Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC5215-5HQ208CO359: High-Performance FPGA Field-Programmable Gate Array for Industrial Applications

Product Details

Product Overview: XC5215-5HQ208CO359 FPGA Solution

The XC5215-5HQ208CO359 is a premium field-programmable gate array (FPGA) from the renowned XC5200 family, manufactured by Rochester Electronics LLC as an authorized continuation source. This robust FPGA delivers exceptional performance for embedded systems, digital signal processing, and industrial control applications requiring reliable programmable logic solutions.

As part of the legendary Xilinx FPGA XC5200 series, the XC5215-5HQ208CO359 combines proven SRAM-based architecture with advanced VersaBlock technology, making it ideal for designers seeking cost-effective, high-density programmable logic devices with extended lifecycle support.

Key Specifications and Technical Features

Core Performance Specifications

Specification Value Description
Logic Cells 1,936 cells High-density programmable logic resources
System Gates 23,000 gates Equivalent gate count for complex designs
Operating Voltage 5V Standard industrial voltage rating
Technology Node 0.5µm CMOS Three-layer metal process technology
Maximum Frequency 83 MHz Internal clock frequency capability
Package Type 208-Pin HQFP Heat-dissipating quad flat pack
Temperature Grade Commercial (0°C to +70°C) Standard operating temperature range

Advanced FPGA Architecture Features

The XC5215-5HQ208CO359 leverages cutting-edge programmable logic architecture designed for maximum flexibility:

  • VersaBlock Logic Module: Register-rich, SRAM-based reprogrammable architecture optimizing logic density
  • VersaRing I/O Interface: Innovative I/O architecture providing superior logic-to-pin ratios
  • Hierarchical Interconnect: Rich routing resources minimizing signal propagation delays
  • Zero Hold Time: Simplified system timing with zero flip-flop hold requirements for input registers
  • Programmable Slew Rate: Configurable output slew-rate control maximizing performance while reducing EMI noise

Detailed Technical Specifications Table

Electrical and Physical Characteristics

Parameter Specification Notes
Part Number XC5215-5HQ208CO359 Full manufacturer part number
Manufacturer Rochester Electronics LLC Authorized Xilinx continuation source
Product Category Field-Programmable Gate Arrays (FPGAs) Integrated Circuits / Programmable Logic
Package 208-HQFP (Heat Sink Quad Flat Pack) Surface mount technology
Pin Count 208 pins High I/O density configuration
Speed Grade -5 Standard commercial speed grade
Operating Temperature 0°C to +70°C Commercial temperature range
Supply Voltage 5V ±5% Single voltage operation
RoHS Compliance Not Compliant Legacy product specification
Moisture Sensitivity MSL 3 Moisture sensitivity level rating

I/O and Interface Capabilities

Input/Output Configuration

Feature Specification Advantage
Maximum I/O Pins Up to 160 user I/O High pin-to-logic cell ratio
I/O Standards TTL/CMOS compatible Broad system compatibility
Output Drive Configurable drive strength Optimized signal integrity
Input Protection ESD protection on all pins Enhanced reliability
Slew Rate Control Programmable per pin EMI/noise reduction capability

Application Areas and Use Cases

Primary Applications for XC5215-5HQ208CO359

The XC5215-5HQ208CO359 FPGA excels in diverse industrial and commercial applications:

Industrial Automation and Control

  • Programmable logic controllers (PLCs)
  • Motor control systems
  • Factory automation interfaces
  • Industrial protocol converters

Digital Signal Processing

  • Digital filters and FFT implementation
  • Audio/video processing pipelines
  • Real-time data acquisition systems
  • Signal conditioning applications

Communications Infrastructure

  • Protocol bridging and translation
  • Network interface controllers
  • Telecommunications equipment
  • Data multiplexing systems

Embedded Systems

  • Custom peripheral interfaces
  • System-on-chip prototyping
  • Legacy system upgrades
  • Glue logic replacement

Test and Measurement

  • Automated test equipment (ATE)
  • Data acquisition systems
  • Logic analyzers
  • Pattern generators

Design and Development Support

Software and Design Tools Compatibility

The XC5215-5HQ208CO359 benefits from comprehensive Xilinx development tool support:

Tool Category Supported Tools Purpose
Design Entry ABEL, Schematic Capture HDL and graphical design
HDL Synthesis VHDL, Verilog HDL Hardware description languages
Implementation Xilinx ISE, Foundation Place and route tools
Simulation ModelSim, ISim Functional and timing verification
Programming iMPACT, ChipScope Device configuration and debug

Development Workflow Features

  • Multiple Design Entry Methods: Support for schematic capture, HDL synthesis, and state machine editors
  • Cross-Platform Support: Compatible with Windows, Linux, and Unix workstations
  • Legacy Tool Integration: Works with existing Xilinx design flows and IP cores
  • Timing Analysis: Comprehensive static timing analysis and performance optimization

Package and Pin Configuration

208-Pin HQFP Package Details

Package Attribute Specification
Package Type HQFP (Heat Sink Quad Flat Pack)
Total Pins 208
Pin Pitch 0.5mm typical
Body Size 28mm x 28mm nominal
Height Low-profile surface mount
Thermal Enhancement Integrated heat sink pad

Pin Assignment Categories

  • Power Pins: Multiple VCC and GND for stable power distribution
  • I/O Pins: User-configurable general-purpose I/O
  • Configuration Pins: JTAG boundary-scan and programming interface
  • Clock Pins: Dedicated global clock inputs
  • Special Function Pins: Mode selection and status outputs

Competitive Advantages and Benefits

Why Choose XC5215-5HQ208CO359?

Proven Reliability

Field-tested architecture with decades of successful deployments across industries worldwide.

Cost-Effective Solution

Optimal balance between logic density, performance, and price point for medium-complexity designs.

Long-Term Availability

Rochester Electronics provides authorized continuation manufacturing ensuring supply chain security.

Design Flexibility

SRAM-based architecture allows unlimited reprogramming for iterative development and field updates.

Comprehensive Ecosystem

Extensive IP libraries, reference designs, and community support accelerate time-to-market.

Backward Compatibility

Pin-compatible with other XC5200 family members enabling scalable design migration.

Programming and Configuration

Configuration Methods

Method Description Use Case
JTAG Boundary-Scan IEEE 1149.1 compliant In-system programming and debug
Master Serial Mode Configuration from serial PROM Standalone operation
Slave Serial Mode External microcontroller configuration System-integrated designs
Master Parallel Mode Fast configuration from parallel source High-speed boot requirements

Configuration Memory Options

The XC5215-5HQ208CO359 supports various configuration storage solutions:

  • Serial configuration PROMs
  • Platform Flash in-system programmable devices
  • Microcontroller-based configuration
  • External EEPROM/Flash memory

Quality and Compliance

Manufacturing Standards

Standard Status Details
ISO 9001 Certified Quality management system
AS9100 Compliant Aerospace quality standards
ITAR Registered Export control compliance
Counterfeit Prevention Active Program Authorized source verification

Testing and Reliability

  • 100% Functional Testing: Every device tested to datasheet specifications
  • Environmental Stress Screening: Optional burn-in and temperature cycling
  • Qualification Standards: MIL-STD-883 methods available
  • Traceability: Full lot traceability and certificate of conformance

Ordering Information and Part Number Breakdown

Part Number Decoder: XC5215-5HQ208CO359

Segment Code Meaning
XC Family Xilinx FPGA product line
5215 Device 1936 logic cells, XC5200 family
-5 Speed Grade Commercial speed grade
HQ208 Package 208-pin HQFP package type
C Temperature Commercial (0°C to +70°C)
O359 Revision Rochester Electronics revision code

Available Package Options Comparison

Package Pins Size Best For
PQ160 160 Plastic Quad Flat Pack Space-constrained designs
HQ208 208 Heat Sink QFP Standard applications
PQ240 240 Plastic QFP Maximum I/O requirements
BG352 352 Ball Grid Array High-density routing

Power Consumption and Thermal Management

Power Specifications

Parameter Typical Maximum Conditions
Core Current 250 mA 400 mA 5V, 25°C, typical design
I/O Current Variable 50 mA per pin Depends on drive strength
Standby Current 10 mA 25 mA Configured, no switching
Total Power 1.25W 2.5W Full utilization estimate

Thermal Considerations

  • Junction Temperature: 125°C maximum recommended
  • Thermal Resistance (θJA): Approximately 35°C/W with heat sink
  • Cooling Requirements: Natural convection typically sufficient
  • Heat Sink Options: Optional clip-on heat sinks available

Design Resources and Support

Available Documentation

  1. Datasheet: Complete electrical specifications and AC/DC parameters
  2. User Guide: Architecture overview and design guidelines
  3. Application Notes: Design techniques and best practices
  4. PCB Layout Guidelines: Recommended footprints and routing
  5. Programming Specifications: Configuration timing and protocols

Technical Support Resources

  • Online Community: Xilinx forums and knowledge base
  • FAE Support: Field application engineer assistance
  • Training Courses: Online and instructor-led FPGA design courses
  • Reference Designs: Downloadable IP cores and example projects

Migration and Upgrade Paths

Family Compatibility

The XC5215-5HQ208CO359 offers seamless migration within the XC5200 family:

Device Logic Cells Gates Migration Path
XC5202 256 3,000 Lower density option
XC5204 484 6,000 Entry-level design
XC5206 729 9,000 Mid-range capacity
XC5210 1,024 12,000 Standard capacity
XC5215 1,936 23,000 Current device

Modern Alternatives

For new designs requiring advanced features, consider migration to:

  • Spartan Series: Cost-optimized modern FPGAs
  • Artix Series: Low-power, high-performance options
  • Zynq Series: ARM processor + FPGA integration

Industry Certifications and Standards

The XC5215-5HQ208CO359 supports various industry-specific requirements:

  • Automotive: Suitable for non-safety-critical automotive applications
  • Industrial: Meets industrial temperature and reliability standards
  • Medical: Can be used in non-implantable medical equipment
  • Aerospace: Available through authorized aerospace distributors

Frequently Asked Questions

Is the XC5215-5HQ208CO359 suitable for new designs?

While this is a mature product, it remains excellent for:

  • Legacy equipment upgrades and replacements
  • Applications requiring proven, stable technology
  • Designs where long-term availability is critical
  • Cost-sensitive projects with moderate complexity

What is Rochester Electronics’ role?

Rochester Electronics is an authorized manufacturer of Xilinx legacy products, providing:

  • Continued production of discontinued components
  • Full specification compliance
  • Warranty and technical support
  • Long-term supply chain security

Can I use modern design tools?

Yes, the XC5215-5HQ208CO359 is supported by Xilinx ISE Design Suite and compatible with legacy design flows.

Conclusion

The XC5215-5HQ208CO359 FPGA represents a reliable, cost-effective solution for industrial programmable logic applications. With 1,936 logic cells, 23,000 equivalent gates, and robust 5V operation in a 208-pin HQFP package, this field-programmable gate array delivers the performance and flexibility required for demanding embedded systems.

Whether you’re maintaining legacy equipment, developing industrial control systems, or implementing custom digital logic, the XC5215-5HQ208CO359 provides a proven platform backed by comprehensive development tools and long-term availability through Rochester Electronics.

For procurement inquiries, technical specifications, or design support regarding the XC5215-5HQ208CO359 FPGA, consult authorized distributors or contact Rochester Electronics directly to ensure authentic components and optimal pricing for your volume requirements.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.