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XC4028XLA-BC352AKP: Xilinx XC4000XLA Series FPGA – Complete Product Guide

Product Details

The XC4028XLA-BC352AKP is a high-performance field-programmable gate array (FPGA) from Xilinx’s XC4000XLA family. Designed for demanding digital logic applications, this device combines a large gate count with low-voltage operation and a versatile 352-pin BGA package. Whether you are working on telecommunications, industrial control, or embedded systems, the XC4028XLA-BC352AKP delivers the programmable logic resources needed for complex, production-grade designs. For a broader selection of compatible devices, explore our Xilinx FPGA inventory.


What Is the XC4028XLA-BC352AKP?

The XC4028XLA-BC352AKP is a member of the Xilinx XC4000XLA FPGA family — an enhanced, low-voltage variant of the classic XC4000 series. The “28” in the part number indicates approximately 28,000 usable logic gates, the “XLA” suffix denotes the low-voltage, high-speed process technology, and “BC352AKP” specifies the 352-ball BGA (Ball Grid Array) package with a commercial temperature rating.

This FPGA is ideal for engineers maintaining legacy designs or migrating older Xilinx-based systems, as well as those who require proven, stable logic devices for production applications.


XC4028XLA-BC352AKP Key Specifications

The table below summarizes the primary technical parameters of the XC4028XLA-BC352AKP:

Parameter Value
Manufacturer Xilinx (AMD)
Product Family XC4000XLA
Part Number XC4028XLA-BC352AKP
Logic Gates (Typical) ~28,000
Configurable Logic Blocks (CLBs) 784
Flip-Flops / Registers ~3,136
Maximum User I/O Pins Up to 246
Package Type BC352 (352-Ball BGA)
Package Body Size 27 × 27 mm
Supply Voltage (VCC) 2.5 V (XLA process)
Speed Grade Commercial
Temperature Range 0°C to +85°C (Commercial)
Technology SRAM-based, re-programmable
Configuration Interface SelectMAP, Serial, JTAG

XC4028XLA-BC352AKP Pin Configuration and Package Details

BGA Package Overview

The BC352 package is a 352-ball Ball Grid Array with a 1.27 mm ball pitch. BGA packaging offers significant board-space savings compared to equivalent QFP packages and provides excellent signal integrity at high frequencies.

Package Attribute Detail
Package Code BC352
Package Type Ball Grid Array (BGA)
Total Ball Count 352
Ball Pitch 1.27 mm
Body Dimensions 27 mm × 27 mm
PCB Land Pattern Standard BGA per JEDEC MO-151
Mounting Method Surface Mount Technology (SMT)
Soldering Profile Compatible with RoHS-compliant lead-free reflow

I/O Bank Structure

The XC4028XLA-BC352AKP organizes its I/O pins into multiple banks, each supporting independent I/O voltage levels. This multi-bank architecture enables designers to interface with 5 V TTL, 3.3 V LVTTL, and 2.5 V LVCMOS peripherals without external level-shifting logic.


XC4028XLA-BC352AKP Logic Resources

Configurable Logic Blocks (CLBs)

The heart of any Xilinx XC4000XLA FPGA is its Configurable Logic Block (CLB) array. Each CLB in the XC4028XLA contains:

  • Two 4-input function generators (Look-Up Tables, LUTs) capable of implementing any 4-input Boolean function
  • Additional dedicated carry logic for fast arithmetic operations
  • Two edge-triggered D flip-flops with dedicated clock enable and reset signals
  • Wide-function multiplexers for building larger logic functions efficiently
CLB Resource Per CLB Total (784 CLBs)
4-Input LUTs 2 1,568
Flip-Flops 2 ~3,136
Dedicated Carry Chains Yes Full array
Wide-AND Function Gates Yes Full array

Block RAM and Distributed RAM

The XC4000XLA architecture supports distributed RAM implemented directly within the CLB LUTs. This allows on-chip memory without consuming dedicated RAM blocks, which is particularly useful for small FIFOs, register files, and lookup tables in data-path designs.

Clock Resources

The XC4028XLA-BC352AKP includes dedicated global clock buffers and clock routing networks optimized for minimal skew across the entire device. This ensures reliable clocking for designs with multiple clock domains or tight setup-and-hold timing requirements.


Electrical Characteristics

Absolute Maximum Ratings

The table below lists the absolute maximum ratings. Exceeding these values may permanently damage the device.

Parameter Rating
Supply Voltage (VCC) –0.5 V to +3.0 V
Input Voltage (VI) –0.5 V to VCC + 0.5 V
Storage Temperature –65°C to +150°C
Junction Temperature (TJ) +125°C maximum

DC Operating Conditions

Parameter Minimum Typical Maximum Unit
Supply Voltage (VCC) 2.375 2.5 2.625 V
Input High Voltage (VIH) 2.0 VCC + 0.5 V
Input Low Voltage (VIL) –0.5 0.8 V
Output High Voltage (VOH) 2.4 V
Output Low Voltage (VOL) 0.4 V
Quiescent Current (ICCQ) 5 mA (typ.)

Configuration and Programming

Supported Configuration Modes

The XC4028XLA-BC352AKP supports multiple configuration interfaces, giving designers flexibility in how bitstream data is loaded into the device:

Mode Description Use Case
Master Serial FPGA controls clock; reads from serial PROM Simple single-device systems
Slave Serial External clock; cascadable for multi-device Daisy-chain multi-FPGA boards
SelectMAP (Parallel) 8-bit parallel bus interface Fast configuration from microcontroller
Boundary Scan (JTAG) IEEE 1149.1 JTAG for programming and test Debug, in-system programming

Configuration Memory

As an SRAM-based FPGA, the XC4028XLA-BC352AKP requires an external non-volatile configuration memory (such as a Xilinx XCFxxS Platform Flash or equivalent serial PROM). Configuration is loaded from this external memory at power-up. The SRAM cells are re-programmable an unlimited number of times, making iterative design and prototyping straightforward.


Timing and Performance

Speed Grade

The commercial-grade variant of the XC4028XLA is optimized for operation in a 0°C to +85°C ambient temperature range. Xilinx specified internal propagation delays using a standardized worst-case corner model.

Timing Parameter Typical Value
CLB-to-CLB Propagation Delay ~3–5 ns (speed grade dependent)
Internal Clock-to-Output (tCO) ~5–8 ns
Setup Time (tSU) ~2–4 ns
Global Clock Buffer Delay < 1 ns
Maximum Usable Frequency Up to ~80–100 MHz (design-dependent)

Note: Exact timing depends on the specific speed grade suffix. Consult the Xilinx XC4000XLA datasheet for precise timing specifications.


XC4028XLA-BC352AKP vs. Comparable Variants

The XC4000XLA family includes several members with varying gate counts and package options. The table below compares the XC4028XLA-BC352AKP to key family siblings:

Part Number Logic Gates CLBs Package Supply Voltage I/O Count
XC4013XLA ~13,000 338 Various 2.5 V Up to 192
XC4020XLA ~20,000 576 Various 2.5 V Up to 224
XC4028XLA-BC352AKP ~28,000 784 BC352 BGA 2.5 V Up to 246
XC4036XLA ~36,000 1,024 Various 2.5 V Up to 260
XC4062XLA ~62,000 1,936 Various 2.5 V Up to 320

Typical Applications

The XC4028XLA-BC352AKP is well-suited for a wide range of embedded and logic-intensive applications:

  • Telecommunications: Line card interface logic, framing, and protocol conversion
  • Industrial Automation: Motion control sequencing, sensor fusion, and machine safety logic
  • Medical Devices: Signal conditioning and data acquisition front-ends
  • Defense and Aerospace (commercial temp range): Avionics interface logic, radar signal processing
  • Prototyping and Legacy System Maintenance: Drop-in replacement for aging FPGA designs
  • Consumer Electronics: Video timing controllers and display interface logic

Design and Development Tools

Xilinx Foundation Series / ISE Design Suite

The XC4028XLA-BC352AKP is supported by the Xilinx ISE (Integrated Synthesis Environment) design suite. Engineers can use:

  • VHDL or Verilog for RTL design entry
  • Xilinx CORE Generator for optimized IP cores (FIFOs, multipliers, memory controllers)
  • FPGA Editor for placement and routing analysis
  • ChipScope Pro for in-system logic analysis via JTAG

Third-Party EDA Support

Tool Vendor Function
Synplify Pro Synopsys High-performance RTL synthesis
Precision RTL Mentor Graphics Synthesis with timing closure
ModelSim / QuestaSim Mentor Graphics RTL and gate-level simulation
Allegro / Cadence Cadence PCB layout and signal integrity

Ordering and Availability

Part Number Decoder

Understanding the full part number helps confirm you are ordering the correct variant:

Field Code Meaning
Family XC4028 XC4000XLA series, ~28K gates
Process XLA Low-voltage, advanced CMOS process
Package BC352 352-ball BGA, 27×27 mm
Temp / Grade AKP Commercial temperature (0°C to +85°C)

Compatible Replacement and Cross-Reference

Engineers maintaining legacy PCB designs may also encounter the following equivalent or compatible part numbers:

OEM Part Number Package Source
XC4028XLA-09BGG352C BG352 BGA Xilinx / Rochester Electronics
XC4028XLA-BC352AKP BC352 BGA Xilinx / Distributors

Note: Always verify pin-out and timing equivalence before substituting parts in production designs.


PCB Design Recommendations

Decoupling and Power Integrity

Proper power supply decoupling is critical for FPGA reliability. Recommended practice for the XC4028XLA-BC352AKP:

  • Place 100 nF ceramic capacitors (X7R, 0402 or 0603) within 2 mm of each VCC ball
  • Add 10 µF bulk capacitors per power plane to suppress low-frequency transients
  • Use a dedicated 2.5 V power plane with low-impedance routing to all VCC balls
  • Maintain separate GND return planes for core and I/O supplies

Signal Integrity

  • Route high-speed I/O signals as 50 Ω controlled-impedance traces
  • Keep clock traces short and matched in length for multi-clock designs
  • Avoid routing signals under the BGA device if vias are present (use HDI design rules for dense boards)

Frequently Asked Questions (FAQ)

Q: What is the difference between XC4028XLA and XC4028XL? The XLA suffix denotes an enhanced version of the XC4028XL with improved speed grades and lower power consumption at 2.5 V supply, compared to the XL variant’s 3.3 V operation.

Q: Is the XC4028XLA-BC352AKP RoHS compliant? Availability of RoHS-compliant versions depends on the manufacturing date code. Contact your distributor to confirm RoHS status for your specific lot.

Q: Can I program the XC4028XLA-BC352AKP with Xilinx ISE 14.7? Yes. Xilinx ISE 14.7 is the last version of ISE and provides full support for the XC4000XLA device family, including the XC4028XLA.

Q: What is the pin-out compatibility between BC352 and BGG352 packages? The BC352 and BGG352 are both 352-ball BGA packages but may have different ball pitch or array dimensions. Always verify against the Xilinx package pinout file before assuming compatibility.


Summary

The XC4028XLA-BC352AKP is a reliable, mid-range FPGA from Xilinx’s proven XC4000XLA family, offering approximately 28,000 logic gates in a compact 352-ball BGA package. Its 2.5 V supply, versatile I/O banks, multi-mode configuration support, and extensive EDA tool compatibility make it a strong choice for both new embedded logic designs and legacy system maintenance. With 784 CLBs, dedicated carry chains, and flexible clocking resources, this device handles everything from simple glue logic to complex state machines and arithmetic data paths.

For procurement assistance or to browse additional Xilinx programmable logic devices, contact our sales team or visit our online store.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.