Overview of XC3SD3400A-6FGG676C FPGA
The XC3SD3400A-6FGG676C is a powerful Field-Programmable Gate Array (FPGA) from AMD’s (formerly Xilinx) Spartan-3A DSP family, designed specifically for high-volume, cost-sensitive, and high-performance digital signal processing applications. This advanced FPGA combines exceptional processing capabilities with energy efficiency, making it an ideal solution for modern embedded systems.
Key Features and Specifications
Core Architecture Specifications
| Specification |
Details |
| Logic Elements/Cells |
53,712 cells |
| System Gates |
3.4 Million gates |
| Number of LABs/CLBs |
5,968 |
| Total RAM Bits |
2,322,432 bits |
| Number of I/O Pins |
469 I/O |
| Operating Frequency |
Up to 770 MHz |
| Process Technology |
90nm CMOS |
Electrical and Physical Characteristics
| Parameter |
Value |
| Supply Voltage |
1.14V – 1.26V (1.2V nominal) |
| Package Type |
676-Pin FBGA (Fine-Pitch Ball Grid Array) |
| Package Dimensions |
27mm × 27mm |
| Speed Grade |
-6 (Commercial) |
| Operating Temperature |
0°C to +85°C (TJ) |
| Mounting Type |
Surface Mount Technology (SMT) |
Advanced DSP Capabilities
The XC3SD3400A-6FGG676C incorporates XtremeDSP DSP48A slices, which are specifically optimized for demanding digital signal processing tasks:
- Enhanced multiply-accumulate operations
- High-speed data processing at 250 MHz (standard -4 speed grade)
- Optimized for filtering, FFT, and complex arithmetic operations
- Based on proven Virtex-4 DSP48 block architecture
Technical Performance Benefits
Memory Architecture Excellence
The XC3SD3400A-6FGG676C features an advanced block RAM configuration with enhanced performance characteristics:
- Increased memory-per-logic ratio compared to standard Spartan-3A devices
- Fast output registers for improved timing closure
- Dual-port memory configurations for simultaneous read/write operations
- Ideal for buffer management, lookup tables, and data storage
Speed and Efficiency
With its -6 speed grade designation, this FPGA delivers:
- Maximum operating frequency of 770 MHz
- Reduced propagation delays for time-critical paths
- Enhanced setup and hold time margins
- Optimized for high-throughput data processing applications
Primary Application Markets
Consumer Electronics
The XC3SD3400A-6FGG676C excels in consumer applications requiring cost-effective DSP performance:
- Digital Television (DTV) – Video processing, format conversion, scaling
- DVD Players – Decoding, audio processing, user interface control
- Home Networking – Packet processing, protocol handling, data routing
- Display/Projection Systems – Image enhancement, color correction, scaling
Industrial and Communications
- Broadband access equipment
- Wireless infrastructure
- Industrial automation and control
- Medical imaging systems
- Test and measurement instruments
Why Choose XC3SD3400A-6FGG676C Over ASICs?
Cost Advantages
| Benefit |
Description |
| No NRE Costs |
Eliminate expensive mask sets and fabrication setup fees |
| Faster Time-to-Market |
Reduced development cycles from months to weeks |
| Flexible Updates |
Field-programmable for design revisions without hardware changes |
| Lower Risk |
Prototype and validate before volume production |
Design Flexibility
The FPGA architecture allows:
- In-system reprogramming capabilities
- Design iteration without physical hardware modifications
- Easy bug fixes and feature enhancements post-deployment
- Adaptability to changing specifications and standards
Programming and Development Support
Compatible Development Tools
The XC3SD3400A-6FGG676C is supported by industry-standard design tools:
- Xilinx ISE Design Suite – Legacy support for Spartan-3A DSP devices
- Vivado Design Suite – Modern development environment with advanced features
- IP Core Libraries – Pre-verified DSP, memory, and interface IP blocks
- Simulation Tools – ModelSim, ISim, and third-party simulators
Configuration Options
Multiple programming interfaces are supported:
- JTAG boundary-scan programming
- SelectMAP parallel configuration
- Serial peripheral interface (SPI)
- Master/slave serial modes
Package and Reliability Information
676-FBGA Package Benefits
The fine-pitch ball grid array package provides:
- Excellent thermal performance for heat dissipation
- High pin-count density in compact footprint
- Reliable solder ball connections for industrial environments
- RoHS compliant options available
Quality and Standards
- Manufactured using proven 90nm process technology
- Comprehensive production testing and quality assurance
- Extended temperature range options for harsh environments
- Long-term product availability commitment
Integration with Xilinx FPGA Ecosystem
As part of the comprehensive Xilinx FPGA portfolio, the XC3SD3400A-6FGG676C benefits from:
- Extensive documentation and application notes
- Active developer community and technical forums
- Proven IP core library compatibility
- Migration path to higher-performance device families
- Consistent toolchain and development methodology
Ordering Information and Availability
Part Number Breakdown
XC3SD3400A-6FGG676C decodes as:
- XC3S – Spartan-3 family
- D – DSP-optimized variant
- 3400A – 3.4M gate density, automotive-grade
- -6 – Speed grade (commercial temperature)
- FGG676 – 676-pin Fine-pitch BGA package
- C – Commercial temperature range (0°C to +85°C)
Competitive Advantages Summary
| Feature |
Advantage |
| High Gate Density |
3.4M gates for complex designs |
| DSP Optimization |
Dedicated XtremeDSP slices for signal processing |
| Memory Rich |
2.3+ Mbit of block RAM |
| Cost-Effective |
Best price/performance in its class |
| Proven Technology |
Mature 90nm process for reliability |
| Extensive I/O |
469 user I/O pins for connectivity |
Power Management Features
The XC3SD3400A-6FGG676C incorporates several power-saving technologies:
- Low static power consumption in idle states
- Dynamic power scaling based on utilization
- Clock gating for unused logic blocks
- Optimized routing for reduced switching power
- Multiple voltage domains for power optimization
Thermal Considerations
Heat Dissipation Guidelines
For optimal performance of the XC3SD3400A-6FGG676C:
- Recommended heatsink attachment for high-utilization applications
- Thermal interface material (TIM) for improved heat transfer
- Adequate PCB copper pour for thermal spreading
- Consideration of airflow in enclosure design
- Junction temperature monitoring for reliability
Design Best Practices
Signal Integrity Recommendations
To maximize XC3SD3400A-6FGG676C performance:
- Implement proper power supply decoupling with multiple capacitor values
- Use controlled impedance traces for high-speed signals
- Maintain adequate ground plane coverage
- Follow manufacturer’s PCB layout guidelines
- Consider EMI/EMC requirements in board design
Configuration and Debugging
- Provide accessible JTAG headers for programming and debugging
- Include configuration mode selection circuitry
- Implement proper power sequencing
- Add status LEDs for visual feedback
- Consider configuration memory backup options
Comparison with Similar Devices
XC3SD3400A vs XC3SD1800A
| Specification |
XC3SD3400A |
XC3SD1800A |
| Logic Cells |
53,712 |
37,440 |
| System Gates |
3.4M |
1.8M |
| Total RAM |
2.3 Mbit |
Lower capacity |
| Application Fit |
Complex DSP systems |
Mid-range applications |
Frequently Asked Questions
What makes the -6 speed grade different?
The -6 speed grade offers faster propagation delays and higher maximum operating frequencies compared to slower grades, making it ideal for timing-critical applications.
Is this FPGA suitable for industrial temperature ranges?
The XC3SD3400A-6FGG676C is specified for commercial temperature (0°C to +85°C). Industrial temperature variants are available with different suffix codes.
Can I migrate from older Spartan-3 devices?
Yes, the Spartan-3A DSP family maintains compatibility with Spartan-3 pinouts and development tools, facilitating easy migration.
Conclusion
The XC3SD3400A-6FGG676C represents an excellent choice for engineers seeking a balance of high performance, cost-effectiveness, and DSP optimization. With 3.4 million system gates, dedicated DSP resources, and extensive I/O capabilities in a compact 676-pin FBGA package, this FPGA delivers exceptional value for demanding digital signal processing applications. Whether you’re designing broadcast equipment, industrial control systems, or consumer electronics, the XC3SD3400A-6FGG676C provides the flexibility and performance required for successful product development.
For detailed technical specifications, development resources, and the latest availability information, consult authorized AMD/Xilinx distributors and explore the comprehensive Xilinx FPGA product family.
