The XC4028XLA-09BGG352C is a high-performance field-programmable gate array (FPGA) from the Xilinx XC4000XLA family, distributed by Rochester Electronics. With 28,000 gates, 2,432 logic cells, and a 352-pin BGA package, this device is a proven solution for complex digital design applications requiring high gate density and reliable 3.3V operation. If you’re sourcing legacy Xilinx FPGA components for maintenance, repair, or continued production of established systems, this part number is a trusted choice backed by one of the industry’s most respected authorized distributors.
What Is the XC4028XLA-09BGG352C?
The XC4028XLA-09BGG352C belongs to Xilinx’s XC4000XLA/XV FPGA family — a generation of programmable logic devices renowned for architectural flexibility, abundant routing resources, and automated implementation support. The “09” speed grade indicates a 9 ns propagation delay, while the “BGG352C” suffix identifies the 352-ball fine-pitch BGA package in commercial temperature range.
This device was manufactured using Xilinx’s advanced 0.35µm CMOS process and operates at 3.3V core voltage, making it compatible with a wide range of legacy digital system designs developed in the late 1990s and 2000s.
Key Specifications at a Glance
| Parameter |
Value |
| Manufacturer |
Xilinx (AMD) / Distributed by Rochester Electronics |
| Part Number |
XC4028XLA-09BGG352C |
| FPGA Family |
XC4000XLA |
| Gate Count |
28,000 Gates |
| Logic Cells |
2,432 Cells |
| Maximum Frequency |
227 MHz |
| Supply Voltage |
3.3V |
| Technology Node |
0.35µm CMOS |
| Package Type |
352-Pin Fine-Pitch BGA (FBGA) |
| Package Code |
LBGA / FBGG352 |
| Package Shape |
Square |
| Terminal Type |
Ball (BGA) |
| Number of Terminals |
352 |
| Temperature Grade |
Commercial (C) – 0°C to +85°C |
| RoHS Compliance |
Not RoHS Compliant |
| Product Status |
Not Recommended for New Designs (NRND) |
| Distributor |
Rochester Electronics, LLC |
XC4028XLA-09BGG352C Part Number Decoder
Understanding the part number helps engineers and procurement teams verify the correct component for their application.
| Segment |
Code |
Meaning |
| Device Family |
XC4028XLA |
Xilinx XC4000XLA, 28K Gates |
| Speed Grade |
-09 |
9 ns propagation delay |
| Package Code |
BGG |
Fine-Pitch Ball Grid Array |
| Pin Count |
352 |
352 ball terminals |
| Temperature |
C |
Commercial (0°C to +85°C) |
XC4000XLA Family Overview
Architecture & Logic Resources
The XC4000XLA family was designed to deliver maximum flexibility and density for mid-range programmable logic applications. The XC4028XLA integrates a rich set of on-chip resources that enable designers to implement complex logic functions without sacrificing timing performance.
Core Logic Features
| Feature |
Description |
| Logic Cells |
2,432 configurable logic cells |
| Flip-Flops |
Dedicated D flip-flops per cell |
| LUT Architecture |
4-input function generators per CLB |
| CLB Array |
Regular, tile-based array for predictable routing |
| Carry Logic |
Dedicated fast carry chain for arithmetic |
| Wide Function Support |
Wide multiplexers and decoders |
I/O and Routing Resources
| Resource |
Specification |
| Maximum User I/Os |
Up to 224 (package-dependent) |
| I/O Standards |
TTL, LVTTL, CMOS 3.3V compatible |
| Global Clock Networks |
4 dedicated global clock buffers |
| Routing Architecture |
Hierarchical, switch matrix-based |
| Dedicated RAM |
On-chip distributed RAM support |
Performance Characteristics
Speed and Timing
The “-09” speed grade on the XC4028XLA-09BGG352C indicates a maximum system clock frequency support up to 227 MHz under optimal conditions. The device’s dedicated carry chains and fast routing matrix ensure predictable timing closure for registered designs.
| Timing Parameter |
Value |
| Maximum Clock Frequency |
227 MHz |
| Propagation Delay (tpd) |
9 ns |
| Clock-to-Output (tco) |
Optimized for synchronous designs |
| Setup Time (ts) |
Specified in Xilinx XC4000XLA datasheet |
Power Characteristics
| Parameter |
Typical Value |
| Core Supply Voltage (VCC) |
3.3V |
| I/O Supply Voltage |
3.3V (LVCMOS compatible) |
| Operating Technology |
0.35µm CMOS (low power by era standards) |
| Standby Current |
Low quiescent current characteristic of CMOS |
Package Details: 352-Pin BGA (BGG352)
The BGG352 package is a square fine-pitch ball grid array, offering a compact footprint with a high pin count — ideal for dense PCB designs where through-hole or leaded packages are impractical.
| Package Attribute |
Detail |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Total Balls |
352 |
| Package Shape |
Square |
| Mounting Type |
Surface Mount (SMD) |
| Ball Pitch |
Fine pitch |
| Package Code |
BGG / LBGA |
| Moisture Sensitivity |
Per JEDEC standards (verify with distributor) |
Operating Conditions
Absolute Maximum Ratings
| Parameter |
Rating |
| Supply Voltage (VCC) |
–0.5V to +4.0V |
| Input Voltage |
–0.5V to VCC + 0.5V |
| Storage Temperature |
–65°C to +150°C |
| Junction Temperature |
+125°C (Commercial Grade) |
Recommended Operating Conditions
| Parameter |
Min |
Typical |
Max |
| VCC (Core) |
3.0V |
3.3V |
3.6V |
| Ambient Temperature (TA) |
0°C |
25°C |
85°C |
| Input High Voltage (VIH) |
2.0V |
— |
VCC + 0.5V |
| Input Low Voltage (VIL) |
–0.5V |
— |
0.8V |
Applications and Use Cases
Where Is the XC4028XLA-09BGG352C Used?
The XC4028XLA-09BGG352C is primarily relevant in maintenance, repair, and continued production scenarios for systems originally designed in the late 1990s and early 2000s. Its 28K gates and 352-pin BGA make it suitable for:
| Application Area |
Description |
| Industrial Control Systems |
Legacy PLC and motion control logic replacement |
| Telecommunications Equipment |
Line card and framing logic for SDH/SONET systems |
| Military & Defense (MIL) |
Long-lifecycle programs requiring legacy parts |
| Medical Instrumentation |
FDA-cleared legacy device maintenance |
| Aerospace Systems |
Avionics and satellite ground equipment support |
| Test & Measurement |
Legacy ATE (Automatic Test Equipment) support |
| Communications Infrastructure |
Network switching and routing hardware |
Rochester Electronics: Authorized Source for Legacy Xilinx FPGAs
The XC4028XLA-09BGG352C listed on DigiKey is distributed by Rochester Electronics, a globally recognized authorized source for end-of-life (EOL) and long-lifecycle semiconductor components. Rochester Electronics sources its inventory through authorized channels, ensuring that every device meets original manufacturer specifications.
| Rochester Electronics Advantage |
Description |
| Authorized Distributor |
Sourced directly from original manufacturer inventory |
| Anti-Counterfeiting |
Full traceability and authentication |
| Long-Term Supply |
Stocks EOL components for decades |
| Certifications |
AS9120B and ISO 9001:2015 certified |
| Support for Legacy Programs |
Ideal for defense, aerospace, and industrial OEMs |
Ordering Information and Variants
XC4028XLA Speed Grade Comparison
| Part Number |
Speed Grade |
Max Frequency |
Package |
| XC4028XLA-08BGG352C |
-08 |
Faster (8ns) |
352-Pin BGA |
| XC4028XLA-09BGG352C |
-09 |
227 MHz |
352-Pin BGA |
| XC4028XLA-09BGG256C |
-09 |
227 MHz |
256-Pin BGA |
| XC4028XLA-09HQ160C |
-09 |
227 MHz |
160-Pin TQFP |
| XC4028XLA-09HQ240C |
-09 |
227 MHz |
240-Pin TQFP |
Commercial vs. Industrial Temperature
| Suffix |
Temperature Range |
Use Case |
| C (Commercial) |
0°C to +85°C |
Standard commercial electronics |
| I (Industrial) |
–40°C to +100°C |
Harsh environment / industrial |
Design and Development Considerations
Software and Programming Tools
The XC4028XLA-09BGG352C is supported by Xilinx’s legacy Foundation Series and ISE Design Suite software tools. Engineers maintaining existing designs should note:
- JTAG boundary scan is supported for in-system programming and debugging
- Configuration can be performed via JTAG, Master Serial, or Slave Parallel modes
- Bitstream files generated for the XC4028XLA family are compatible with legacy ISE project flows
- Third-party EDA tools (Synopsys, Mentor Graphics) support the XC4000XLA family
PCB Design Guidelines
When designing or reworking a PCB for the BGG352 package:
| Design Parameter |
Recommendation |
| Ball Pitch |
Verify with package drawing (fine-pitch BGA) |
| Via Strategy |
Via-in-pad or dog-bone fanout recommended |
| Power Decoupling |
100nF ceramic caps at each VCC/GND pair |
| Signal Integrity |
Length-match critical clock and data buses |
| Soldering Profile |
Lead-free or leaded per board assembly spec |
Frequently Asked Questions (FAQ)
Q: Is the XC4028XLA-09BGG352C still in production? A: No. This part is classified as “Not Recommended for New Designs” (NRND). It is available through authorized distributors like Rochester Electronics for legacy system support.
Q: What is the difference between XC4028XLA-09BGG352C and XC4028XLA-09BGG352I? A: The “C” suffix indicates a commercial temperature range (0°C to +85°C), while the “I” suffix indicates an industrial temperature range (–40°C to +100°C).
Q: Can I replace XC4028XLA-09BGG352C with a newer Xilinx FPGA? A: Migration to a newer device like a Xilinx Spartan-6 or Artix-7 is architecturally possible but requires a full redesign and re-verification of the logic. For drop-in replacement in fielded hardware, like-for-like sourcing through Rochester Electronics is the recommended approach.
Q: Is this device RoHS compliant? A: No. The XC4028XLA-09BGG352C is not RoHS compliant. Applications requiring RoHS compliance should verify with the distributor about available compliant variants.
Q: What configuration modes does the XC4028XLA support? A: The XC4028XLA supports Master Serial, Slave Serial, Master Parallel (Byte-Wide), Slave Parallel, and Peripheral Bus (Byte-Wide) configuration modes, plus JTAG (IEEE 1149.1).
Summary
The XC4028XLA-09BGG352C is a well-established, high-gate-density FPGA from Xilinx’s proven XC4000XLA family. With 28,000 gates, 2,432 logic cells, 227 MHz maximum frequency, and a 352-pin BGA footprint, it delivers the logic capacity and I/O flexibility required for demanding legacy digital designs. Sourced exclusively through Rochester Electronics — a certified authorized distributor — this component provides engineers and procurement teams with verified, traceable supply for critical end-of-life system support applications in industrial, telecommunications, defense, and aerospace markets.
