Contact Sales & After-Sales Service

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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC3SD3400A-7FGG676I: High-Performance Spartan-3A DSP FPGA for Advanced Digital Signal Processing Applications

Product Details

Product Overview: XC3SD3400A-7FGG676I FPGA

The XC3SD3400A-7FGG676I is a cutting-edge Field Programmable Gate Array (FPGA) from AMD’s (formerly Xilinx) renowned Spartan-3A DSP family, specifically engineered for demanding digital signal processing applications. This industrial-grade FPGA combines exceptional performance with cost-effectiveness, making it the ideal choice for telecommunications, embedded systems, automotive electronics, and industrial control applications.

As part of the Spartan-3A DSP series, the XC3SD3400A-7FGG676I delivers superior DSP capabilities while maintaining the flexibility and reprogrammability that distinguishes Xilinx FPGA solutions from traditional ASICs.

Technical Specifications

Core Architecture Specifications

Parameter Specification
Product Family Spartan-3A DSP FPGA
Part Number XC3SD3400A-7FGG676I
System Gates 3.4 Million gates
Logic Cells 53,712 cells
Configurable Logic Blocks (CLBs) 5,968 CLBs
Speed Grade -7 (highest performance)
Maximum Operating Frequency Up to 770 MHz
Process Technology 90nm CMOS technology
Core Voltage 1.2V

Package Details

Specification Value
Package Type FBGA (Fine-pitch Ball Grid Array)
Pin Count 676 pins
Package Code FGG676
Temperature Range Industrial Grade: -40°C to +100°C
Moisture Sensitivity Level MSL 3

DSP Resources and Memory Architecture

Feature Specification
XtremeDSP DSP48A Slices 126 slices @ 250 MHz
Dedicated 18×18 Multipliers 126 multipliers
Block RAM Up to 2,268 Kbits with byte write enables
Distributed RAM Up to 373 Kbits
Block RAM Performance 280 MHz (minimum)
48-bit Accumulator Integrated MAC operation support

I/O and Connectivity Features

Parameter Details
User I/O Pins Up to 519 I/O pins
Differential Signal Pairs Up to 227 pairs
Supported I/O Standards LVTTL, LVCMOS (3.3V, 2.5V, 1.8V, 1.5V, 1.2V), HSTL, SSTL, Differential standards
SelectIO Technology Multi-voltage, multi-standard interface
Digital Clock Managers (DCMs) Advanced clocking resources

Key Features and Benefits

Advanced DSP Performance

The XC3SD3400A-7FGG676I excels in digital signal processing applications with its dedicated hardware multipliers and DSP slices. The 250 MHz XtremeDSP DSP48A slices provide:

  • High-speed 18×18 multipliers for efficient signal processing
  • 48-bit accumulator for multiply-accumulate (MAC) operations
  • Integrated pre-adder for complex mathematical operations
  • Cascaded multiply capability for enhanced performance
  • Pipeline stages enabling operation at 250 MHz+ in standard speed grades

Memory Architecture Excellence

The hierarchical SelectRAM memory system offers:

  • Fast block RAM with up to 2,268 Kbits capacity
  • Byte-write enables optimized for processor applications
  • Distributed RAM providing up to 373 Kbits of efficient storage
  • Registered outputs on block RAM for improved timing
  • Dual-port capability for concurrent read/write operations

Power Management Features

Advanced power optimization ensures efficiency across applications:

  • Dual-range VCCAUX supply simplifying 3.3V-only designs
  • Suspend mode for reduced system power consumption
  • Hibernate mode for ultra-low power standby
  • Low-power option reducing quiescent current
  • Intelligent clock gating for dynamic power management

Flexible I/O Capabilities

The multi-voltage SelectIO interface provides:

  • Maximum flexibility with support for multiple I/O standards
  • High-speed differential signaling capabilities
  • Single-ended and differential I/O configurations
  • On-chip termination for signal integrity
  • Programmable drive strength and slew rate control

Application Areas

Telecommunications and Networking

The XC3SD3400A-7FGG676I excels in:

  • Wireless base stations requiring high-speed DSP
  • Software-defined radio (SDR) implementations
  • Network packet processing and routing
  • 5G/LTE signal processing applications
  • Voice over IP (VoIP) systems

Industrial and Automotive

Ideal for demanding industrial applications:

  • Motor control systems with precise PWM generation
  • Industrial automation and control systems
  • Automotive infotainment systems
  • Advanced driver assistance systems (ADAS)
  • Industrial imaging and machine vision

Medical and Scientific Instrumentation

Perfect for precision instruments:

  • Medical imaging equipment (ultrasound, CT, MRI)
  • Laboratory test equipment
  • Signal analysis instruments
  • Data acquisition systems
  • Spectroscopy equipment

Audio and Video Processing

Optimized for multimedia applications:

  • Video encoding/decoding systems
  • Audio DSP processing
  • Broadcast equipment
  • Professional audio mixers
  • Digital video recorders (DVR)

Development Tools and Software Support

Design Software

The XC3SD3400A-7FGG676I is supported by comprehensive development tools:

  • Vivado Design Suite: Modern synthesis and implementation toolchain
  • ISE Design Suite: Legacy support for existing designs
  • IP Core Library: Pre-verified intellectual property blocks
  • System Generator for DSP: MATLAB/Simulink integration
  • ChipScope Pro: Real-time debugging and analysis

Programming and Configuration

Multiple configuration options available:

  • JTAG programming for development and debugging
  • SelectMAP interface for fast configuration
  • Serial configuration modes (SPI, BPI)
  • Partial reconfiguration support
  • Multi-boot capability for redundancy

Comparison with Related Models

Speed Grade Variants

Model Speed Grade Max Frequency Application Focus
XC3SD3400A-7FGG676I -7 770 MHz Highest performance
XC3SD3400A-5FGG676I -5 700 MHz Balanced performance
XC3SD3400A-4FGG676I -4 667 MHz Cost-optimized

Package Options

The XC3SD3400A family offers multiple package choices:

  • FGG676 (676-pin FBGA): Maximum I/O capability
  • CSG484 (484-pin csBGA): Compact footprint
  • CG484 (484-pin ceramic): High-reliability applications

Quality and Reliability

Manufacturing Standards

The XC3SD3400A-7FGG676I meets stringent quality requirements:

  • RoHS compliant for environmental compliance
  • Pb-free assembly following industry standards
  • ISO 9001 certified manufacturing facilities
  • Automotive-grade options available (AEC-Q100)
  • Extended temperature range variants for harsh environments

Testing and Validation

Comprehensive testing ensures reliability:

  • 100% factory functional testing
  • Temperature and voltage characterization
  • Signal integrity verification
  • Long-term reliability testing
  • Qualification to JESD standards

Ordering Information

Part Number Breakdown

XC3SD3400A-7FGG676I decodes as:

  • XC3S = Spartan-3A family
  • D3400 = 3.4M system gates with DSP
  • A = Automotive/Advanced features
  • -7 = Speed grade (highest performance)
  • FGG676 = 676-pin FBGA package
  • I = Industrial temperature range (-40°C to +100°C)

Availability and Distribution

The XC3SD3400A-7FGG676I is available through:

  • Authorized AMD/Xilinx distributors
  • Global semiconductor marketplaces
  • Franchise distributors worldwide
  • Direct from manufacturer (volume orders)

Design Considerations

PCB Layout Guidelines

Critical design factors for optimal performance:

  • Power supply decoupling: Multiple bypass capacitors near power pins
  • Ground plane integrity: Solid ground planes for noise reduction
  • Signal routing: Matched impedance for high-speed signals
  • Thermal management: Adequate heat dissipation provisions
  • Configuration interface: Clean, noise-free configuration signals

Power Supply Requirements

Proper power delivery ensures reliable operation:

  • VCCINT (1.2V): Core logic power supply
  • VCCAUX (2.5V or 3.3V): Auxiliary circuitry supply
  • VCCO (1.2V to 3.3V): I/O bank power supplies
  • Power sequencing: Follow recommended power-up sequence
  • Decoupling strategy: Per datasheet recommendations

Documentation and Support Resources

Technical Documentation

Comprehensive documentation available:

  • Product Datasheet: Complete electrical and timing specifications
  • User Guide: Detailed architecture and feature descriptions
  • Application Notes: Design tips and best practices
  • PCB Design Guide: Layout and routing recommendations
  • Packaging and Pinout: Mechanical drawings and pin assignments

Community and Support

Access extensive support resources:

  • AMD Support Portal: Technical documentation and downloads
  • Community Forums: User discussions and solutions
  • Application Engineers: Direct technical support
  • Training Programs: Online and in-person courses
  • Design Services: Partner ecosystem for development assistance

Why Choose the XC3SD3400A-7FGG676I?

Performance Advantages

The -7 speed grade delivers:

  • Maximum operating frequency of 770 MHz
  • Fastest logic propagation delays in the family
  • Critical path optimization for timing-critical designs
  • Enhanced DSP performance for demanding applications
  • Superior timing margins for reliable operation

Cost-Effectiveness

Compared to alternative solutions:

  • Lower NRE costs vs. ASIC development
  • Rapid prototyping reduces time-to-market
  • Field upgradability extends product lifecycle
  • Single design supports multiple product variants
  • Volume pricing competitive with alternative technologies

Ecosystem Benefits

Comprehensive development ecosystem:

  • Mature toolchain with extensive optimization capabilities
  • Large IP library accelerates development
  • Broad third-party support from tools to IP vendors
  • Active community for knowledge sharing
  • Long-term availability ensures product longevity

Frequently Asked Questions

What is the difference between speed grades?

Speed grades (-4, -5, -7) indicate maximum operating frequency. The -7 grade offers the highest performance but typically at a premium price. Choose based on your timing requirements.

Is the XC3SD3400A-7FGG676I RoHS compliant?

Yes, this device meets RoHS requirements for lead-free assembly and environmentally responsible manufacturing.

What development boards support this FPGA?

Several evaluation platforms support the Spartan-3A DSP family, including Xilinx starter kits and third-party development boards featuring similar devices.

Can I upgrade from a lower speed grade?

Yes, devices are pin-compatible within the same package. You can upgrade from -4 or -5 to -7 grade for improved performance without board changes.

What software do I need to develop with this FPGA?

The ISE Design Suite or Vivado Design Suite (for newer workflows) provides complete development capabilities. Both are available from AMD/Xilinx.

Conclusion

The XC3SD3400A-7FGG676I represents the pinnacle of performance in the Spartan-3A DSP FPGA family. With its combination of 3.4 million system gates, 126 dedicated DSP slices, extensive memory resources, and the highest -7 speed grade, this FPGA delivers exceptional performance for demanding digital signal processing applications.

Whether you’re developing telecommunications equipment, industrial control systems, medical instrumentation, or multimedia processing solutions, the XC3SD3400A-7FGG676I provides the processing power, flexibility, and reliability your application demands. Its comprehensive development ecosystem, proven reliability, and cost-effective solution make it an excellent choice for engineers seeking high-performance FPGA capabilities.

For more information about Xilinx FPGA solutions and to explore the complete Spartan-3A DSP family, visit our comprehensive Xilinx FPGA resource center.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.