Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC3SD3400A-4CSG484C: High-Performance Spartan-3A DSP FPGA for Advanced Digital Applications

Product Details

The XC3SD3400A-4CSG484C is a powerful field-programmable gate array (FPGA) from AMD’s (formerly Xilinx) renowned Spartan-3A DSP family, engineered to deliver exceptional performance for demanding digital signal processing and embedded system applications. This versatile FPGA combines cost-effectiveness with robust processing capabilities, making it an ideal choice for engineers and designers developing next-generation electronic systems.

Product Overview: XC3SD3400A-4CSG484C FPGA Specifications

The XC3SD3400A-4CSG484C represents the pinnacle of the Extended Spartan-3A FPGA series, offering impressive logic density and processing power in a compact 484-pin CSBGA package. Built on proven 90nm process technology, this FPGA delivers reliability and performance for high-volume, cost-sensitive applications across multiple industries.

Key Technical Specifications

Specification Value
Logic Capacity 3.4 Million System Gates
Logic Elements 53,712 Cells
I/O Pins 309 User I/Os
Operating Frequency Up to 667 MHz
Package Type 484-Pin LCSBGA (CSBGA-484)
Speed Grade -4 (Standard Performance)
Supply Voltage 1.2V Core (VCCINT)
Process Technology 90nm CMOS
Operating Temperature 0°C to +85°C (Commercial)

Advanced Features of XC3SD3400A-4CSG484C

Digital Signal Processing Capabilities

The XC3SD3400A-4CSG484C incorporates dedicated XtremeDSP DSP48A slices that accelerate complex mathematical operations essential for signal processing applications. These hardware-accelerated blocks enable:

  • High-speed multiply-accumulate operations
  • Efficient implementation of digital filters
  • Real-time signal processing with minimal latency
  • Power-efficient computation compared to software solutions

Memory Architecture

This <a href=”https://pcbsync.com/xilinx-fpga/”>Xilinx FPGA</a> features a sophisticated memory hierarchy designed for data-intensive applications:

Memory Type Capacity
Distributed RAM 373 Kbit
Embedded Block RAM 2,268 Kbit (2.21 Mbit)
Total Memory Resources 2,641 Kbit

The generous embedded memory enables efficient buffering, data storage, and implementation of complex state machines without requiring external memory components in many applications.

Performance Characteristics

Speed and Timing

The -4 speed grade designation indicates standard performance characteristics optimized for a wide range of applications:

  • Maximum System Clock: 667 MHz internal frequency
  • External I/O Performance: 250 MHz typical operation
  • Low Propagation Delay: Fast signal routing through configurable logic blocks
  • Deterministic Timing: Predictable performance for critical real-time systems

Power Efficiency

Built on 90nm technology, the XC3SD3400A-4CSG484C offers excellent power-per-performance characteristics:

  • Low static power consumption
  • Dynamic power scaling with clock gating
  • Multiple power domains (VCCINT, VCCAUX, VCCO)
  • Optimized for battery-powered and energy-conscious applications

Application Areas for XC3SD3400A-4CSG484C

Industrial Automation and Control

The robust architecture makes this FPGA ideal for:

  • Programmable logic controllers (PLCs)
  • Motor control systems
  • Industrial communication protocols
  • Real-time monitoring and control systems

Communications Infrastructure

High-speed I/O and DSP capabilities support:

  • Software-defined radio implementations
  • Protocol processing and bridging
  • Data encryption and security
  • Network packet processing

Consumer Electronics

Cost-effective performance enables:

  • High-definition video processing
  • Audio signal processing and effects
  • Image processing and computer vision
  • Gaming and entertainment systems

Automotive Systems

Reliability and performance support:

  • Advanced driver assistance systems (ADAS)
  • In-vehicle infotainment
  • Sensor fusion and processing
  • CAN bus and automotive networking

Package Information: 484-Pin CSBGA

Physical Characteristics

Parameter Specification
Package Type Chip Scale Ball Grid Array (CSBGA)
Total Pins 484
Mounting Style Surface Mount Technology (SMT)
Body Size Compact footprint for space-constrained designs
Ball Pitch Industry-standard spacing

Thermal Management

The CSBGA package provides excellent thermal performance through:

  • Direct thermal path to PCB
  • Efficient heat dissipation
  • Compatibility with standard cooling solutions
  • Junction-to-ambient thermal resistance optimized for reliability

Design Resources and Development Tools

Software Support

The XC3SD3400A-4CSG484C is supported by AMD’s comprehensive development ecosystem:

  • Vivado Design Suite: Modern FPGA design flow with advanced synthesis and implementation
  • ISE Design Suite: Legacy support for existing designs
  • IP Core Library: Pre-verified intellectual property blocks
  • Simulation Tools: Industry-standard verification environments

Development Boards

While specific development kits may vary, compatible evaluation platforms typically include:

  • Spartan-3A DSP starter kits
  • Third-party development boards
  • Custom carrier board designs
  • Educational platform support

Ordering and Availability

Part Number Breakdown

XC3SD3400A-4CSG484C

  • XC3SD3400A: Device family and density
  • -4: Speed grade (standard performance)
  • CSG484: Package type (484-pin CSBGA)
  • C: Commercial temperature range (0°C to +85°C)

Quality and Compliance

Certification Status
RoHS Compliant Yes
Moisture Sensitivity MSL (Moisture Sensitivity Level) rated
ESD Protection Industry-standard handling precautions
Quality Standards ISO 9001 manufacturing

Technical Comparison Table

XC3SD3400A vs. Other Spartan-3A Devices

Device Logic Cells System Gates Block RAM DSP Slices
XC3SD1800A 37,440 1.8M 1,512 Kbit 84
XC3SD3400A 53,712 3.4M 2,268 Kbit 126

Design Considerations

Power Supply Requirements

Proper power sequencing and regulation ensure reliable operation:

  1. VCCINT (1.2V): Core logic supply – highest current requirement
  2. VCCAUX (2.5V): Auxiliary circuits and clock management
  3. VCCO (1.2V to 3.3V): I/O banks – voltage depends on I/O standards

Configuration Options

The device supports multiple configuration modes:

  • Master Serial configuration
  • Slave Serial configuration
  • JTAG boundary scan
  • SelectMAP parallel configuration

Why Choose XC3SD3400A-4CSG484C?

Competitive Advantages

  1. Cost-Effective Performance: Optimal price-to-performance ratio for high-volume production
  2. Proven Technology: 90nm process with extensive field deployment history
  3. Rich Feature Set: DSP slices, abundant memory, flexible I/O
  4. Broad Ecosystem: Mature development tools and IP libraries
  5. Scalability: Pin-compatible family members for design migration

Long-Term Reliability

AMD (Xilinx) products are known for:

  • Extensive qualification testing
  • High mean time between failures (MTBF)
  • Automotive-grade options available
  • Comprehensive technical support

Getting Started with XC3SD3400A-4CSG484C

Design Flow Overview

  1. Requirements Analysis: Define system specifications and constraints
  2. Architecture Design: Partition functionality between hardware and software
  3. HDL Coding: Implement logic in VHDL or Verilog
  4. Simulation: Verify functionality using testbenches
  5. Synthesis: Convert HDL to gate-level netlist
  6. Implementation: Place and route design
  7. Timing Analysis: Verify timing closure
  8. Bitstream Generation: Create programming file
  9. Testing: Validate on actual hardware

Best Practices

  • Follow AMD design guidelines for optimal results
  • Utilize IP cores to accelerate development
  • Implement proper clock domain crossing techniques
  • Consider power optimization from early design stages
  • Plan for testability and debug access

Conclusion

The XC3SD3400A-4CSG484C stands as a versatile and powerful FPGA solution for modern digital design challenges. Whether you’re developing industrial control systems, communications equipment, consumer electronics, or automotive applications, this device provides the processing power, flexibility, and cost-effectiveness needed for successful product development.

With its combination of 3.4 million system gates, dedicated DSP resources, substantial embedded memory, and 309 user I/Os, the XC3SD3400A-4CSG484C delivers professional-grade performance in a compact 484-pin CSBGA package. Backed by AMD’s industry-leading development tools and extensive ecosystem support, this FPGA enables engineers to bring innovative designs to market efficiently and reliably.

For procurement inquiries, technical specifications, datasheets, and design support for the XC3SD3400A-4CSG484C, contact authorized AMD distributors or visit the official AMD documentation portal.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.