The XC3SD1800A-4FGG676C is an advanced Field Programmable Gate Array from AMD (formerly Xilinx), belonging to the renowned Spartan-3A DSP family. This powerful FPGA delivers exceptional digital signal processing capabilities combined with flexible logic resources, making it ideal for cost-sensitive applications demanding high performance and reliability.
Overview of XC3SD1800A-4FGG676C FPGA
The XC3SD1800A-4FGG676C represents cutting-edge FPGA technology designed for applications requiring robust DSP performance. Built on advanced 90nm process technology, this device offers 1.8 million system gates and comprehensive I/O capabilities in a compact 676-ball Fine-pitch Ball Grid Array (FBGA) package. As part of the Xilinx FPGA portfolio, it combines flexibility with performance for demanding embedded applications.
Key Features and Specifications
Core Technical Specifications
| Parameter |
Specification |
| Part Number |
XC3SD1800A-4FGG676C |
| Family |
Spartan-3A DSP |
| System Gates |
1,800,000 |
| Logic Cells/Elements |
37,440 |
| CLBs (Configurable Logic Blocks) |
4,160 |
| Total RAM Bits |
1,548,288 bits |
| Number of I/O Pins |
519 |
| Package Type |
676-FBGA (27x27mm) |
| Speed Grade |
-4 |
| Operating Voltage |
1.14V ~ 1.26V |
| Operating Temperature |
0°C ~ 85°C (TJ) |
Advanced DSP Capabilities
The XC3SD1800A-4FGG676C excels in digital signal processing applications with dedicated DSP48A slices that provide enhanced computational performance:
- Dedicated DSP Blocks: Optimized for multiply-accumulate operations
- High-Speed Arithmetic: 18×18 multipliers with 48-bit accumulation
- DSP Performance: Ideal for filtering, transforms, and signal conditioning
- Low Latency Processing: Minimal clock cycles for DSP operations
Memory Architecture
| Memory Type |
Capacity |
Configuration |
| Block RAM |
1,548,288 bits |
Dual-port configuration |
| Distributed RAM |
Available from logic cells |
Flexible sizing |
| Memory Blocks |
Multiple 18Kb blocks |
Cascadable for larger memories |
Technical Architecture and Design Features
High-Performance Logic Resources
The XC3SD1800A-4FGG676C provides extensive logic resources for complex digital designs:
- 67,600 Logic Cells: Enables implementation of sophisticated algorithms
- Flexible LUT Architecture: 4-input and 6-input look-up tables
- Fast Carry Logic: Optimized for arithmetic operations
- Embedded Multipliers: Hardware multiplication for signal processing
Clocking and Timing Infrastructure
| Clock Feature |
Specification |
| DCM (Digital Clock Managers) |
Multiple DCMs for flexible clock generation |
| PLL Support |
Phase-locked loops for precise frequency synthesis |
| Global Clock Networks |
Low-skew clock distribution |
| Clock Frequency |
Up to 375 MHz internal performance |
High-Speed I/O Capabilities
The device offers versatile I/O options with 519 user I/O pins:
- I/O Standards Support: LVDS, LVTTL, LVCMOS, and more
- Differential Pairs: High-speed serial communication support
- 3.125 Gbps Transceivers: Built-in high-speed serial interfaces
- Programmable Slew Rate: Optimized signal integrity control
XC3SD1800A-4FGG676C Applications
Industrial and Commercial Applications
| Application Domain |
Use Cases |
| Digital Signal Processing |
Audio/video processing, filtering, FFT implementations |
| Telecommunications |
Base stations, protocol converters, signal conditioning |
| Industrial Control |
Motor control, automation systems, PLC functionality |
| Test and Measurement |
Oscilloscopes, logic analyzers, signal generators |
| Networking Equipment |
Routers, switches, firewall acceleration |
Embedded Systems Applications
The XC3SD1800A-4FGG676C excels in embedded applications requiring:
- Data Processing Systems: Servers, storage controllers, data centers
- Video and Image Processing: Encoders, decoders, image enhancement
- High-Performance Computing: Parallel processing, algorithm acceleration
- Automotive Systems: ADAS (Advanced Driver Assistance Systems), infotainment
- IoT Edge Devices: Smart sensors, edge computing nodes
Design and Development Resources
Software Development Tools
| Tool |
Purpose |
| Xilinx ISE |
Complete development environment for Spartan-3A DSP |
| ISE WebPACK |
Free version for smaller designs |
| System Generator |
MATLAB/Simulink integration for DSP design |
| SDK |
Embedded software development kit |
Documentation and Support
Comprehensive technical resources available for the XC3SD1800A-4FGG676C:
- Datasheet (DS610): Complete electrical and timing specifications
- User Guide (UG331): Implementation guidelines and best practices
- Package Information: Mechanical drawings and pinout details
- Power Analysis Tools: Thermal and power consumption calculators
- Reference Designs: Application-specific implementation examples
Package and Physical Specifications
FBGA Package Details
| Physical Parameter |
Value |
| Package Type |
676-FBGA Fine-pitch Ball Grid Array |
| Package Dimensions |
27mm x 27mm |
| Ball Pitch |
1.0mm |
| Total Balls |
676 |
| Mounting Type |
Surface Mount Technology (SMT) |
| Thermal Resistance |
Optimized for commercial temperature range |
Pin Configuration
The XC3SD1800A-4FGG676C pinout includes:
- Power Supply Pins: Multiple VCCINT, VCCAUX, and VCCO pins
- Ground Pins: Distributed GND connections for optimal signal integrity
- User I/O: 519 configurable I/O pins supporting multiple standards
- Configuration Pins: JTAG and dedicated configuration interfaces
- Clock Input Pins: Dedicated global clock inputs
Performance Characteristics
Speed Grade -4 Performance
The -4 speed grade of the XC3SD1800A-4FGG676C offers:
| Performance Metric |
Specification |
| Maximum Frequency |
Up to 375 MHz (design-dependent) |
| Logic Delay |
Optimized for high-speed operation |
| Setup/Hold Times |
Industry-leading timing margins |
| Clock-to-Out |
Minimal propagation delay |
Power Consumption
Efficient power management with multiple power domains:
- Core Voltage (VCCINT): 1.2V nominal operation
- Auxiliary Voltage (VCCAUX): 2.5V for auxiliary circuits
- I/O Voltage (VCCO): Programmable from 1.2V to 3.3V
- Low Power Modes: Static power reduction features
Comparison with Similar FPGAs
XC3SD1800A vs XC3SD3400A
| Specification |
XC3SD1800A-4FGG676C |
XC3SD3400A |
| System Gates |
1,800,000 |
3,400,000 |
| Logic Cells |
37,440 |
53,712 |
| Block RAM |
1,548,288 bits |
2,322,432 bits |
| DSP Slices |
84 |
126 |
| I/O Pins |
519 |
469 (package dependent) |
Competitive Advantages
The XC3SD1800A-4FGG676C stands out with:
- Cost-Effective DSP: High DSP performance at competitive pricing
- Balanced Resources: Optimal logic-to-memory-to-DSP ratio
- Proven Reliability: Mature technology with extensive field deployment
- Broad Tool Support: Compatible with industry-standard development tools
Ordering Information and Availability
Part Number Breakdown
XC3SD1800A-4FGG676C decodes as:
- XC3S: Spartan-3 family designation
- D1800A: DSP variant with 1.8M gates, revision A
- -4: Speed grade (commercial temperature)
- FGG676: Fine-pitch BGA, 676-ball package
- C: Commercial temperature grade (0°C to 85°C)
Package Status and Procurement
| Status |
Details |
| Production Status |
Active (limited availability – check with distributors) |
| Lead Time |
Varies by distributor and quantity |
| Minimum Order |
Typically available in units and trays |
| ESD Protection |
All units shipped with anti-static protection |
Integration and Implementation Guidelines
PCB Design Considerations
Key factors when designing with the XC3SD1800A-4FGG676C:
- Power Plane Design: Separate planes for VCCINT, VCCAUX, and VCCO
- Decoupling Strategy: Multiple capacitors per power pin
- Thermal Management: Adequate copper pour for heat dissipation
- Signal Integrity: Controlled impedance for high-speed signals
- BGA Layout: Proper via-in-pad or fanout routing techniques
Configuration Options
| Configuration Mode |
Description |
| JTAG |
IEEE 1149.1 boundary scan programming |
| Master Serial |
Direct configuration from serial memory |
| Slave Serial |
Configuration via external controller |
| Master SelectMAP |
Parallel configuration interface |
Quality and Compliance
Regulatory and Export Information
- ECCN Classification: 3A001.a.2.c
- Export Compliance: Subject to U.S. Export Administration Regulations
- RoHS Status: Compliant with EU environmental directives
- Quality Standard: ISO 9001 manufacturing
Reliability Specifications
The XC3SD1800A-4FGG676C meets stringent quality requirements:
- MTBF: High mean time between failures
- Temperature Cycling: Extensive testing for thermal reliability
- ESD Protection: Human Body Model (HBM) compliant
- Moisture Sensitivity: Level 3 (MSL3) classification
Development Kits and Evaluation Boards
Recommended Development Platforms
| Platform |
Features |
| Spartan-3A DSP Starter Kit |
Complete evaluation platform featuring XC3SD1800A |
| Third-Party Development Boards |
Custom solutions for specific applications |
| Prototyping Modules |
Rapid development and testing platforms |
Getting Started
Steps to begin developing with the XC3SD1800A-4FGG676C:
- Install Development Tools: Download Xilinx ISE or ISE WebPACK
- Review Documentation: Study datasheet and user guides
- Select Development Board: Choose appropriate evaluation platform
- Create Initial Design: Start with reference designs or tutorials
- Simulate and Verify: Use integrated simulation tools
- Program and Test: Configure FPGA and validate functionality
Support and Resources
Technical Support Channels
Access comprehensive support for the XC3SD1800A-4FGG676C:
- AMD/Xilinx Support Portal: Official technical documentation
- Community Forums: User discussions and troubleshooting
- FAE Support: Field Application Engineers for design assistance
- Training Resources: Webinars, tutorials, and application notes
IP Core Library
Leverage pre-verified IP cores for faster development:
- DSP Cores: FIR filters, FFTs, cordic algorithms
- Communication Protocols: Ethernet, PCIe, USB
- Memory Controllers: DDR, SRAM, Flash interfaces
- Video Processing: Image scaling, color space conversion
Conclusion
The XC3SD1800A-4FGG676C delivers exceptional value for embedded applications requiring robust DSP capabilities and flexible logic resources. With 1.8 million system gates, 519 I/O pins, and comprehensive development tool support, this FPGA provides an ideal solution for industrial, telecommunications, and high-performance computing applications. Its proven architecture, competitive pricing, and extensive ecosystem make it a reliable choice for both prototyping and volume production deployments.
Whether you’re developing advanced signal processing systems, implementing custom communication protocols, or creating sophisticated control systems, the XC3SD1800A-4FGG676C offers the performance, flexibility, and reliability needed to bring your designs to life efficiently and cost-effectively.
