Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC5210-6PQG208C: High-Performance FPGA for Industrial Applications | Complete Technical Guide

Product Details

Overview of XC5210-6PQG208C Field Programmable Gate Array

The XC5210-6PQG208C is a powerful field-programmable gate array (FPGA) from the renowned XC5200 family, originally manufactured by Xilinx (now AMD). This advanced programmable logic device offers exceptional flexibility and performance for a wide range of industrial, telecommunications, and embedded system applications. As part of the legacy Xilinx FPGA product line, the XC5210-6PQG208C continues to serve critical applications in existing designs and legacy system maintenance.

Key Features of XC5210-6PQG208C FPGA

The XC5210-6PQG208C FPGA delivers robust functionality through its advanced architecture:

  • 16,000 equivalent gates providing substantial logic capacity
  • 1,296 logic cells for complex digital design implementation
  • 208-pin PQFP package (Plastic Quad Flat Pack) for reliable board-level integration
  • 164 user I/O pins enabling extensive connectivity options
  • 5V operating voltage for compatibility with standard logic levels
  • 83 MHz maximum operating frequency for high-speed applications
  • 0.5µm CMOS process technology ensuring reliable performance
  • SRAM-based reprogrammable architecture allowing unlimited reconfiguration

Technical Specifications Table

Parameter Specification
Part Number XC5210-6PQG208C
Manufacturer Xilinx (AMD) / Rochester Electronics
Product Family XC5200 Series FPGA
Logic Gates 16,000 gates
Logic Cells 1,296 cells
User I/O Pins 164
Total Pin Count 208 pins
Package Type PQFP (Plastic Quad Flat Pack)
Operating Voltage 5V
Process Technology 0.5µm three-layer metal CMOS
Maximum Frequency 83 MHz
Operating Temperature Commercial (0°C to +70°C)
Programming Type SRAM-based (reprogrammable)

Pin Configuration and Package Details

Package Attribute Details
Package Style PQFP208 (Plastic Quad Flat Pack)
Pin Pitch Standard QFP pitch
Body Size 28mm x 28mm (typical)
Mounting Type Surface Mount Technology (SMT)
Lead Count 208
User I/O 164 programmable I/O pins
RoHS Compliance RoHS Compliant (Lead-free)

XC5210-6PQG208C Architecture and Design Capabilities

VersaBlock Logic Module Technology

The XC5210-6PQG208C incorporates Xilinx’s innovative VersaBlock architecture, which provides:

  • Register and latch-rich design for efficient state machine implementation
  • Flexible logic configuration supporting various design methodologies
  • Optimized interconnect hierarchy reducing routing congestion
  • Enhanced design flexibility for complex digital circuits

VersaRing I/O Interface

The advanced VersaRing I/O interface delivers:

  • High logic cell to I/O ratio maximizing design efficiency
  • Programmable output slew-rate control for signal integrity optimization
  • Zero flip-flop hold time for input registers simplifying system timing
  • Up to 244 I/O signals support (164 in the 208-pin package)

Application Areas for XC5210-6PQG208C

The XC5210-6PQG208C FPGA excels in diverse applications:

Industrial Control Systems

  • Process control and automation
  • Motor control applications
  • Industrial protocol interfaces
  • PLC (Programmable Logic Controller) implementations

Telecommunications Equipment

  • Protocol converters and adapters
  • Signal processing applications
  • Data acquisition systems
  • Communication interface modules

Embedded Systems

  • Custom logic implementation
  • Glue logic replacement
  • System prototyping
  • Legacy system maintenance

Consumer Electronics

  • Video processing circuits
  • Audio signal processing
  • Display controllers
  • Interface bridging

Design Support and Software Tools

Compatible Development Environments

The XC5210-6PQG208C FPGA is supported by industry-standard design tools:

Tool Category Supported Options
Design Entry ABEL, Schematic Capture, VHDL, Verilog HDL
Synthesis Tools Third-party synthesis tools compatible
Development Suite Xilinx ISE Foundation/Alliance software
Platform Support Windows and Unix workstations
Simulation ModelSim, Xilinx ISE Simulator

Design Methodology Support

  • HDL synthesis workflow for modern design entry
  • Schematic capture for traditional design approaches
  • Mixed design entry combining HDL and schematics
  • IP core integration for rapid development

Performance Characteristics

Timing Specifications

Parameter Value
Maximum Clock Frequency 83 MHz
Input Setup Time Speed grade dependent
Clock-to-Output Delay Speed grade dependent
Propagation Delay Low, optimized for performance

Power Consumption

The XC5210-6PQG208C operates efficiently with:

  • 5V single supply operation simplifying power design
  • CMOS technology for reduced static power consumption
  • Dynamic power scaling based on utilization
  • Power-efficient SRAM configuration cells

Ordering Information and Part Number Breakdown

Part Number Decoding: XC5210-6PQG208C

  • XC5210: Device family and gate count (10 = 10K gates nominal)
  • -6: Speed grade (6 = 83 MHz maximum frequency)
  • PQG: Package type (Plastic Quad Flat Pack, Gull-wing leads)
  • 208: Pin count
  • C: Commercial temperature range (0°C to +70°C)

Available Variants

Part Number Speed Grade Package Temperature Range
XC5210-6PQG208C -6 (83 MHz) PQFP-208 Commercial (0°C to +70°C)
XC5210-5PQG208C -5 (lower speed) PQFP-208 Commercial
XC5210-6PQG208I -6 (83 MHz) PQFP-208 Industrial (-40°C to +85°C)

Quality and Reliability Standards

Manufacturing Quality

  • Automotive-grade quality (when specified)
  • 100% electrical testing at final test
  • JEDEC standard compliance for thermal performance
  • ESD protection on all I/O pins
  • Latch-up immune CMOS design

Product Lifecycle Information

Important Note: The XC5210-6PQG208C is part of the legacy XC5200 FPGA family and is not recommended for new designs. This product is primarily available for:

  • Legacy system support and maintenance
  • Spare parts inventory for existing equipment
  • Design continuity for established products
  • Repair and replacement applications

Rochester Electronics serves as an authorized manufacturer continuing production for lifecycle management.

Comparison with Modern FPGA Alternatives

Feature XC5210-6PQG208C Modern FPGAs
Logic Capacity 16K gates 10K to 1M+ logic elements
Process Technology 0.5µm 7nm to 28nm
Operating Voltage 5V 1.0V to 3.3V
Power Consumption Higher Significantly lower
I/O Standards 5V TTL/CMOS LVDS, DDR, MIPI, etc.
Configuration SRAM (volatile) Flash or SRAM options

Programming and Configuration

Configuration Methods

The XC5210-6PQG208C supports multiple configuration modes:

  • Master Serial mode using external PROM
  • Slave Serial mode for multi-device chains
  • Master Parallel mode for fast configuration
  • Boundary Scan (JTAG) for programming and test

Configuration Memory

  • SRAM-based configuration requiring external storage
  • Unlimited reprogrammability for development flexibility
  • Fast configuration times for rapid system initialization
  • Bitstream security options available

Purchase Considerations for XC5210-6PQG208C

Availability and Sourcing

Given the legacy status of the XC5210-6PQG208C:

  • Rochester Electronics continues authorized manufacturing
  • Distributor stock available at select electronics suppliers
  • Lead times may vary based on production schedules
  • Minimum order quantities may apply for production runs

Pricing Factors

Pricing for XC5210-6PQG208C depends on:

  • Order quantity (volume discounts available)
  • Package type and speed grade
  • Temperature range specification
  • Distributor and region
  • Market availability and demand

Current market prices typically range from $27 to $80+ per unit depending on quantity and supplier.

Technical Support Resources

Documentation Available

  • XC5200 Family Datasheet (complete specifications)
  • User Guide and Application Notes
  • FPGA Editor documentation
  • Timing analysis guidelines
  • PCB layout recommendations

Design Resources

  • Reference designs for common applications
  • IP cores compatible with XC5200 architecture
  • Training materials for design methodology
  • Technical support through distributor channels

PCB Design Guidelines for XC5210-6PQG208C

Layout Recommendations

When designing PCBs with the XC5210-6PQG208C:

  1. Power supply decoupling: Place 0.1µF ceramic capacitors near each VCC pin
  2. Ground plane: Implement solid ground plane for signal integrity
  3. Thermal management: Ensure adequate airflow or heatsinking
  4. Signal routing: Follow high-speed design practices for critical signals
  5. Package footprint: Use manufacturer-recommended land patterns

Power Distribution Network

  • Multiple VCC and GND pins require parallel connections
  • Low-impedance power delivery essential for stable operation
  • Bulk decoupling capacitors (10µF-100µF) near device
  • Separate analog/digital grounds if mixed-signal design

Environmental and Compliance Information

Standard Compliance Status
RoHS Directive Compliant (Lead-free)
REACH Regulation Compliant
Conflict Minerals Compliant
WEEE Directive Compliant
Moisture Sensitivity Level MSL 3 (typical)

Frequently Asked Questions

Is the XC5210-6PQG208C suitable for new product designs?

No, the XC5210-6PQG208C is part of the legacy XC5200 family and is not recommended for new designs. Modern FPGA families offer superior performance, lower power consumption, and better features. This device should primarily be used for maintaining existing products or replacing components in legacy systems.

What is the difference between XC5210-6PQG208C and XC5210-6PQ208C?

The “G” designation in PQG typically indicates a specific package variant with gull-wing leads. Both refer to essentially the same device in a 208-pin PQFP package. Consult the manufacturer’s documentation for precise package specifications.

Can I program the XC5210-6PQG208C multiple times?

Yes, the XC5210-6PQG208C uses SRAM-based configuration technology, allowing unlimited reprogramming cycles. However, configuration data is volatile and lost when power is removed, requiring reconfiguration at each power-up.

What development tools do I need for XC5210-6PQG208C?

You’ll need Xilinx ISE Foundation or Alliance software (legacy versions), JTAG programming hardware, and appropriate design entry tools (VHDL/Verilog compiler or schematic capture software).

Conclusion: XC5210-6PQG208C for Reliable FPGA Solutions

The XC5210-6PQG208C represents proven FPGA technology from the established XC5200 family. While not recommended for new designs, this device remains valuable for legacy system support, offering 16,000 gates of programmable logic, 164 I/O pins, and robust 5V operation. Whether maintaining existing equipment or sourcing replacement components, the XC5210-6PQG208C continues to serve critical applications through authorized manufacturers like Rochester Electronics.

For new projects requiring similar functionality, consider modern Xilinx FPGA families that deliver enhanced performance, lower power consumption, and advanced features. The current AMD Xilinx portfolio offers superior alternatives with significantly improved capabilities for contemporary embedded and digital design challenges.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.