Product Overview: AMD Xilinx XC3SD3400A-4FG676C FPGA
The XC3SD3400A-4FG676C is a powerful field-programmable gate array (FPGA) from AMD’s acclaimed Spartan-3A DSP family, designed to deliver exceptional digital signal processing capabilities for demanding embedded applications. This advanced FPGA combines 3.4 million system gates with integrated DSP48A slices, making it an ideal solution for telecommunications, industrial automation, medical imaging, and high-performance computing projects.
As part of the proven Xilinx FPGA product line, the XC3SD3400A-4FG676C offers engineers a cost-effective platform that balances performance, power efficiency, and flexibility for next-generation digital designs.
Key Technical Specifications
Core Performance Parameters
| Specification |
Value |
| System Gates |
3,400,000 gates |
| Logic Cells |
53,712 cells |
| Configurable Logic Blocks (CLBs) |
5,968 CLBs |
| Maximum Clock Frequency |
250 MHz (standard -4 speed grade) |
| DSP48A Slices |
126 dedicated DSP blocks |
| Block RAM |
283.5 KB embedded memory |
| Process Technology |
90nm CMOS |
| Core Voltage |
1.2V |
| I/O Voltage |
1.2V / 2.5V / 3.3V |
Package and Pin Configuration
| Parameter |
Specification |
| Package Type |
FBGA (Fine-Pitch Ball Grid Array) |
| Total Pins |
676 pins |
| Package Designation |
FG676 |
| User I/O Pins |
519 user I/O |
| Mounting Type |
Surface Mount |
| Operating Temperature Range |
0°C to +85°C (Commercial) |
Advanced Features and Capabilities
DSP48A Architecture for Enhanced Signal Processing
The XC3SD3400A-4FG676C incorporates 126 high-performance DSP48A slices, each featuring:
- 18×18 multiplier for efficient arithmetic operations
- 48-bit accumulator supporting multiply-accumulate (MAC) functions
- Pipeline stages achieving minimum 250 MHz operation
- Integrated adder for complex multiply and multiply-add operations
- Pre-adder for efficient filter implementations
This dedicated DSP architecture enables the FPGA to handle complex signal processing algorithms with minimal logic resource consumption, making it perfect for:
- Digital filtering applications
- FFT/IFFT implementations
- Image and video processing
- Software-defined radio (SDR)
- Motor control systems
Memory Architecture and Block RAM
The device features a hierarchical memory system with 283.5 KB of embedded Block RAM, organized as:
| Memory Feature |
Specification |
| Total Block RAM |
283.5 KB |
| Block RAM Blocks |
126 dedicated blocks |
| Operating Frequency |
280 MHz minimum (-4 speed grade) |
| Dual-Port Access |
True dual-port operation |
| Configuration |
Flexible width/depth configuration |
The registered outputs on Block RAM ensure reliable high-speed operation at frequencies exceeding 280 MHz, ideal for buffering, FIFO implementations, and embedded memory requirements.
I/O Capabilities and Interface Standards
Comprehensive I/O Support
The XC3SD3400A-4FG676C provides 519 user-configurable I/O pins supporting multiple industry-standard interfaces:
Single-Ended Standards:
- LVCMOS (1.2V, 1.5V, 1.8V, 2.5V, 3.3V)
- LVTTL (3.3V)
- PCI (33 MHz and 66 MHz)
- HSTL and SSTL (Classes I, II, III)
Differential Standards:
- LVDS (Low-Voltage Differential Signaling)
- RSDS (Reduced Swing Differential Signaling)
- mini-LVDS
- PPDS (Point-to-Point Differential Signaling)
- Integrated differential termination resistors
Clock Management System
| Clock Resource |
Quantity |
| Global Clock Networks |
8 low-skew networks |
| Regional Clock Networks |
8 per half device |
| Digital Clock Managers (DCMs) |
8 DCMs |
| Phase-Locked Loops (PLLs) |
Integrated in DCMs |
The advanced clock distribution network ensures minimal skew and jitter, essential for high-speed synchronous designs and multi-clock domain applications.
Application Areas and Use Cases
Industrial and Embedded Systems
The XC3SD3400A-4FG676C excels in demanding industrial applications:
- Industrial Automation: PLC controllers, motion control, robotics
- Test and Measurement: High-speed data acquisition, signal analysis
- Motor Control: FOC algorithms, servo systems, inverter control
- Machine Vision: Real-time image processing, pattern recognition
Communications and Networking
- Software-Defined Radio (SDR): Flexible baseband processing
- Telecommunications: Protocol processing, channel coding/decoding
- Network Infrastructure: Packet processing, traffic management
- Wireless Systems: Modulation/demodulation, signal conditioning
Medical and Scientific Equipment
- Medical Imaging: Ultrasound processing, MRI signal processing
- Laboratory Instrumentation: Spectrum analyzers, oscilloscopes
- Diagnostic Equipment: Real-time signal analysis and filtering
- Research Systems: Data acquisition and processing platforms
Design Resources and Development Tools
Software Support
| Tool Category |
Available Tools |
| Design Suite |
Xilinx ISE Design Suite (Legacy support) |
| Development Environment |
Vivado Design Suite (migration path) |
| Simulation |
ModelSim, ISim |
| DSP Design |
System Generator for DSP (MATLAB integration) |
| Debug Tools |
ChipScope Pro embedded logic analyzer |
Programming and Configuration
The XC3SD3400A-4FG676C supports multiple configuration modes:
- Master Serial Mode: SPI Flash memory
- Master Parallel Mode: Fast configuration
- Slave Serial Mode: External controller configuration
- JTAG Mode: In-system programming and debugging
Power Management and Efficiency
Supply Voltage Requirements
| Supply Rail |
Voltage Range |
Typical Current |
Purpose |
| VCCINT |
1.2V ±5% |
Varies by design |
Core logic |
| VCCAUX |
2.5V or 3.3V |
Design dependent |
Auxiliary circuits |
| VCCO |
1.2V to 3.3V |
Per I/O bank |
I/O banks |
Power Optimization Features
- Dynamic power management: Clock gating capabilities
- Low-power design flow: ISE power optimization tools
- Flexible I/O standards: Voltage-selectable per bank
- Sleep mode support: Reduced power consumption states
Package and Physical Characteristics
Mechanical Specifications
| Physical Parameter |
Specification |
| Package Type |
FBGA (Fine-pitch Ball Grid Array) |
| Ball Pitch |
1.0 mm |
| Package Size |
27 mm × 27 mm (nominal) |
| Package Height |
2.6 mm maximum seated height |
| Ball Material |
SAC305 (lead-free solder) |
| Moisture Sensitivity |
MSL 3 (168 hours at 30°C/60% RH) |
Thermal Characteristics
- Junction Temperature Range: 0°C to +85°C (Commercial grade)
- Thermal Resistance (ΘJA): Varies by airflow and mounting
- Recommended Heat Sink: May be required for high-power designs
- Thermal Management: Refer to Xilinx thermal design guidelines
Quality and Compliance
Standards and Certifications
| Compliance Area |
Status |
| RoHS Compliance |
RoHS compliant (lead-free) |
| REACH |
EU REACH compliant |
| Conflict Minerals |
Compliant with Dodd-Frank Act |
| Export Control |
ECCN: 3A991.d (US Export Administration) |
| Quality Standard |
Manufactured to automotive and industrial standards |
Reliability and Testing
- 100% electrical testing at production
- Extended temperature testing available
- Long-term reliability: Proven Spartan-3A DSP architecture
- Industry-proven design: Thousands of successful deployments
Comparison with Alternative FPGA Solutions
Spartan-3A DSP Family Comparison
| Part Number |
System Gates |
Logic Cells |
DSP48A Slices |
Block RAM |
Package |
| XC3SD1800A |
1.8M |
37,440 |
84 |
189 KB |
Various |
| XC3SD3400A-4FG676C |
3.4M |
53,712 |
126 |
283.5 KB |
FG676 |
| XC3S1600E |
1.6M |
33,192 |
36 |
231 KB |
FG320/FG484 |
The XC3SD3400A-4FG676C offers the optimal balance of logic density, DSP capability, and I/O count for mid-range to high-performance applications.
Ordering Information and Availability
Part Number Breakdown
XC3SD3400A-4FG676C:
- XC3SD3400A: Device family and density
- -4: Speed grade (standard performance)
- FG676: Package type (Fine-pitch BGA, 676 pins)
- C: Commercial temperature range (0°C to +85°C)
Related Part Numbers
| Variant |
Temperature Grade |
Speed Grade |
| XC3SD3400A-4FG676C |
Commercial (0°C to 85°C) |
-4 (Standard) |
| XC3SD3400A-4FG676I |
Industrial (-40°C to 100°C) |
-4 (Standard) |
| XC3SD3400A-5FG676C |
Commercial (0°C to 85°C) |
-5 (Enhanced) |
Pricing and Lead Time
For current pricing, availability, and volume discount information, please contact authorized AMD Xilinx distributors. Typical MOQ (Minimum Order Quantity) requirements and lead times vary based on market conditions.
Getting Started: Development Resources
Essential Documentation
- Datasheet: Spartan-3A DSP FPGA Family Data Sheet (DS611)
- User Guide: Spartan-3A DSP FPGA Family User Guide (UG431)
- PCB Design: Package and Pinout Specifications
- Application Notes: Reference designs and implementation guides
Reference Designs
- DSP reference designs: FIR filters, IIR filters, FFT cores
- Communication interfaces: UART, SPI, I2C, Ethernet
- Video processing: Image scaling, edge detection, format conversion
- Motor control: FOC algorithms, encoder interfaces
Community and Support
- Xilinx Forums: Active community support
- GitHub repositories: Open-source IP cores and examples
- Application engineers: Technical support from AMD/Xilinx
- Training resources: Online courses and webinars
Conclusion: Why Choose XC3SD3400A-4FG676C
The XC3SD3400A-4FG676C represents an excellent choice for engineers requiring robust DSP processing capabilities combined with flexible FPGA logic resources. With its proven architecture, comprehensive I/O support, and extensive development ecosystem, this FPGA enables rapid prototyping and deployment of sophisticated digital systems.
Key Benefits Summary
✓ High-performance DSP: 126 dedicated DSP48A slices for efficient signal processing
✓ Extensive logic resources: 3.4M gates and 53,712 logic cells
✓ Flexible I/O: 519 user I/O pins with multiple standard support
✓ Cost-effective: Optimal price-performance ratio in mid-range FPGA segment
✓ Mature ecosystem: Comprehensive tools, IP cores, and documentation
✓ Proven reliability: Field-tested architecture with excellent track record
Whether you’re developing industrial control systems, communications equipment, medical devices, or embedded computing platforms, the XC3SD3400A-4FG676C from the Xilinx FPGA family delivers the performance, flexibility, and reliability your project demands.
