Overview of XC3SD3400A-5CSG484C FPGA
The XC3SD3400A-5CSG484C is a powerful field-programmable gate array from the Spartan-3A DSP family, engineered by Xilinx (now AMD). This advanced FPGA delivers exceptional digital signal processing capabilities with 3.4 million system gates and 53,712 configurable logic cells, making it an ideal solution for demanding embedded applications in telecommunications, industrial automation, and digital signal processing systems.
Key Technical Specifications
Core Architecture Features
| Specification |
Value |
| FPGA Family |
Spartan-3A DSP Series |
| System Gates |
3.4 Million Gates |
| Logic Cells |
53,712 Configurable Cells |
| Maximum Frequency |
770 MHz Operating Frequency |
| Process Technology |
Advanced 90nm Manufacturing |
| Core Voltage |
1.2V (1.14V – 1.26V Range) |
| Speed Grade |
-5 (High Performance) |
Package and I/O Specifications
| Feature |
Description |
| Package Type |
484-Pin LCSBGA (Low-profile Chip Scale BGA) |
| Package Dimensions |
19mm x 19mm |
| User I/O Pins |
309 Available I/O |
| Mounting Type |
Surface Mount Technology (SMT) |
| Operating Temperature |
Commercial (0°C to +85°C) |
| Data Transfer Rate |
Up to 622 Mb/s per I/O |
Memory and DSP Resources
| Resource Type |
Capacity |
| Total Block RAM |
Up to 1,872 Kbits |
| Total RAM Bits |
2,322,432 Bits |
| LABs/CLBs |
5,968 Logic Array Blocks |
| Dedicated Multipliers |
18 x 18 Multipliers for DSP Operations |
| Distributed RAM |
Up to 520 Kbits |
Advanced Features and Capabilities
Digital Signal Processing Performance
The XC3SD3400A-5CSG484C excels in high-speed digital signal processing applications. With dedicated 18×18 multipliers and abundant logic resources, this FPGA handles complex mathematical operations efficiently. The 770 MHz maximum operating frequency ensures rapid data processing for real-time applications in telecommunications and industrial control systems.
Flexible I/O Standards Support
This Spartan-3A DSP FPGA supports an extensive range of signaling standards:
- 17 Single-Ended Standards: Including LVTTL, LVCMOS variants (3.3V, 2.5V, 1.8V, 1.5V, 1.2V)
- 7 Differential Standards: LVDS, mini-LVDS, RSDS, PPDS, BLVDS, and differential HSTL
- Digitally Controlled Impedance: Built-in termination for signal integrity
- DDR Support: Double Data Rate capability for high-bandwidth interfaces
- Voltage Range: 1.14V to 3.45V signal swing compatibility
Power Efficiency and Thermal Management
Built on 90nm process technology, the XC3SD3400A-5CSG484C delivers high performance while maintaining reasonable power consumption. The three-rail power architecture provides:
- Core power rail at 1.2V for logic operations
- Flexible I/O power rails (1.2V to 3.3V) for interface compatibility
- Auxiliary power rail at 2.5V for specialized functions
Target Applications
Industrial Automation and Control
The robust architecture and high-speed processing make this Xilinx FPGA perfect for industrial control systems requiring real-time data processing, motor control, and sensor interfacing.
Telecommunications Infrastructure
With 622 Mb/s data transfer rates and extensive I/O capabilities, the XC3SD3400A-5CSG484C supports:
- Digital signal processing for communications
- Protocol conversion and data routing
- High-speed serial interfaces
- Network processing applications
Embedded System Development
The flexible architecture enables rapid prototyping and deployment in:
- Medical imaging and diagnostic equipment
- Automotive electronic control units
- Military and aerospace systems
- Test and measurement instrumentation
Development and Integration
Compatible Development Tools
This FPGA integrates seamlessly with Xilinx ISE Design Suite and related development environments, providing:
- Comprehensive synthesis and implementation tools
- Advanced timing analysis and optimization
- Built-in debugging capabilities with ChipScope
- JTAG programming interface (IEEE 1149.1/1532 compliant)
Design Resources
| Resource |
Details |
| Look-Up Tables (LUTs) |
Flexible 4-input LUTs with shift register capability |
| Carry Logic |
Fast look-ahead carry for arithmetic operations |
| Multiplexers |
Wide multiplexer structures for data routing |
| Clock Management |
Multiple clock domains and clock management tiles |
Product Lifecycle and Availability
Important Notice: The XC3SD3400A-5CSG484C is currently in Last Time Buy (LTB) phase, indicating end-of-life status. While the device continues to serve critical applications where specific features and pin compatibility are essential, customers planning new designs should consider current-generation FPGA families.
Ordering Information Breakdown
Part Number: XC3SD3400A-5CSG484C
- XC3SD3400A: Device family and gate count designation
- -5: Speed grade (high-performance variant)
- CSG484: Package type (Chip Scale Grid array, 484 pins)
- C: Commercial temperature range (0°C to +85°C)
Performance Comparison
Speed Grade Differences
| Speed Grade |
Maximum Frequency |
Performance Level |
| -4 |
667 MHz |
Standard Performance |
| -5 |
770 MHz |
High Performance (This Model) |
Logic Density Comparison
| Device Model |
System Gates |
Logic Cells |
| XC3S700A |
700K |
13,248 |
| XC3S1400A |
1.4M |
25,344 |
| XC3SD1800A |
1.8M |
37,440 |
| XC3SD3400A |
3.4M |
53,712 |
Technical Advantages
High-Performance Computing
The -5 speed grade designation indicates premium performance characteristics, delivering 770 MHz operation for time-critical applications. This high-speed capability combined with extensive logic resources enables implementation of complex algorithms without external processing requirements.
Comprehensive Connectivity
With 309 user I/O pins and support for multiple signaling standards, the XC3SD3400A-5CSG484C provides exceptional connectivity options. The Digitally Controlled Impedance (DCI) feature ensures signal integrity across various interface standards without external termination components.
Memory Hierarchy Optimization
The hierarchical memory architecture combines distributed RAM within logic cells and dedicated block RAM resources, allowing designers to optimize memory placement for performance and resource utilization.
Design Considerations
Thermal Management Requirements
Operating within the commercial temperature range (0°C to +85°C), designers should implement appropriate thermal management:
- Adequate PCB copper planes for heat dissipation
- Thermal vias connecting to ground planes
- Consider ambient operating conditions
- Monitor junction temperature during operation
Power Supply Design
The three-rail power architecture requires careful power supply design:
- Core Supply (VCCINT): 1.2V ±5% tolerance, high current capability
- I/O Supply (VCCO): Configurable per I/O bank (1.2V to 3.3V)
- Auxiliary Supply (VCCAUX): 2.5V for DLLs and other auxiliary circuits
PCB Layout Guidelines
For optimal performance with the 484-pin LCSBGA package:
- Maintain controlled impedance for high-speed signals
- Provide adequate decoupling capacitors near power pins
- Follow recommended land pattern specifications
- Consider ball escape routing for dense interconnects
Quality and Reliability
Manufacturing Standards
The XC3SD3400A-5CSG484C is manufactured to rigorous quality standards:
- RoHS compliant (lead-free options available)
- Moisture sensitivity level (MSL) considerations for handling
- Compliant with industry quality management systems
- Comprehensive electrical and environmental testing
Long-Term Reliability
Built on proven 90nm technology, this FPGA demonstrates reliability in mission-critical applications across various industries. The robust architecture withstands industrial operating environments while maintaining consistent performance.
Conclusion
The XC3SD3400A-5CSG484C represents a mature, high-performance FPGA solution for applications requiring substantial logic resources, advanced DSP capabilities, and flexible I/O options. While in end-of-life status, it continues to serve existing designs where its specific characteristics and proven reliability are essential.
For new design projects, engineers should evaluate current-generation alternatives while considering the XC3SD3400A-5CSG484C for applications requiring backward compatibility or specific feature sets unique to the Spartan-3A DSP family.
