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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC4062XLA-9HQ240C: Xilinx XC4000XLA FPGA — Complete Specifications & Datasheet Guide

Product Details

The XC4062XLA-9HQ240C is a high-performance Field-Programmable Gate Array (FPGA) from Xilinx’s XC4000XLA family, housed in a 240-pin HSPQFP package. Designed for demanding logic integration tasks, this device delivers 62,000 gates of programmable logic capacity at 3.3V operation, making it a reliable choice for industrial, communications, and embedded system applications. Whether you are a hardware design engineer evaluating FPGA options or a procurement specialist sourcing this legacy component, this guide covers everything you need to know about the XC4062XLA-9HQ240C.


What Is the XC4062XLA-9HQ240C?

The XC4062XLA-9HQ240C belongs to Xilinx’s XC4000XLA/XV family — a mature, proven series of FPGAs built on 0.35-micron CMOS technology. The “XLA” suffix denotes the extended low-power variant of the XC4000 series, optimized for lower voltage (3.3V) and higher speed compared to earlier generations.

As a leading Xilinx FPGA solution for legacy and industrial designs, the XC4062XLA-9HQ240C continues to be specified in aerospace, defense, industrial automation, and communications hardware where design longevity and proven logic density are paramount.

Part Number Breakdown

Understanding the part number helps verify you are ordering the correct variant:

Segment Value Meaning
XC4062 XC4062 Device family & gate count (~62K gates)
XLA XLA Extended Low-power Architecture, 3.3V
-9 -9 Speed grade (9 ns max propagation delay)
HQ HQ Package type: Heat Sink Quad Flat Pack (HSPQFP)
240 240 Pin count: 240 pins
C C Temperature range: Commercial (0°C to +85°C)

XC4062XLA-9HQ240C Key Specifications

The table below summarizes the core electrical and physical specifications of the XC4062XLA-9HQ240C. These parameters are essential for design engineers performing component selection, board layout, and timing analysis.

Electrical & Logic Specifications

Parameter Value
FPGA Family XC4000XLA
Equivalent Gates 62,000
Configurable Logic Blocks (CLBs) 2,304
Logic Cells 5,472
Maximum Frequency 227 MHz
Supply Voltage (VCC) 3.3V
Process Technology 0.35 µm CMOS
I/O Standards Supported LVTTL, LVCMOS, PCI

Package & Mechanical Specifications

Parameter Value
Package Type HSPQFP (Heat Sink Plastic Quad Flat Pack)
Pin Count 240
Package Code HQ240
Operating Temperature 0°C to +85°C (Commercial)
Moisture Sensitivity Level MSL-compliant
RoHS Compliance Lead-Free / RoHS Compliant
Configuration Interface SelectMAP / Serial Slave / JTAG

Ordering Information

Attribute Detail
Manufacturer Xilinx (now AMD)
Part Number XC4062XLA-9HQ240C
Alternative P/N XC4062XLA-09HQ240C
Product Status End of Life / Legacy
Datasheet XC4000XLA/XV Family Datasheet (AMD/Xilinx)

XC4062XLA-9HQ240C Architecture and Features

H2: XC4000XLA Family Architecture Overview

The XC4000XLA family was Xilinx’s high-performance 3.3V generation designed to bridge the gap between earlier 5V FPGAs and the emerging low-voltage Virtex line. The XC4062XLA-9HQ240C inherits a robust architectural foundation with the following key elements:

Configurable Logic Blocks (CLBs): Each CLB in the XC4000XLA architecture contains two function generators (F and G), carry logic, and flip-flops. The 2,304 CLBs in the XC4062XLA-9HQ240C provide substantial logic density for complex combinational and sequential designs.

Dedicated Carry Logic: Hardened fast-carry chains enable efficient arithmetic operations such as adders, counters, and accumulators without consuming additional routing resources.

Distributed RAM: The function generators within each CLB can be configured as 16×1 synchronous RAM, enabling efficient on-chip data storage for FIFOs, buffers, and lookup tables.

Global Clocking: Four global clock buffers with low-skew routing networks support multi-clock domain designs. The device supports Delay-Locked Loops (DLLs) for clock deskewing and frequency synthesis.

Boundary Scan (JTAG): Full IEEE 1149.1 JTAG support is included for in-circuit testing, debugging, and configuration via the JTAG interface.

H3: I/O Capabilities and Pin Configuration

The 240-pin HSPQFP package provides a practical I/O count well-suited for medium-density designs. Key I/O features include:

I/O Feature Detail
Total User I/O Pins Up to 160 (typical, deducting config & power pins)
I/O Standards LVTTL 3.3V, LVCMOS 2.5V/3.3V
Output Drive Strength Programmable (2 mA to 24 mA)
Slew Rate Control Fast / Slow selectable per I/O
Pull-Up / Pull-Down Programmable on unused I/O pins
Input Delay Optional registered or combinational

H3: Configuration Modes

The XC4062XLA-9HQ240C supports multiple configuration modes, giving designers flexibility in system boot architecture:

Configuration Mode Description
Master Serial External serial PROM drives configuration data
Slave Serial Host controller provides configuration bitstream
Slave Parallel (SelectMAP) Byte-wide parallel interface for fast configuration
JTAG IEEE 1149.1 boundary-scan-based programming
Express Mode High-speed SelectMAP variant

Applications for the XC4062XLA-9HQ240C

The XC4062XLA-9HQ240C is suited for a wide range of application domains, particularly in systems that require proven, stable logic integration at 3.3V:

H3: Industrial and Embedded Automation

Industrial PLCs, motion controllers, and sensor fusion systems benefit from the XC4062XLA-9HQ240C’s deterministic timing and configurable I/O. The commercial temperature grade (0°C to +85°C) covers the vast majority of factory floor environments.

H3: Communications Infrastructure

Protocol bridges, serializer/deserializer (SerDes) glue logic, and frame processing engines for legacy telecom and datacom systems often rely on XC4000XLA devices where form-factor and PCB compatibility are constraints.

H3: Aerospace and Defense (Legacy Systems)

Many avionics and defense platforms were designed with XC4000XLA-series FPGAs in the 1990s and 2000s. The XC4062XLA-9HQ240C continues to be sourced for system maintenance, board repair, and life-extension programs.

H3: Test and Measurement Equipment

Flexible reconfigurable logic for signal routing, pattern generation, and data capture makes the XC4062XLA-9HQ240C a valuable component in oscilloscopes, logic analyzers, and ATE systems.


XC4062XLA-9HQ240C vs. Related Variants

Understanding the differences between the XC4062XLA-9HQ240C and closely related variants helps engineers and procurement teams identify correct substitutes or upgrades.

H3: Speed Grade Comparison

Part Number Speed Grade Max Frequency Temp Grade
XC4062XLA-7HQ240C -7 ~250 MHz Commercial
XC4062XLA-9HQ240C -9 227 MHz Commercial
XC4062XLA-09HQ240I -9 227 MHz Industrial (-40°C to +100°C)
XC4062XLA-09HQ240C -9 227 MHz Commercial

Note: XC4062XLA-9HQ240C and XC4062XLA-09HQ240C are the same device. The leading zero in the speed grade suffix is optional notation used by different distributors.

H3: Package Comparison for XC4062XLA

Part Number Package Pin Count Form Factor
XC4062XLA-9HQ240C HSPQFP 240 QFP (through-hole pads optional)
XC4062XLA-09BG352C BGA 352 Ball Grid Array
XC4062XLA-09BG432C BGA 432 Ball Grid Array
XC4062XLA-09BG560I BGA 560 Ball Grid Array

XC4062XLA-9HQ240C Design and Support Resources

Engineers working with the XC4062XLA-9HQ240C should reference the following official resources:

H3: Recommended Xilinx/AMD Documentation

Document Description
XC4000XLA/XV Family Datasheet Complete electrical specifications, timing parameters, and I/O standards
XC4000XLA/XV Pinout Tables Package pinout diagrams for HQ240 and all other packages
Foundation/ISE Design Software Legacy Xilinx design tools supporting XC4000XLA synthesis and place-and-route
JTAG Programming Guide Configuration procedures and boundary-scan test setup
XC4000XLA/XV Application Notes DLL usage, RAM inference, and advanced I/O configuration guides

H3: EDA & PCB Design Considerations

  • PCB Footprint: The HSPQFP-240 package requires a 0.5 mm or 0.65 mm pitch QFP land pattern. Verify the specific pitch (0.5 mm typical for HQ240) against the package specification before board layout.
  • Decoupling Capacitors: Place 100 nF ceramic decoupling capacitors within 2–3 mm of each VCC pin to minimize power supply noise.
  • Configuration Pull-Up Resistors: PROGRAM, INIT, and DONE pins typically require external pull-up resistors (4.7 kΩ to 10 kΩ) depending on the configuration mode.
  • JTAG Chain: The XC4062XLA-9HQ240C supports standard 4-wire JTAG (TCK, TMS, TDI, TDO). It can be daisy-chained with other JTAG-compliant devices.

Frequently Asked Questions

H3: Is the XC4062XLA-9HQ240C still in production?

No. The XC4062XLA-9HQ240C is an End-of-Life (EOL) component. Xilinx (AMD) discontinued production of the XC4000XLA family as the design community migrated to Spartan, Virtex, and later 7-Series FPGAs. The device remains widely available through authorized distributors and specialty component sourcing companies that stock legacy semiconductors.

H3: What is the difference between XC4062XLA-9HQ240C and XC4062XLA-09HQ240C?

These two part numbers refer to identical devices. The only difference is notational — some databases and distributors omit the leading zero in the speed grade, writing “-9” instead of “-09.” Both designations describe the same Xilinx XC4000XLA FPGA with a -9 speed grade, 240-pin HSPQFP package, and commercial temperature range.

H3: Can I replace the XC4062XLA-9HQ240C with a newer FPGA?

A direct pin-compatible drop-in replacement does not exist in current Xilinx (AMD) product lines because the HQ240 HSPQFP package was discontinued along with the XC4000XLA family. If a board redesign is feasible, functional migration to a Spartan-6 or Artix-7 family FPGA with a re-routed PCB is the recommended path forward.

H3: What design tools support the XC4062XLA-9HQ240C?

The XC4062XLA-9HQ240C is supported by legacy Xilinx Foundation Series and ISE Design Suite software (ISE 14.7 being the final version). Vivado, Xilinx’s current design suite, does not support the XC4000XLA family.


Summary

The XC4062XLA-9HQ240C is a 62,000-gate, 3.3V FPGA from Xilinx’s proven XC4000XLA family, packaged in a 240-pin HSPQFP. With 2,304 CLBs, 5,472 logic cells, and a maximum operating frequency of 227 MHz, it delivers reliable programmable logic performance for industrial, communications, and legacy embedded system designs. While now classified as an End-of-Life component, it remains an important part in maintenance and life-extension programs across numerous industries.

For design engineers sourcing this device or evaluating compatible alternatives, always confirm the exact part number suffix — particularly the speed grade (-9), package code (HQ240), and temperature grade (C for commercial) — to ensure proper fit for your application.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.