Overview of XC3SD3400A-4FGG676C FPGA
The XC3SD3400A-4FGG676C is a Field Programmable Gate Array from the Spartan-3A DSP Family, featuring 3.4 million gates and 53,712 cells operating at 667MHz. This advanced FPGA solution, manufactured using 90nm technology with 1.2V operation in a 676-pin FBGA package, delivers exceptional performance for digital signal processing applications.
Key Technical Specifications
Core Architecture Features
| Specification |
Details |
| Logic Cells |
53,712 cells |
| System Gates |
3.4 Million gates |
| CLBs (Configurable Logic Blocks) |
5,968 CLBs |
| Operating Frequency |
667 MHz maximum |
| Speed Grade |
-4 (Standard) |
| Technology Node |
90nm CMOS |
| Supply Voltage |
1.2V core |
| Package Type |
676-Pin FBGA (Fine-Pitch Ball Grid Array) |
| I/O Count |
469 user I/Os |
DSP Performance Specifications
| Feature |
Specification |
| DSP Slices |
Integrated XtremeDSP™ slices |
| Pipeline Stages |
Enhanced performance at 250+ MHz |
| Accumulator |
48-bit for MAC operations |
| Block RAM Speed |
280+ MHz registered outputs |
Advanced DSP Capabilities
XtremeDSP Slice Features
The XC3SD3400A-4FGG676C incorporates powerful DSP processing blocks optimized for demanding signal processing tasks:
- Enhanced Pipeline Architecture: Pipeline stages deliver enhanced performance of at least 250 MHz in the standard -4 speed grade
- Multiply-Accumulate Operations: 48-bit accumulator designed for MAC operations
- Complex Mathematics: Integrated adder enables complex multiply or multiply-add operations
- High-Speed Memory Interface: Registered outputs on block RAM operate at least 280 MHz in the -4 speed grade
Memory and Storage Architecture
Block RAM Configuration
| Memory Feature |
Specification |
| Block RAM Blocks |
Distributed dual-port RAM |
| RAM Operating Speed |
280+ MHz with registered outputs |
| Configuration Options |
Single/dual port configurations |
| Data Width |
Flexible width configurations |
Distributed RAM Resources
The device provides extensive distributed RAM capabilities for creating fast, small memory structures directly within the logic fabric, ideal for FIFOs, shift registers, and lookup tables.
I/O and Interface Capabilities
Differential I/O Standards
The XC3SD3400A-4FGG676C supports multiple high-speed differential signaling standards:
- LVDS (Low-Voltage Differential Signaling): LVDS, RSDS, mini-LVDS, HSTL/SSTL differential I/O with integrated differential termination resistors
- Source-Synchronous Interfaces: Optimized for DDR, DDR2 memory interfaces
- Flexible I/O Standards: Support for multiple single-ended and differential standards
Clock Management System
| Clock Resource |
Capability |
| Global Clock Networks |
8 low-skew global clocks |
| Regional Clocks |
8 additional clocks per half device |
| DCM (Digital Clock Manager) |
Multiple DCMs for clock synthesis |
| Clock Routing |
Abundant low-skew routing resources |
Eight low-skew global clock networks and eight additional clocks per half device provide flexible timing solutions, enabling complex multi-clock domain designs.
Power Management Features
Intelligent Power Design
- Dual-Range VCCAUX: Dual-range VCCAUX supply simplifies 3.3V-only design implementations
- Core Voltage: 1.2V optimized for performance and power efficiency
- I/O Voltage Options: Flexible I/O banking supports multiple voltage standards
- Power Optimization: Advanced clock gating and power management
Target Applications
Communications and Networking
The XC3SD3400A-4FGG676C excels in telecommunications infrastructure, including base station signal processing, software-defined radio, and network packet processing applications.
Industrial Automation
Perfect for motor control, machine vision systems, and real-time control applications requiring high-speed DSP operations and multiple I/O interfaces.
Medical Imaging
Ideal for ultrasound processing, CT scan reconstruction, and digital X-ray systems where parallel processing and high-speed computations are essential.
Test and Measurement
Suitable for oscilloscopes, spectrum analyzers, and signal generators requiring flexible DSP capabilities and high-speed data acquisition.
Video and Image Processing
Optimal for video encoding/decoding, image enhancement, computer vision, and broadcast equipment applications.
Development and Programming
Design Tools Compatibility
| Tool Suite |
Compatibility |
| Vivado Design Suite |
Latest versions supported |
| ISE Design Suite |
Full support for legacy designs |
| Programming Languages |
VHDL, Verilog, System Verilog |
| High-Level Synthesis |
C/C++ to RTL conversion |
Configuration Options
- Multiple Configuration Modes: Master/Slave Serial, JTAG, SelectMAP
- Configuration Memory: External SPI Flash, Platform Flash
- Partial Reconfiguration: Dynamic reconfiguration capabilities
- Security Features: Bitstream encryption support
Package and Reliability
FBGA Package Details
| Package Attribute |
Value |
| Pin Count |
676 pins |
| Package Type |
Fine-Pitch Ball Grid Array |
| Body Size |
27mm x 27mm (nominal) |
| Ball Pitch |
1.0mm |
| Thermal Performance |
Enhanced thermal characteristics |
Quality and Reliability
- RoHS Compliant: Lead-free package materials
- Operating Temperature: Industrial grade options available
- MTBF Rating: High reliability for mission-critical applications
- Testing Standards: Meets automotive and industrial quality standards
Why Choose the XC3SD3400A-4FGG676C?
Performance Advantages
This FPGA delivers exceptional DSP performance with dedicated hardware accelerators, making it superior to general-purpose FPGAs for signal processing applications. The -4 speed grade ensures maximum performance for time-critical designs.
Cost-Effective Solution
The Spartan-3A DSP family provides an optimal balance between features and cost, offering professional-grade DSP capabilities at competitive pricing for volume production.
Proven Technology
Built on mature 90nm technology, this device offers excellent yield, reliability, and supply chain stability for long-term production designs.
Design Flexibility
With 469 I/Os and extensive logic resources, designers can implement complex systems-on-chip, integrating multiple functions into a single device.
Xilinx FPGA Product Family Overview
The XC3SD3400A-4FGG676C belongs to the renowned Xilinx Spartan-3A DSP FPGA family, which combines the low-cost advantages of the Spartan-3A architecture with integrated DSP48A slices for superior signal processing performance. This family bridges the gap between pure logic FPGAs and dedicated DSP processors, offering the flexibility of programmable logic with the efficiency of hardened DSP blocks.
Comparison with Related Products
Within Spartan-3A DSP Family
| Device |
Gates |
Cells |
CLBs |
DSP Slices |
I/Os |
| XC3SD1800A |
1.8M |
37,440 |
4,160 |
84 |
519 |
| XC3SD3400A |
3.4M |
53,712 |
5,968 |
126 |
469 |
Competitive Advantages
Compared to similar devices from other manufacturers, the XC3SD3400A offers superior DSP density, more flexible I/O standards, and mature development tools with extensive IP library support.
Ordering and Availability
Part Number Breakdown
XC3SD3400A-4FGG676C
- XC3SD3400A: Device family and size
- -4: Speed grade (standard performance)
- FGG676: Package type (676-pin FBGA)
- C: Commercial temperature range (0°C to +85°C)
Package Variants
Additional package options are available in the Spartan-3A DSP 3400A family, including smaller pin counts for designs with fewer I/O requirements.
Technical Support and Resources
Documentation
- Complete datasheets with AC/DC specifications
- Application notes for DSP implementation
- Reference designs and IP cores
- PCB design guidelines for FBGA packages
Design Examples
Xilinx provides extensive reference designs including:
- FIR/IIR filter implementations
- FFT/IFFT processors
- Video processing pipelines
- Communication protocol implementations
Conclusion
The XC3SD3400A-4FGG676C represents an excellent choice for engineers developing DSP-intensive applications requiring high performance, reliability, and cost-effectiveness. Its combination of logic resources, dedicated DSP blocks, high I/O count, and mature development tools makes it suitable for a wide range of industrial, communications, and consumer applications.
With its proven 90nm technology, extensive support ecosystem, and competitive pricing, this FPGA enables designers to bring innovative products to market quickly while maintaining excellent performance and reliability standards.
