Product Overview: XC3SD3400A-1CSG484C FPGA Solution
The XC3SD3400A-1CSG484C is a cutting-edge Field Programmable Gate Array (FPGA) from AMD’s Spartan-3A DSP family, delivering exceptional performance and versatility for demanding digital design applications. This advanced programmable logic device combines 3.4 million system gates with 53,712 configurable logic cells, making it an ideal solution for cost-conscious, high-volume applications requiring superior processing capabilities.
Manufactured using advanced 90nm CMOS technology, the XC3SD3400A-1CSG484C represents a perfect balance between performance, power efficiency, and cost-effectiveness. Whether you’re developing communication systems, industrial automation equipment, or embedded digital signal processing solutions, this Xilinx FPGA provides the flexibility and computational power your project demands.
Key Technical Specifications
| Parameter |
Specification |
| Part Number |
XC3SD3400A-1CSG484C |
| Manufacturer |
AMD (formerly Xilinx) |
| FPGA Family |
Spartan-3A DSP |
| System Gates |
3.4 Million |
| Logic Cells |
53,712 Configurable Cells |
| Speed Grade |
-1 (Standard Performance) |
| Package Type |
484-pin CSBGA (Chip Scale Ball Grid Array) |
| Operating Voltage |
1.2V Core (VCCINT) |
| Process Technology |
90nm CMOS |
| I/O Count |
469 User I/O Pins |
| Temperature Range |
Commercial (0°C to +85°C) |
Core Features and Capabilities
Advanced Logic Architecture
The XC3SD3400A-1CSG484C features AMD’s proven Configurable Logic Block (CLB) architecture with flexible Look-Up Tables (LUTs) that enable efficient implementation of both combinational and sequential logic functions. Each CLB contains multiple slices with dedicated resources for arithmetic operations, making this FPGA particularly well-suited for DSP-intensive applications.
High-Density Integration
| Resource Type |
Quantity |
Benefits |
| System Gates |
3.4M |
Supports complex digital designs |
| Logic Cells |
53,712 |
Ample resources for multi-function systems |
| User I/O Pins |
469 |
Extensive connectivity options |
| Block RAM |
High-capacity distributed RAM |
Efficient data buffering and storage |
| DSP48 Slices |
Multiple dedicated blocks |
Accelerated signal processing |
Performance Characteristics
The -1 speed grade of the XC3SD3400A-1CSG484C delivers reliable standard performance with excellent timing characteristics for a wide range of applications. The device supports maximum operating frequencies suitable for:
- Digital signal processing applications
- High-speed data acquisition systems
- Industrial control systems
- Communication interface implementations
- Video and image processing pipelines
Package Details: 484-CSBGA
Physical Specifications
| Package Parameter |
Details |
| Package Type |
CSBGA (Chip Scale Ball Grid Array) |
| Pin Count |
484 pins |
| Ball Pitch |
Industry-standard spacing |
| Body Size |
Compact footprint design |
| Mounting Type |
Surface Mount Technology (SMT) |
| Lead-Free |
RoHS compliant |
Thermal Management
The CSBGA package provides excellent thermal performance with efficient heat dissipation characteristics. Proper PCB design with adequate thermal vias and copper planes ensures optimal operating temperatures even under sustained computational loads.
Application Areas
Digital Signal Processing
The XC3SD3400A-1CSG484C excels in DSP applications with its dedicated DSP48 slices and abundant logic resources. Ideal implementations include:
- FIR/IIR Filter Design – High-order digital filters with minimal resource utilization
- FFT/IFFT Processing – Real-time frequency domain analysis
- Digital Down Conversion – Software-defined radio applications
- Adaptive Algorithms – Noise cancellation and echo suppression
Communication Systems
| Application |
Key Benefits |
| Protocol Bridges |
Multiple interface support with flexible I/O |
| Ethernet Controllers |
Gigabit Ethernet MAC implementations |
| Serial Communications |
UART, SPI, I2C, CAN bus protocols |
| Wireless Interfaces |
Custom modem and baseband processing |
Industrial Automation
The robust design and commercial temperature range make the XC3SD3400A-1CSG484C perfect for:
- Motion control systems
- Machine vision processing
- PLC (Programmable Logic Controller) implementations
- Real-time monitoring and data acquisition
- Sensor fusion and signal conditioning
Embedded Systems Development
- Custom processor cores with soft-core implementations
- Hardware acceleration for compute-intensive algorithms
- Peripheral interface controllers
- System-on-Chip (SoC) prototyping
Development and Programming
Design Tools Compatibility
The XC3SD3400A-1CSG484C is fully supported by AMD’s comprehensive development ecosystem:
- Vivado Design Suite – Industry-leading FPGA design software
- ISE Design Suite – Legacy tool support for existing projects
- IP Core Libraries – Pre-verified functional blocks
- Simulation Tools – Behavioral and timing simulation capabilities
Programming Interface
| Interface |
Description |
| JTAG |
IEEE 1149.1 standard boundary scan |
| Configuration |
Master/Slave serial and parallel modes |
| Bitstream |
Secure bitstream encryption support |
| In-System Programming |
Live system updates and debugging |
Power Supply Requirements
Voltage Rails
| Power Rail |
Voltage |
Purpose |
| VCCINT |
1.2V |
Core logic power supply |
| VCCAUX |
2.5V/3.3V |
Auxiliary circuits |
| VCCO |
1.2V to 3.3V |
I/O banks (programmable per bank) |
Power Consumption Optimization
The XC3SD3400A-1CSG484C incorporates several power-saving features:
- Clock gating for unused logic regions
- Dynamic power management
- Low-power sleep modes
- Optimized I/O standards for reduced consumption
Quality and Reliability
Manufacturing Standards
The XC3SD3400A-1CSG484C is manufactured under stringent quality control processes:
- ISO 9001 certified manufacturing facilities
- Full traceability throughout production
- Comprehensive functional testing
- Reliability stress testing for commercial applications
ESD Protection
- Electrostatic Discharge (ESD) sensitive device
- Class 1C per JEDEC standard JESD22-A114
- Proper handling procedures required
- ESD protection recommendations included in documentation
Moisture Sensitivity
| Parameter |
Rating |
| MSL Level |
As per JEDEC J-STD-020 |
| Baking Requirements |
May be required before reflow |
| Storage Conditions |
Temperature and humidity controlled |
Ordering Information and Packaging
Part Number Breakdown
XC3SD3400A-1CSG484C
- XC3SD3400A – Device family and capacity
- -1 – Speed grade (standard performance)
- CSG484 – Package type (484-pin CSBGA)
- C – Commercial temperature range
Package Options
| Packaging |
Description |
Typical Use |
| Tray |
Individual units in trays |
Prototyping and low-volume |
| Tape & Reel |
Automated assembly ready |
High-volume production |
| Tube |
Protected individual packaging |
Development and testing |
Design Considerations
PCB Layout Recommendations
For optimal performance of the XC3SD3400A-1CSG484C:
- Power Plane Design – Dedicated power and ground planes with adequate decoupling
- Signal Integrity – Controlled impedance for high-speed signals
- Thermal Management – Thermal vias beneath package for heat dissipation
- BGA Routing – Follow AMD’s recommended fanout strategies
Critical Design Guidelines
| Aspect |
Recommendation |
| Decoupling Capacitors |
Multiple values (0.01µF, 0.1µF, 10µF) placed close to pins |
| Configuration Circuit |
Follow reference design for mode selection |
| Clock Distribution |
Use dedicated clock routing with minimal skew |
| I/O Standards |
Match voltage levels across interface banks |
Competitive Advantages
Why Choose XC3SD3400A-1CSG484C
The XC3SD3400A-1CSG484C offers several compelling advantages:
- Cost-Effective Solution – Optimal price-performance ratio for mid-range applications
- Proven Architecture – Based on mature, field-tested Spartan-3A technology
- Extensive I/O Options – 469 user I/O pins for complex system interfaces
- DSP-Optimized – Dedicated DSP blocks for efficient signal processing
- Development Ecosystem – Comprehensive tools and IP library support
- Scalable Design – Part of Spartan-3A family for easy migration
Comparison with Alternatives
| Feature |
XC3SD3400A-1CSG484C |
Typical Competitor |
| Logic Density |
53,712 cells |
Similar range |
| DSP Capability |
Dedicated DSP48 blocks |
May require soft implementation |
| Tool Support |
Industry-standard Vivado/ISE |
Vendor-specific tools |
| Ecosystem |
Extensive IP core library |
Limited third-party support |
| Cost-Performance |
Optimized for value |
Varies by vendor |
Support and Documentation
Available Resources
AMD provides comprehensive documentation for the XC3SD3400A-1CSG484C:
- Complete datasheet with electrical specifications
- User guides and application notes
- Reference designs and example projects
- PCB layout guidelines and footprint files
- Thermal design guides
- Configuration and programming specifications
Technical Support
- Online knowledge base and forums
- Direct technical support through AMD channels
- Community-driven resources and tutorials
- Training webinars and documentation
Conclusion: Your Ideal FPGA Solution
The XC3SD3400A-1CSG484C represents an excellent choice for engineers and designers seeking a high-performance, cost-effective FPGA solution. With its combination of substantial logic resources, dedicated DSP capabilities, and extensive I/O options, this device can handle complex digital designs across multiple application domains.
Whether you’re developing advanced communication systems, implementing sophisticated signal processing algorithms, or creating next-generation industrial control solutions, the XC3SD3400A-1CSG484C provides the flexibility, performance, and reliability your project demands. Backed by AMD’s proven technology and comprehensive development tools, this FPGA delivers exceptional value for both prototype and production applications.
Ready to harness the power of the XC3SD3400A-1CSG484C in your next design? Explore the full capabilities of Xilinx FPGA technology and discover how this versa
