Overview of XC4062XLA-08BG560I Field Programmable Gate Array
The XC4062XLA-08BG560I is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s renowned XC4000XLA family. This industrial-grade programmable logic device delivers exceptional versatility and reliability for complex digital design applications. With 62,000 equivalent gates and 2,304 configurable logic blocks (CLBs), this Xilinx FPGA provides the perfect balance of functionality, performance, and cost-effectiveness for demanding embedded systems.
Built on proven 0.35-micron CMOS technology, the XC4062XLA-08BG560I combines advanced architectural features with robust industrial specifications, making it ideal for telecommunications, industrial automation, automotive electronics, and aerospace applications.
Key Features and Technical Specifications
Core Architecture Specifications
The XC4062XLA-08BG560I represents cutting-edge FPGA technology with comprehensive features designed for professional applications:
| Feature |
Specification |
| Device Family |
XC4000XLA Series |
| Logic Capacity |
62,000 equivalent gates |
| Configurable Logic Blocks (CLBs) |
2,304 CLBs |
| Total Logic Cells |
5,472 cells |
| Operating Voltage |
3.0V to 3.6V (3.3V nominal) |
| Speed Grade |
-08 (8ns) |
| Package Type |
BG560 (560-pin BGA) |
| Temperature Range |
-40°C to +100°C (Industrial) |
| Process Technology |
0.35μm CMOS |
Performance Characteristics
| Parameter |
Value |
| Maximum Operating Frequency |
227 MHz |
| System Gate Count |
Up to 62K gates |
| User I/O Pins |
384 maximum |
| Internal Flip-Flops |
4,608 |
| Distributed RAM |
Yes |
| Configuration Time |
Fast configuration mode supported |
Advanced FPGA Capabilities
VersaBlock Architecture
The XC4062XLA-08BG560I features Xilinx’s proprietary VersaBlock logic module architecture, providing:
- Flexible logic resources for efficient design implementation
- Enhanced routing capabilities with hierarchical interconnect structure
- Optimized CLB design supporting both combinatorial and sequential logic
- Embedded memory options through distributed RAM functionality
- Fast carry logic for arithmetic operations
I/O and Interface Features
| I/O Feature |
Description |
| I/O Standards Support |
TTL, CMOS, LVTTL, LVCMOS |
| Programmable I/O |
Individually configurable pins |
| Input Register |
Available on all I/Os |
| Output Register |
Available on all I/Os |
| Tri-State Capability |
Full tri-state buffer support |
| Pull-up/Pull-down |
Programmable weak pull-up resistors |
Package Information: BG560
BG560 Ball Grid Array Package Details
The BG560 package provides exceptional connectivity and thermal performance:
| Package Attribute |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array (BGA) |
| Total Pins |
560 balls |
| Package Dimensions |
27mm × 27mm |
| Ball Pitch |
1.27mm |
| Moisture Sensitivity Level |
MSL 3 |
| RoHS Compliant |
Yes (Lead-free available) |
| Mounting Type |
Surface Mount Technology (SMT) |
Thermal Characteristics
| Thermal Parameter |
Value |
| Junction-to-Ambient (θJA) |
~25°C/W (with airflow) |
| Junction-to-Case (θJC) |
~5°C/W |
| Maximum Junction Temperature |
125°C |
| Power Dissipation |
Application dependent |
Application Areas
Primary Applications
The XC4062XLA-08BG560I excels in numerous high-reliability applications:
- Telecommunications Equipment
- Digital signal processing
- Protocol conversion
- Line interface units
- Network switching systems
- Industrial Automation
- Motor control systems
- PLC replacement
- Machine vision processing
- Real-time control applications
- Automotive Electronics
- Engine management systems
- Advanced driver assistance systems (ADAS)
- Infotainment controllers
- Vehicle diagnostics
- Aerospace and Defense
- Avionics systems
- Radar signal processing
- Secure communications
- Mission-critical control systems
- Medical Equipment
- Diagnostic imaging
- Patient monitoring systems
- Laboratory instruments
- Portable medical devices
Design and Programming
Development Tool Support
| Tool Category |
Supported Tools |
| Design Entry |
VHDL, Verilog HDL, Schematic Capture, ABEL |
| Synthesis |
Xilinx Synthesis Technology (XST), Third-party tools |
| Implementation |
Xilinx ISE Design Suite |
| Simulation |
ModelSim, ISim, Third-party simulators |
| Programming |
JTAG, Slave Serial, Master Serial, SelectMAP |
Configuration Options
The XC4062XLA-08BG560I supports multiple configuration modes:
- Master Serial Mode – Direct configuration from serial PROM
- Slave Serial Mode – Configuration controlled by external processor
- Slave Parallel Mode – High-speed configuration option
- JTAG Boundary-Scan – IEEE 1149.1 compliant for testing and programming
Competitive Advantages
Why Choose XC4062XLA-08BG560I?
- Proven Reliability – Thousands of successful field deployments
- Industrial Temperature Rating – Operates reliably from -40°C to +100°C
- High Logic Density – 62,000 gates provide ample design capacity
- Flexible Architecture – Adaptable to diverse application requirements
- Comprehensive Tool Support – Mature, well-documented development ecosystem
- Cost-Effective Solution – Optimal price-performance ratio
- Long-Term Availability – Supported by Rochester Electronics and other authorized distributors
Quality and Compliance
Certifications and Standards
| Standard/Certification |
Status |
| RoHS Compliance |
Compliant |
| REACH Compliance |
Compliant |
| Conflict Minerals |
Compliant |
| ISO 9001 |
Manufactured under ISO 9001 quality system |
| ESD Sensitivity |
Class 1C (HBM), Class C4 (CDM) |
Power Consumption and Requirements
Power Supply Specifications
| Supply Rail |
Voltage Range |
Typical Current |
| VCCINT (Core) |
3.0V – 3.6V |
Design dependent |
| VCCO (I/O) |
2.5V – 3.6V |
Pin activity dependent |
| Standby Current |
N/A |
< 10mA |
Power Optimization Features
- Programmable slew rate control reduces ground bounce and EMI
- Selective I/O banking enables mixed-voltage interfaces
- Low-power design techniques supported by development tools
- Power-down modes for unused logic blocks
Ordering Information
Part Number Breakdown
XC4062XLA-08BG560I decodes as follows:
- XC4062 – Device type and gate count (62K gates)
- XLA – XC4000XLA family designation
- 08 – Speed grade (-08 = 8ns)
- BG560 – Package type (560-pin BGA)
- I – Industrial temperature range (-40°C to +100°C)
Available Speed Grades
| Speed Grade |
Maximum Delay |
Typical Applications |
| -09 |
9ns |
Cost-sensitive, lower-speed designs |
| -08 |
8ns |
Balanced performance applications |
| -07 |
7ns |
High-performance requirements |
Technical Support and Resources
Available Documentation
- Datasheet – Complete electrical and timing specifications
- User Guide – Comprehensive architectural overview
- Application Notes – Design guidelines and best practices
- Reference Designs – Example implementations
- PCB Layout Guidelines – BGA mounting recommendations
- Thermal Management Guide – Cooling and reliability information
Storage and Handling
Recommended Storage Conditions
| Parameter |
Specification |
| Storage Temperature |
-55°C to +150°C |
| Humidity |
< 90% RH non-condensing |
| ESD Protection |
Required – Class 1 ESD sensitive |
| Moisture Barrier Bag |
Recommended for long-term storage |
| Baking Before Reflow |
May be required per MSL 3 |
Comparison with Similar Devices
XC4000XLA Family Comparison
| Device |
Gates |
CLBs |
Max I/O |
Package Options |
| XC4036XLA |
36K |
1,296 |
288 |
BG352, BG432, HQ240 |
| XC4044XLA |
44K |
1,600 |
320 |
BG432, HQ240 |
| XC4062XLA |
62K |
2,304 |
384 |
BG432, BG560, HQ240 |
| XC4085XLA |
85K |
3,136 |
448 |
BG432, BG560, HQ304 |
Frequently Asked Questions
Q: Is the XC4062XLA-08BG560I still in production?
The XC4062XLA family has reached end-of-life from Xilinx (now AMD), but remains available through authorized distributors like Rochester Electronics who provide continued manufacturing and long-term support.
Q: What is the difference between -08 and -09 speed grades?
The -08 speed grade offers faster timing performance (8ns vs 9ns maximum delay), enabling higher operating frequencies for time-critical applications.
Q: Can this FPGA be reprogrammed in-circuit?
Yes, the XC4062XLA-08BG560I supports SRAM-based configuration and can be reprogrammed unlimited times via JTAG or other configuration modes.
Q: What development tools are required?
Xilinx ISE Design Suite (legacy version) is the primary development environment. Modern alternatives may require special license considerations.
Q: Is this device suitable for new designs?
While capable and reliable, designers should consider newer FPGA families (Artix-7, Spartan-7) for new projects requiring advanced features and longer availability.
Conclusion
The XC4062XLA-08BG560I represents a mature, reliable FPGA solution for industrial and embedded applications requiring robust performance in challenging environments. With its comprehensive feature set, industrial temperature rating, and proven track record, this Xilinx FPGA continues to serve critical applications across telecommunications, automotive, aerospace, and industrial sectors.
For applications requiring high logic density, flexible I/O configuration, and industrial-grade reliability, the XC4062XLA-08BG560I delivers exceptional value. Combined with extensive development tool support and continued long-term availability through authorized channels, this FPGA remains a viable choice for both legacy system maintenance and select new designs where its capabilities align with project requirements.
