Overview of XC3SD3400A-4FGG676C FPGA
The XC3SD3400A-4FGG676C is a powerful field-programmable gate array (FPGA) from AMD (formerly Xilinx), part of the renowned Spartan-3A DSP family. This advanced FPGA delivers exceptional performance with 3.4 million system gates, making it an ideal solution for DSP-intensive applications, embedded systems, and complex digital designs. The device features 469 user I/O pins in a compact 676-pin Fine-pitch Ball Grid Array (FBGA) package, providing designers with extensive connectivity options.
Manufactured using 90nm CMOS technology, this FPGA operates at 1.2V, offering an optimal balance between high performance and low power consumption. The -4 speed grade delivers impressive clock frequencies up to 667 MHz, ensuring your designs meet demanding timing requirements.
Key Specifications at a Glance
| Specification |
Value |
| Part Number |
XC3SD3400A-4FGG676C |
| Manufacturer |
AMD (Xilinx) |
| Product Family |
Spartan-3A DSP |
| System Gates |
3.4 Million |
| Logic Cells |
53,712 Cells |
| CLBs (Configurable Logic Blocks) |
5,968 |
| Speed Grade |
-4 (667 MHz) |
| Package Type |
676-Pin FBGA |
| I/O Count |
469 User I/Os |
| Operating Voltage |
1.2V |
| Process Technology |
90nm CMOS |
| Operating Temperature |
Commercial (0°C to +85°C) |
Advanced Features and Capabilities
DSP Performance Excellence
The XC3SD3400A-4FGG676C incorporates dedicated DSP48A slices that provide exceptional signal processing capabilities:
- High-Speed MAC Operations: 48-bit accumulator supporting multiply-accumulate operations at over 250 MHz in -4 speed grade
- Pipeline Flexibility: Configurable pipeline stages for enhanced performance optimization
- Complex Arithmetic Support: Integrated adder enables complex multiply and multiply-add operations
- Parallel Processing: Multiple DSP blocks enable simultaneous high-throughput calculations
Memory Architecture
| Memory Type |
Capacity |
Performance |
| Block RAM |
283.5 KB total |
280 MHz operation in -4 speed grade |
| Distributed RAM |
Configurable from CLBs |
Flexible memory implementation |
| Configuration Memory |
SRAM-based |
Fast reconfiguration capability |
Clock Management System
- 8 Low-Skew Global Clock Networks: Ensures minimal clock distribution delay
- 8 Additional Regional Clocks: Per half-device for localized timing control
- Digital Clock Managers (DCMs): Advanced clock synthesis, multiplication, and phase shifting
- Low-Skew Routing: Abundant resources for critical timing paths
I/O Standards and Connectivity
The XC3SD3400A-4FGG676C supports a comprehensive range of I/O standards, making it compatible with diverse system architectures:
Supported I/O Standards
| Standard Type |
Standards Supported |
| Single-Ended |
LVCMOS, LVTTL, HSTL, SSTL |
| Differential |
LVDS, RSDS, mini-LVDS |
| High-Performance |
HSTL/SSTL with integrated differential termination |
| Voltage Range |
1.2V to 3.3V support |
Dual-Range VCCAUX
The device features a dual-range VCCAUX supply (2.5V/3.3V), simplifying board design for 3.3V-only systems while maintaining compatibility with 2.5V standards.
Application Areas
Industrial Automation and Control
The Xilinx FPGA platform excels in industrial environments where reliability and real-time processing are critical:
- Motor control algorithms with precise PWM generation
- PLC (Programmable Logic Controller) implementations
- Real-time sensor data acquisition and processing
- Industrial communication protocol bridges
Communications Infrastructure
- Software-defined radio (SDR) implementations
- Digital signal processing for wireless base stations
- High-speed data serialization/deserialization
- Protocol conversion and packet processing
Medical Instrumentation
- Medical imaging processing (ultrasound, X-ray enhancement)
- Real-time biosignal processing
- Diagnostic equipment control systems
- Patient monitoring systems with multiple sensor inputs
Test and Measurement Equipment
- High-speed data capture systems
- Signal generators and arbitrary waveform generators
- Logic analyzers and protocol analyzers
- Automated test equipment (ATE)
Development Resources and Tools
Design Software Support
| Tool |
Purpose |
Compatibility |
| Vivado Design Suite |
Modern FPGA design platform |
Latest versions |
| ISE Design Suite |
Legacy design environment |
14.7 (legacy support) |
| IP Core Libraries |
Pre-verified functional blocks |
DSP, memory controllers, interfaces |
Programming Options
- JTAG: Standard boundary scan programming
- SelectMAP: High-speed parallel configuration
- Serial Modes: SPI, BPI for compact designs
- Platform Flash: Non-volatile configuration storage
Package and Physical Characteristics
FBGA Package Details
| Parameter |
Specification |
| Package Code |
FGG676 |
| Pin Count |
676 pins |
| Ball Pitch |
1.0 mm |
| Package Dimensions |
27 mm × 27 mm |
| Package Height |
2.6 mm (typical) |
| Moisture Sensitivity |
Level 3 |
Thermal Characteristics
- Junction Temperature (TJ): Maximum 125°C
- Thermal Resistance (θJA): Varies with airflow and PCB design
- Recommended Heat Sink: Required for high-utilization designs
Power Management
Supply Voltage Requirements
| Supply Rail |
Voltage |
Purpose |
| VCCINT |
1.2V |
Core logic supply |
| VCCAUX |
2.5V or 3.3V |
Auxiliary circuits |
| VCCO |
1.2V to 3.3V |
I/O bank supplies |
Power Optimization Features
- Power-down modes: Selective block shutdown for reduced power
- Clock gating: Automatic and user-controlled clock management
- I/O standards selection: Choose appropriate standards for power efficiency
- Dynamic power management: Adjusts power based on design activity
Ordering Information and Part Number Breakdown
Part Number Decoding: XC3SD3400A-4FGG676C
- XC3SD: Spartan-3A DSP family identifier
- 3400: 3.4 million system gates
- A: Enhanced features version
- -4: Speed grade (commercial temperature, 667 MHz)
- FG: Fine-pitch BGA package
- G676: 676-pin configuration
- C: Commercial temperature grade (0°C to +85°C)
Temperature Grades Available
| Grade |
Code |
Temperature Range |
| Commercial |
C |
0°C to +85°C |
| Industrial |
I |
-40°C to +100°C |
| Extended |
E |
-40°C to +125°C (select devices) |
Design Considerations
PCB Layout Guidelines
- Power Distribution: Implement robust power planes with adequate decoupling
- Differential Pairs: Maintain controlled impedance for high-speed signals
- Length Matching: Critical for DDR interfaces and high-speed buses
- Ground Planes: Solid reference planes for signal integrity
- Thermal Management: Adequate copper area for heat dissipation
Configuration Strategy
- Configuration File Size: Approximately 11.9 Mbits
- Configuration Time: Varies by configuration mode (typically 50-200ms)
- Multi-boot Support: Fallback configuration options
- Bitstream Encryption: Security features for IP protection
Competitive Advantages
Why Choose XC3SD3400A-4FGG676C?
- Proven Architecture: Mature, reliable Spartan-3A DSP platform with extensive deployment history
- DSP Optimization: Dedicated DSP48A slices deliver superior signal processing performance
- Cost-Effective: Excellent price-performance ratio for mid-range applications
- Comprehensive Support: Extensive documentation, reference designs, and community resources
- Supply Chain Stability: Wide availability through authorized distributors
Comparison with Similar Devices
| Feature |
XC3SD3400A |
Typical Alternative |
| Logic Cells |
53,712 |
40,000-60,000 |
| DSP Slices |
126 |
80-120 |
| Block RAM |
283.5 KB |
200-300 KB |
| I/O Pins |
469 |
400-500 |
| Speed Grade |
667 MHz |
500-700 MHz |
Quality and Reliability
Manufacturing Standards
- RoHS Compliant: Lead-free manufacturing process
- Quality Certifications: ISO 9001, automotive-grade options available
- Testing: 100% production testing with comprehensive coverage
- Traceability: Full lot traceability for quality assurance
Reliability Metrics
- MTBF (Mean Time Between Failures): Exceeds 1 million hours under standard conditions
- ESD Protection: Meets JEDEC standards for electrostatic discharge
- Latch-up Immunity: Robust design prevents latch-up conditions
Technical Support and Documentation
Available Resources
- Datasheet: Complete electrical and mechanical specifications
- User Guides: Comprehensive design and configuration documentation
- Application Notes: Design tips and best practices
- Reference Designs: Proven starting points for common applications
- FAQs and Forums: Community-driven support resources
Getting Started
- Download Design Tools: Obtain ISE or Vivado software from AMD website
- Review Documentation: Study the Spartan-3A DSP family datasheet
- Evaluate Development Kits: Consider purchasing evaluation boards for prototyping
- Join Community: Participate in FPGA design forums and user groups
Conclusion
The XC3SD3400A-4FGG676C represents an excellent choice for designers seeking a balance of performance, features, and cost-effectiveness in their FPGA designs. With its robust DSP capabilities, extensive I/O support, and mature design ecosystem, this Spartan-3A DSP family member continues to serve a wide range of applications across industrial, communications, medical, and test equipment markets.
Whether you’re implementing complex DSP algorithms, building high-speed communication systems, or developing industrial control solutions, the XC3SD3400A-4FGG676C provides the resources and performance needed for successful product development.
Frequently Asked Questions
Q: What is the main difference between the XC3SD3400A and standard Spartan-3 devices?
A: The XC3SD3400A includes dedicated DSP48A slices optimized for signal processing applications, enhanced with 48-bit accumulators and integrated arithmetic units not found in standard Spartan-3 devices.
Q: Can I use the XC3SD3400A-4FGG676C in automotive applications?
A: The commercial-grade (-C) version is suitable for non-automotive applications. For automotive environments, consider industrial-grade (-I) variants or contact AMD for automotive-qualified options.
Q: What configuration methods does this FPGA support?
A: The device supports multiple configuration modes including JTAG, SelectMAP, serial SPI, and BPI modes, offering flexibility for different system requirements.
Q: How much block RAM is available in the XC3SD3400A-4FGG676C?
A: The device contains 283.5 KB of block RAM organized in dual-port blocks, capable of operating at 280 MHz in the -4 speed grade.
Q: Is the XC3SD3400A-4FGG676C compatible with modern design tools?
A: While originally designed for ISE Design Suite 14.7, many designers successfully use these devices. For new designs, verify tool compatibility with AMD’s documentation.
