecture enables designers to efficiently utilize the 1,936 available logic cells for register-rich applications, making it particularly suitable for state machine implementations, data path operations, and control logic.

VersaRing™ I/O Interface Technology

With 359 user-configurable I/O pins and the proprietary VersaRing I/O interface, this FPGA offers an outstanding logic cell to I/O ratio. The interface includes programmable output slew-rate control, which allows engineers to optimize signal integrity while minimizing electromagnetic interference (EMI) in high-speed designs.

Hierarchical Interconnect Resources

The XC5215-6HQ208IO359 incorporates a rich hierarchy of interconnect resources that significantly reduce routing congestion and improve overall design performance. This advanced routing architecture ensures predictable timing characteristics and simplifies the place-and-route process.

Technical Capabilities

Design Entry and Development Support

Design Method Support Level
Schematic Capture Fully Supported
VHDL Synthesis Full VHDL Support
Verilog HDL Complete Verilog Support
ABEL Native Support
Third-Party Synthesis Tools Compatible with Leading Tools
Development Platforms Workstation and PC Compatible

The XC5215-6HQ208IO359 is supported by comprehensive design software environments, including the familiar Xilinx ISE Design Suite. Engineers can leverage their existing design methodologies and tools, ensuring a smooth transition and reduced learning curve.

Process Technology Benefits

Built on a mature 0.5µm CMOS process with three-layer metal interconnect, the XC5215-6HQ208IO359 offers excellent reliability and proven performance. This established technology node provides:

  • Robust noise immunity
  • Predictable electrical characteristics
  • Long-term availability through authorized distributors
  • Proven manufacturing yield and quality

Package and Pin Configuration Details

208-Pin HSPQFP Package Information

Package Characteristic Specification
Package Style HSPQFP (Heat Sink Plastic Quad Flat Pack)
Total Pins 208 Pins
User I/O Pins 359 Configurable I/O
Exposed Pad Yes (for Enhanced Thermal Performance)
Mounting Type Surface Mount
Lead Pitch Fine Pitch Quad
Thermal Enhancement Integrated Heat Sink Capability

The 208-pin HSPQFP package with exposed pad provides excellent thermal dissipation characteristics, making the XC5215-6HQ208IO359 suitable for applications requiring sustained high-performance operation in industrial environments.

Application Areas for XC5215-6HQ208IO359

Industrial Control Systems

The XC5215-6HQ208IO359 excels in industrial automation applications, including:

  • Programmable Logic Controllers (PLCs)
  • Motion control systems
  • Process control interfaces
  • Data acquisition systems
  • Industrial networking protocols

Telecommunications Equipment

With 83 MHz operation and extensive I/O capability, this FPGA is well-suited for:

  • Protocol converters
  • Digital signal processing
  • Line card interfaces
  • Telecommunications switching
  • Network traffic management

Embedded System Applications

Engineers choose the XC5215-6HQ208IO359 for:

  • Custom processor interfaces
  • Peripheral controllers
  • Video and graphics processing
  • Real-time data processing
  • System glue logic

Legacy System Maintenance

As a mature product with continued availability through Rochester Electronics LLC, the XC5215-6HQ208IO359 serves as an excellent solution for:

  • Replacement parts for existing designs
  • Long-term product support
  • Lifecycle extension programs
  • Authorized replacement component

Design Advantages and Benefits

Time-to-Market Acceleration

The XC5215-6HQ208IO359 FPGA significantly reduces development time through:

  1. Reprogrammable Architecture: Make design changes without hardware modifications
  2. Familiar Development Tools: Leverage existing Xilinx tool knowledge
  3. Proven Design Methodology: Build on established best practices
  4. Comprehensive Documentation: Access detailed technical resources

Cost-Effective Solution

This FPGA provides exceptional value through:

  • Register-rich architecture reduces external component count
  • High integration level minimizes PCB complexity
  • Proven reliability reduces warranty costs
  • Long-term availability ensures product lifecycle support

Design Flexibility Features

Flexibility Aspect Benefit
Reprogrammable Logic Field upgradeable functionality
Configurable I/O Standards Interface with multiple logic families
Flexible Clocking Multiple clock domains support
Programmable Slew Rate Optimized signal integrity
Zero Hold Time Simplified timing closure

Programming and Configuration

Configuration Options

The XC5215-6HQ208IO359 supports multiple configuration modes:

  • Master Serial mode
  • Slave Serial mode
  • Peripheral mode
  • JTAG boundary scan programming

Development Software Compatibility

This FPGA is compatible with:

  • Xilinx ISE Design Suite
  • Third-party synthesis tools (Synplify, Precision)
  • Standard simulation tools (ModelSim, VCS)
  • Place-and-route optimization tools

Quality and Reliability

Manufacturing Standards

Quality Aspect Standard
Manufacturing Process ISO 9001 Certified
Availability Through Authorized Distributors
Current Manufacturer Rochester Electronics LLC
Quality Assurance Full Traceability
Testing Comprehensive Production Testing

Product Lifecycle Support

Rochester Electronics LLC, as the current authorized manufacturer, provides:

  • Long-term product availability
  • Consistent quality standards
  • Full technical documentation
  • Applications engineering support
  • RoHS compliance options

Comparison with Similar FPGAs

XC5200 Family Comparison

Device Logic Cells Gates User I/O Package
XC5202 256 3,000 112 Various
XC5204 428 5,000 164 Various
XC5210 1,024 12,000 244 Various
XC5215 1,936 23,000 359 208-Pin HSPQFP

The XC5215-6HQ208IO359 represents the highest gate count option in the XC5200 family, providing maximum logic capacity for complex applications.

Electrical Specifications

Power Requirements

Parameter Typical Maximum
Core Voltage (VCC) 5.0V 5.25V
I/O Voltage (VCCO) 5.0V 5.25V
Standby Current TBD Contact Manufacturer
Active Current Design Dependent Design Dependent

Timing Specifications

Timing Parameter Value
Maximum Internal Clock Frequency 83 MHz
Input Setup Time Design and Speed Grade Dependent
Output Delay Speed Grade Dependent
Clock-to-Output Optimized per Design

Design Guidelines and Best Practices

PCB Layout Considerations

For optimal performance with the XC5215-6HQ208IO359:

  1. Power Decoupling: Place 0.1µF ceramic capacitors near each VCC pin
  2. Ground Plane: Implement solid ground plane for signal integrity
  3. Thermal Management: Ensure adequate airflow around HSPQFP package
  4. Signal Integrity: Maintain controlled impedance for high-speed signals
  5. Clock Distribution: Use dedicated clock routing for critical timing paths

Configuration and Programming Tips

  • Implement JTAG chain for in-system programming capability
  • Consider configuration device selection for master mode operation
  • Plan for configuration memory retention in power-down scenarios
  • Implement proper pull-up/pull-down resistors on configuration pins

Environmental and Operating Conditions

Operating Temperature Range

Parameter Commercial Grade (-6)
Minimum Operating Temperature 0°C
Maximum Operating Temperature +70°C
Storage Temperature Range -65°C to +150°C

Environmental Compliance

  • RoHS compliance available
  • Lead-free options through authorized distributors
  • Conflict minerals compliance
  • REACH regulation compliant

Ordering Information and Availability

Part Number Breakdown

XC5215-6HQ208IO359

  • XC5215: Device family and gate count (23K gates)
  • -6: Speed grade (commercial temperature range)
  • HQ208: Package type (208-pin HSPQFP)
  • IO359: User I/O count specification

Where to Purchase

The XC5215-6HQ208IO359 is available through:

  • Rochester Electronics LLC (authorized manufacturer)
  • Authorized electronic component distributors
  • DigiKey Electronics
  • Specialized FPGA suppliers

Availability Status

This device is currently available as:

  • New production units from Rochester Electronics LLC
  • Replacement parts for legacy designs
  • Long-term lifecycle support component

Technical Support and Resources

Available Documentation

  • Complete product datasheet
  • User guide and application notes
  • Design constraints file (UCF)
  • Timing models and IBIS files
  • Package mechanical drawings

Applications Support

Contact Rochester Electronics LLC or authorized distributors for:

  • Technical design assistance
  • Sample requests
  • Volume pricing
  • Custom testing requirements
  • Long-term availability programs

Frequently Asked Questions

Is the XC5215-6HQ208IO359 suitable for new designs?

While originally classified as “not recommended for new designs” by Xilinx, this FPGA remains an excellent choice for legacy product support, replacement applications, and situations where its specific characteristics meet project requirements. Rochester Electronics LLC continues to manufacture this device to support existing designs.

What development tools are required?

The XC5215-6HQ208IO359 is supported by Xilinx ISE Design Suite and compatible with industry-standard HDL synthesis tools. Many third-party synthesis and simulation tools also support this device family.

How does the -6 speed grade compare to other options?

The -6 speed grade indicates commercial temperature range operation (0°C to +70°C) with standard performance characteristics. This is the most commonly used grade for general-purpose applications.

What makes the 208-pin HSPQFP package advantageous?

The HSPQFP package offers excellent thermal performance through its exposed pad design, fine-pitch pin layout for high I/O density, and proven reliability in surface-mount applications. It’s particularly well-suited for applications requiring good thermal dissipation in a compact footprint.

Can this FPGA interface with 3.3V logic?

Yes, with appropriate external level translation or proper I/O configuration, the XC5215-6HQ208IO359 can interface with various logic levels. Consult the datasheet for specific I/O standard compatibility and implementation guidelines.

Conclusion

The XC5215-6HQ208IO359 Field Programmable Gate Array represents a mature, reliable solution for complex digital design applications. With 23,000 gates, 1,936 logic cells, and 359 user I/O pins in a thermally-efficient 208-pin HSPQFP package, this FPGA delivers the performance and flexibility needed for demanding industrial, telecommunications, and embedded system applications.

Backed by Rochester Electronics LLC’s long-term manufacturing commitment and supported by comprehensive development tools, the XC5215-6HQ208IO359 continues to serve engineers who require proven performance, lifecycle stability, and cost-effective programmable logic solutions.

Whether you’re maintaining an existing design, developing legacy-compatible products, or selecting components for applications where this FPGA’s specific characteristics provide optimal value, the XC5215-6HQ208IO359 remains a solid choice backed by reliable supply chain support.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.