Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC5215-5BG225CO359 FPGA: High-Performance Field Programmable Gate Array Solution

Product Details

Overview of XC5215-5BG225CO359 Field Programmable Gate Array

The XC5215-5BG225CO359 is a professional-grade FPGA (Field Programmable Gate Array) from the renowned Xilinx XC5200 family, manufactured and distributed by Rochester Electronics, LLC. This powerful SRAM-based programmable logic device delivers exceptional performance for embedded systems, industrial automation, telecommunications, and custom digital circuit applications.

Key Technical Specifications

Parameter Specification
Part Number XC5215-5BG225CO359
Manufacturer Rochester Electronics, LLC (Xilinx Original Design)
Product Category Field Programmable Gate Arrays (FPGA)
Logic Cells 1,936 Logic Cells
System Gates 23,000 Gates
Operating Frequency Up to 83 MHz
Process Technology 0.5µm Three-Layer Metal CMOS
Supply Voltage 5V
Package Type BG225 (Ball Grid Array)
Total Pins 225 Pins
I/O Count 196 User I/O Pins
Operating Temperature Commercial Grade (0°C to 70°C)
Architecture SRAM-Based Reprogrammable

Advanced Features and Capabilities

VersaBlock Logic Module Architecture

The XC5215-5BG225CO359 incorporates Xilinx’s innovative VersaBlock logic architecture, providing designers with exceptional flexibility and performance. This advanced module structure enables efficient implementation of complex digital designs while maintaining optimal resource utilization.

High-Performance I/O Interface

Featuring the VersaRing I/O interface technology, this Xilinx FPGA delivers superior logic cell-to-I/O ratios with programmable output slew-rate control. This capability maximizes system performance while effectively reducing electromagnetic interference and signal noise.

Register-Rich Design

With 1,936 logic cells optimized for register and latch-intensive applications, the XC5215-5BG225CO359 excels in:

  • State machine implementations
  • Pipeline processing architectures
  • High-speed data buffering
  • Complex sequential logic designs

Technical Performance Characteristics

Logic Capacity and Configuration

Feature Details
Logic Cell Count 1,936 Configurable Logic Cells
Equivalent Gate Count 23,000 System Gates
CLB Configuration Optimized for Complex Logic Blocks
Flip-Flop Hold Time Zero hold time for input registers
Configuration Memory SRAM-Based (Volatile)
Reprogrammability Unlimited Configuration Cycles

Speed Grade and Timing

The “-5” speed grade designation indicates commercial-grade timing performance, offering:

  • Maximum toggle frequency: 83 MHz
  • Optimized propagation delays
  • Predictable timing characteristics
  • Reliable operation across temperature range

Package Details: BG225 Ball Grid Array

Physical Specifications

Attribute Value
Package Type PBGA (Plastic Ball Grid Array)
Pin Count 225 Pins
Body Size Compact footprint for space-constrained designs
Mounting Type Surface Mount Technology (SMT)
Thermal Characteristics Enhanced heat dissipation

Advantages of BG225 Package

  1. High Density: More I/O connections in smaller footprint
  2. Improved Signal Integrity: Shorter interconnect paths reduce parasitic effects
  3. Better Thermal Performance: Direct die attachment improves heat transfer
  4. Manufacturing Efficiency: Compatible with automated pick-and-place equipment

Design Support and Development Tools

Compatible Software Platforms

The XC5215-5BG225CO359 FPGA is fully supported by industry-standard development environments:

  • Xilinx ISE Design Suite: Complete implementation flow
  • VHDL Support: Hardware Description Language synthesis
  • Verilog HDL: Alternative HDL entry method
  • Schematic Capture: Graphical design entry
  • ABEL: Advanced Boolean Equation Language support

Design Entry Methods

Method Application
Schematic Capture Visual circuit design
VHDL Synthesis Text-based hardware description
Verilog HDL Alternative HDL methodology
ABEL Equation-based logic entry
Logic Synthesis Automated optimization from high-level descriptions

Application Areas

Industrial Automation and Control

The XC5215-5BG225CO359 excels in industrial environments requiring:

  • Motor control systems
  • Process automation controllers
  • Sensor interface circuits
  • Real-time data acquisition systems

Telecommunications Equipment

Ideal for communication infrastructure applications:

  • Protocol conversion interfaces
  • Digital signal processing
  • Network packet routing
  • Communication protocol implementations

Embedded Systems Development

Perfect for custom embedded solutions:

  • Custom peripheral interfaces
  • Application-specific processors
  • Hardware acceleration modules
  • System-on-Chip prototyping

Legacy System Support

As part of Rochester Electronics’ authorized continuation program:

  • Long-term availability guarantee
  • Exact replacement for original Xilinx parts
  • Support for existing deployed systems
  • Maintenance of legacy equipment

Comparison with Other XC5200 Family Members

Device Logic Cells System Gates Max I/O
XC5202 256 3,000 77
XC5204 466 5,000 117
XC5210 961 10,000 168
XC5215 1,936 23,000 196

Quality and Reliability

Manufacturing Standards

  • Process Technology: Advanced 0.5µm CMOS fabrication
  • Quality Assurance: Rigorous testing protocols
  • Authorized Source: Rochester Electronics authorized continuation
  • Traceability: Full manufacturing documentation

Reliability Features

  • Proven SRAM-based architecture
  • Extensive qualification testing
  • Industrial-grade reliability
  • Extended product lifecycle support

Ordering Information and Packaging

Part Number Breakdown

XC5215-5BG225CO359

  • XC5215: Device family and logic capacity
  • -5: Speed grade (commercial)
  • BG225: Package type and pin count
  • C: Commercial temperature range
  • O359: Rochester Electronics authorized continuation code

Available Package Options

Container Quantity Application
Tray Standard quantities Production manufacturing
Tube Small quantities Prototyping and development
Custom Special request Volume production orders

Design Considerations and Best Practices

Power Supply Requirements

  1. Core Voltage: 5V ±5% tolerance
  2. Power Decoupling: Multiple bypass capacitors recommended
  3. Power Sequencing: Follow Xilinx guidelines
  4. Thermal Management: Adequate cooling for high-utilization designs

Configuration and Programming

  • Configuration Modes: Master Serial, Slave Serial, Boundary Scan
  • Programming Interface: JTAG (IEEE 1149.1)
  • Configuration Time: Fast startup options available
  • Bitstream Security: Design protection features

PCB Layout Guidelines

  1. Place decoupling capacitors close to power pins
  2. Minimize trace lengths for high-speed signals
  3. Implement proper ground plane design
  4. Follow BGA routing best practices
  5. Ensure adequate thermal vias for heat dissipation

Frequently Asked Questions

Is the XC5215-5BG225CO359 RoHS compliant?

Contact Rochester Electronics for current compliance status as environmental regulations vary by region and application.

What is the difference between speed grades?

Speed grades (indicated by numbers like -5, -6) represent different timing performance levels. Lower numbers typically indicate faster performance specifications.

Can this FPGA be reprogrammed?

Yes, the XC5215-5BG225CO359 features SRAM-based configuration memory, allowing unlimited reprogramming cycles during development and field updates.

What development tools are required?

The Xilinx ISE Design Suite is the primary development environment, supporting multiple design entry methods including VHDL, Verilog, and schematic capture.

Is technical support available?

Rochester Electronics provides comprehensive technical support for their authorized continuation products, including datasheets, application notes, and design assistance.

Conclusion

The XC5215-5BG225CO359 FPGA represents a robust and reliable solution for embedded system designers requiring proven programmable logic technology. With its combination of substantial logic capacity (1,936 cells, 23K gates), versatile I/O capabilities (196 pins), and mature development tool support, this device serves applications ranging from industrial control to telecommunications infrastructure.

Rochester Electronics’ authorization ensures long-term product availability, making the XC5215-5BG225CO359 an excellent choice for both new designs and legacy system maintenance. The BG225 package provides optimal balance between I/O density and manufacturing convenience, while the 0.5µm CMOS process technology delivers reliable performance in demanding environments.

Whether you’re developing custom digital circuits, implementing complex state machines, or maintaining existing systems, the XC5215-5BG225CO359 FPGA offers the performance, flexibility, and long-term support needed for successful project completion.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.