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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC4062XLA-09BG560I: Xilinx XC4000XLA FPGA – Full Specifications & Buying Guide

Product Details

The XC4062XLA-09BG560I is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s XC4000XLA/XV family. Designed for complex, high-density logic applications, this device combines reprogrammable SRAM-based architecture with a robust 560-pin BGA package, making it a reliable choice for industrial, telecom, and enterprise system designs. If you are sourcing a Xilinx FPGA for demanding embedded applications, the XC4062XLA-09BG560I delivers the logic capacity, I/O flexibility, and speed performance your design requires.


What Is the XC4062XLA-09BG560I?

The XC4062XLA-09BG560I belongs to Xilinx’s XC4000XLA family, which builds on the foundation of earlier XC4000E and XC4000XL series devices. The “XLA” designation indicates enhanced I/O capabilities, upgraded JTAG boundary scan functionality, and improved configuration logic compared to prior generations. This device is logically identical to XC4000EX and XC4000XL FPGAs but features notable architectural enhancements that improve performance and reliability in production-grade designs.

The part number breaks down as follows:

Segment Meaning
XC4062 Device family and logic density (approx. 40,000 gates)
XLA XC4000XLA enhanced I/O variant
-09 Speed grade (9 ns pin-to-pin logic delay)
BG560 Package type: Ball Grid Array, 560 pins
I Temperature range: Industrial (–40°C to +100°C)

XC4062XLA-09BG560I Key Specifications

Core Logic Resources

Parameter Value
Logic Gates (Typical) ~40,000
Configurable Logic Blocks (CLBs) 2,304
Flip-Flops / Registers 4,608
Maximum System Frequency 238 MHz
Technology Node 0.35 µm CMOS
Architecture SRAM-based reprogrammable

I/O and Package Information

Parameter Value
Package BGA (Ball Grid Array)
Total Pins 560
Maximum User I/O Pins ~448
I/O Standards Supported LVTTL, LVCMOS, PCI, GTL, SSTL
VersaRing I/O Interface Yes

Power Supply and Operating Conditions

Parameter Value
Core Supply Voltage (Vcc) 3.0V – 3.6V (nominal 3.3V)
I/O Voltage 3.3V
Operating Temperature (Industrial) –40°C to +100°C
Operating Temperature (Commercial) 0°C to +85°C

Configuration and Programming

Parameter Value
Configuration Mode SRAM (volatile, requires configuration at power-up)
JTAG Support IEEE 1149.1 Boundary Scan
Supported Design Entry ABEL, Schematic, VHDL, Verilog HDL
Supported EDA Tools Xilinx ISE, Foundation Series
Configuration Interfaces SelectMAP, Serial, JTAG

XC4062XLA-09BG560I Architecture Overview

VersaBlock Logic Module

The XC4062XLA-09BG560I uses Xilinx’s proprietary VersaBlock logic module as its core building block. Each VersaBlock includes look-up tables (LUTs) that can be configured as combinational logic, distributed RAM, or shift registers. This dual-purpose capability maximizes logic utilization and reduces the total device count needed in complex system designs.

VersaRing I/O Interface

The VersaRing architecture provides a programmable I/O ring around the core logic array. Each I/O block (IOB) contains both input and output flip-flops, programmable slew rate control, and optional input delay elements. This design enables the XC4062XLA-09BG560I to interface seamlessly with a wide range of external devices, buses, and memory systems without additional glue logic.

Interconnect Hierarchy

A rich multi-level interconnect hierarchy allows efficient routing of signals between logic blocks. The routing architecture includes:

  • Single-length lines for local connections between adjacent CLBs
  • Double-length lines for medium-range routing
  • Long lines spanning the full width or height of the device for global signal distribution
  • Global clock buffers for low-skew, high-fanout clock distribution

Why Choose the XC4062XLA-09BG560I?

High Logic Density

With 2,304 CLBs providing approximately 40,000 equivalent logic gates, the XC4062XLA-09BG560I handles complex state machines, DSP pipelines, communication controllers, and custom bus interfaces without requiring an external logic expander.

Industrial Temperature Grade

The “I” suffix confirms this is the industrial-grade variant, rated for operation from –40°C to +100°C. This makes it an ideal selection for applications deployed in harsh environments, outdoor enclosures, factory automation, or automotive-adjacent systems where commercial-grade components would fall short.

High-Speed Performance

The -09 speed grade delivers a pin-to-pin logic delay of 9 ns and supports system frequencies up to 238 MHz. This performance profile suits high-speed bus bridging, protocol conversion, and real-time signal processing workloads.

Large 560-Pin BGA Package

The BGA-560 package provides a high pin count in a compact footprint, supporting designs that require a large number of user I/O signals. The BGA mounting style also improves signal integrity compared to through-hole or leaded packages, which is critical for high-frequency designs on multi-layer PCBs.


Comparison: XC4062XLA vs. Related Devices

Part Number Gates CLBs Speed Grade Package Temp Grade
XC4062XLA-09BG560I ~40K 2,304 -09 BGA-560 Industrial
XC4062XLA-09BG432C ~40K 2,304 -09 BGA-432 Commercial
XC4085XLA-09BG560I ~85K 3,136 -09 BGA-560 Industrial
XC4062XL-09BG560I ~40K 2,304 -09 BGA-560 Industrial
XC4062XLA-09HQ240I ~40K 2,304 -09 PQFP-240 Industrial

Note: The XC4062XLA improves on the XC4062XL with enhanced I/O, improved JTAG, and better configuration logic, while maintaining full logical compatibility.


Supported Design Flows and Software Tools

Design Entry Methods

The XC4062XLA-09BG560I is fully supported by Xilinx’s legacy software environment, including:

  • Schematic Capture – for visual, hierarchical design entry
  • VHDL – for behavioral and structural hardware description
  • Verilog HDL – widely used in ASIC-style design flows
  • ABEL – for simple state machine and PLD-style designs

Synthesis and Implementation

Logic synthesis tools from Synopsys, Mentor Graphics, and Xilinx’s own Foundation and ISE suites fully support this family. The device is also compatible with third-party P&R (place-and-route) flows on popular workstation and PC platforms.

Simulation

Pre- and post-synthesis simulation is supported via standard VHDL and Verilog testbenches. Xilinx provides simulation models for timing verification at the -09 speed grade.


Typical Application Areas

The XC4062XLA-09BG560I is well-suited for a broad range of applications:

Application Area Use Case
Industrial Automation PLCs, motion controllers, sensor fusion
Telecommunications Framing, protocol conversion, line cards
Military & Aerospace Custom compute, signal processing (commercial grade required separately)
Enterprise Systems Custom ASICs replacement, bus bridging
Test & Measurement Pattern generators, data acquisition front ends
Embedded Computing Custom processor cores, co-processors

Ordering and Availability

The XC4062XLA-09BG560I is a legacy/discontinued Xilinx part. It is currently available through authorized distributors and specialty component brokers, including Rochester Electronics and similar long-tail component suppliers.

Ordering Information

Field Detail
Manufacturer Xilinx (now AMD)
Part Number XC4062XLA-09BG560I
Family XC4000XLA
Package 560-Pin BGA
Temperature Grade Industrial (–40°C to +100°C)
RoHS Status Not compliant (legacy part)
Lifecycle Status Discontinued / End of Life
Availability Specialty / long-tail distribution

Tip: When sourcing discontinued Xilinx FPGAs, always request traceability documentation and pre-shipment inspection (PSI) to reduce the risk of counterfeit components.


Frequently Asked Questions (FAQ)

What is the difference between XC4062XLA and XC4062XL?

The XC4062XLA enhances the earlier XC4062XL with improved I/O functionality (VersaRing), better JTAG boundary scan support, and upgraded configuration logic. Both devices share the same logical core architecture (CLBs, routing, RAM), making them largely pin- and function-compatible.

Is the XC4062XLA-09BG560I still in production?

No. This device is a discontinued, end-of-life part. It is only available through authorized component distributors and specialty excess-inventory suppliers. Lead times and pricing vary depending on stock levels.

What programming software do I need for the XC4062XLA-09BG560I?

This device is supported by Xilinx ISE Design Suite (legacy) and the Foundation Series tools. Modern Vivado does not support XC4000-family devices. You will need ISE 14.7 or an earlier version for synthesis, implementation, and bitstream generation.

Can the XC4062XLA-09BG560I be replaced by a newer Xilinx FPGA?

Yes, in new designs a modern Spartan-7 or Artix-7 device can typically replace XC4000-family FPGAs with higher performance and lower power consumption. However, direct pin- and bitstream-compatibility does not exist between families; a full redesign is required.

What does the “I” suffix mean in XC4062XLA-09BG560I?

The “I” indicates the industrial temperature grade, meaning the device is tested and specified for operation from –40°C to +100°C junction temperature, compared to the commercial grade (“C”) which is rated from 0°C to +85°C.


Summary

The XC4062XLA-09BG560I is a proven, high-capacity FPGA from Xilinx’s XC4000XLA family, offering 2,304 CLBs (~40,000 gates), a 560-pin BGA package, industrial temperature rating, and -09 speed grade performance. While discontinued, it remains in active use across industrial, telecom, and legacy defense platforms. Engineers maintaining or repairing systems built around this device can source it through specialty distributors, while new designs should consider migrating to modern Xilinx FPGA families for improved performance, lower power, and ongoing software support.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.