Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC4085XLA-09BG352I: Xilinx XC4000XLA FPGA – Complete Product Guide

Product Details

The XC4085XLA-09BG352I is a high-performance Field-Programmable Gate Array (FPGA) from Xilinx’s XC4000XLA family, now maintained under AMD’s Adaptive and Embedded Computing Group. Designed for complex, high-density logic applications, this device delivers 85,000 gates and operates at up to 227 MHz — making it a reliable choice for industrial, aerospace, and embedded systems design.

Whether you are sourcing legacy parts for system maintenance or evaluating it for a new application, this guide provides the complete specifications, electrical characteristics, and use-case information you need. For a full range of compatible programmable logic devices, visit our Xilinx FPGA catalog.


What Is the XC4085XLA-09BG352I?

The XC4085XLA-09BG352I belongs to the XC4000XLA/XV family, a series of high-capacity FPGAs built on a 0.35 µm CMOS process. The XC4000XLA generation was developed to combine architectural versatility, abundant routing resources, and high-speed logic — all within a 3.3V supply environment. It is distributed by Rochester Electronics LLC and is available as a tray-packaged component.

The part number breaks down as follows:

Part Number Segment Meaning
XC4085 Device family and gate count (85,000 gates)
XLA XC4000 Extended Low-power Architecture variant
-09 Speed grade (–9, supporting up to 227 MHz)
BG352 Package type (Ball Grid Array, 352 pins)
I Industrial temperature range

XC4085XLA-09BG352I Key Specifications

The table below summarizes the core electrical and physical specifications for the XC4085XLA-09BG352I.

Parameter Value
Manufacturer Xilinx (AMD)
Device Family XC4000XLA
Logic Gate Count 85,000 gates
Configurable Logic Blocks (CLBs) 7,448 cells
Maximum Operating Frequency 227 MHz
Process Technology 0.35 µm CMOS
Supply Voltage (VCC) 3.3V
Package 352-Pin BGA (Ball Grid Array)
Temperature Range Industrial (I)
Form Factor Tray
RoHS Compliance Not Compliant (legacy part)

XC4085XLA-09BG352I Electrical Characteristics

Supply Voltage and Power

The XC4085XLA-09BG352I operates from a single 3.3V VCC supply. Unlike some other XLA/XV devices that use separate VCCIO and VCCINT supplies, all I/O signalling on this device is supported via a unified 3.3V rail. This simplifies board-level power design while maintaining compatibility with a wide range of I/O standards.

I/O Standards Supported

I/O Standard Supported
5V TTL Yes
3.3V LVTTL Yes
PCI-Compatible Yes
Programmable Slew Rate Yes
Output Drive Strength 12 mA / 24 mA selectable

Clock Resources

The device includes eight global low-skew clock networks plus FastCLK buffers on the left and right die edges, each providing fast clock signals to I/O blocks within their respective octants. This ensures precise timing synchronization across all logic blocks and supports demanding, multi-clock designs.


XC4085XLA-09BG352I Architecture Overview

Configurable Logic Blocks (CLBs)

The CLB is the fundamental logic building unit. Each CLB in the XC4085XLA contains:

  • Two independent 4-input function generators (F and G)
  • Internal multiplexers for flexible signal routing
  • Edge-triggered flip-flops with set/reset support
  • On-chip dual-port and edge-triggered RAM capability

This architecture enables highly synthesis-compatible, versatile designs. Logic functions can be implemented without restriction, and the on-chip RAM support makes the device well-suited for embedded memory structures, FIFOs, and data buffering.

Routing Resources

The XC4085XLA uses a low-power segmented routing fabric with abundant interconnect paths. This gives designers flexibility in placement and routing and reduces the need for manual timing constraints in typical applications.

JTAG Boundary Scan

The device supports IEEE 1149.1 JTAG boundary scan, enabling in-system testing, fault isolation, and board-level diagnostics without physical probing. Configuration readback is also supported, which is valuable during prototyping and system verification. The part supports unlimited reprogramming.


XC4085XLA-09BG352I Package Information

Package Attribute Detail
Package Type Plastic BGA (Ball Grid Array)
Pin Count 352
Package Code BG352
Mounting Style Surface Mount (SMD)
Packaging Tray

The 352-pin BGA footprint provides a compact, high-density interconnect suitable for boards where space is at a premium. Designers integrating this device should ensure proper PCB design rules for BGA pad layout, solder mask, and via-in-pad considerations.


Applications of the XC4085XLA-09BG352I

The XC4085XLA-09BG352I has been widely deployed across demanding markets that require reliable, programmable logic:

Application Segment Typical Use Case
Industrial Automation Motor control, PLCs, sensor interfaces
Aerospace & Defense Signal processing, avionic bus interfaces
Enterprise Systems Data path logic, protocol bridging
Automotive (Hybrid/Powertrain) Embedded control logic
Communications Data framing, serialization, FIFO management

The combination of 85,000 logic gates, a fast –09 speed grade, and industrial temperature rating makes this part especially useful in environments requiring both performance and long-term availability.


Ordering and Availability

The XC4085XLA-09BG352I is classified as an obsolete/legacy part, distributed by Rochester Electronics LLC, which specializes in lifecycle management of end-of-life semiconductors. Buyers sourcing this component should verify stock availability and lead times with authorized distributors.

Ordering Detail Information
Manufacturer Part Number XC4085XLA-09BG352I
Distributor (DigiKey listing) Rochester Electronics LLC
Lifecycle Status Obsolete / Legacy
Alternate Part Numbers XC4085XLABG352-O9I
Packaging Tray

XC4085XLA-09BG352I vs. Related Variants

Xilinx offered the XC4085XLA in multiple packages and speed grades. The table below compares common variants to help you select the best fit for your application.

Part Number Speed Grade Package Pins Max Frequency
XC4085XLA-09BG352I –09 BGA 352 227 MHz
XC4085XLA-09BG432C –09 BGA 432 227 MHz
XC4085XLA-08BG432C –08 BGA 432 263 MHz
XC4085XLA-9HQ240C –9 QFP 240 227 MHz

The 352-pin BGA variant (this part) offers a balanced mix of I/O count and board footprint, while the 432-pin BGA variant provides additional I/O flexibility for more complex designs.


Design Tools and Software Support

The XC4085XLA-09BG352I is supported by legacy Xilinx design toolchains. Designers working with this device should use:

  • Xilinx ISE Design Suite (recommended for XC4000-series devices)
  • Alliance Series (legacy Xilinx implementation tools for the XC4000XLA family)

Note: The Xilinx Vivado Design Suite does not support legacy XC4000-series FPGAs. For new designs, consider migrating to a current-generation Xilinx FPGA platform, while using ISE for all work with the XC4085XLA-09BG352I.


Summary

The XC4085XLA-09BG352I is a proven, high-gate-count FPGA with strong logic density, flexible I/O standards, and robust clock distribution — designed for complex embedded applications in industrial and mission-critical environments. As a legacy device, it is primarily sourced through specialty distributors for system maintenance, board repair, and long-life production needs.

Feature Highlight
Gate Count 85,000
Speed Up to 227 MHz
Voltage 3.3V single supply
Package 352-pin BGA
Temperature Industrial
JTAG IEEE 1149.1 compliant
Reprogrammability Unlimited

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.