The XC3SD1800A-4FGG676C represents AMD Xilinx’s premium solution in the Spartan-3A DSP family, delivering exceptional digital signal processing capabilities for cost-sensitive, high-volume applications. This advanced field-programmable gate array combines 1.8 million system gates with dedicated DSP blocks, making it ideal for telecommunications, video processing, and embedded computing systems.
Product Overview: XC3SD1800A-4FGG676C Specifications
The XC3SD1800A-4FGG676C is engineered on proven 90nm process technology, offering designers a powerful balance of performance, flexibility, and cost-effectiveness. This Xilinx FPGA delivers robust processing capabilities while maintaining low power consumption for demanding industrial and commercial applications.
Core Technical Specifications
| Parameter |
Specification |
Description |
| Part Number |
XC3SD1800A-4FGG676C |
Full device identifier |
| Device Family |
Spartan-3A DSP |
High-performance DSP-optimized series |
| System Gates |
1,800,000 |
Equivalent logic capacity |
| Logic Cells |
37,440 |
Configurable logic elements |
| CLB Count |
1,944 |
Configurable Logic Blocks |
| Speed Grade |
-4 |
Fastest commercial grade available |
| Package Type |
676-FBGA |
Fine-pitch Ball Grid Array |
| Package Dimensions |
27mm x 27mm |
Compact form factor |
| User I/O Pins |
519 |
Maximum available I/O |
Advanced DSP Architecture of XC3SD1800A-4FGG676C
XtremeDSP DSP48A Slice Configuration
The XC3SD1800A-4FGG676C incorporates 84 dedicated DSP48A slices, representing a significant enhancement over traditional FPGA architectures. These specialized processing blocks deliver exceptional performance for signal processing applications.
| DSP Feature |
Capability |
Performance |
| DSP48A Slices |
84 blocks |
Dedicated multiply-accumulate units |
| Multiplier Size |
18-bit x 18-bit |
High-precision arithmetic |
| Operating Frequency |
250 MHz |
DSP block performance |
| Accumulator Width |
48-bit |
Extended precision calculations |
| Pre-adder |
18-bit |
Integrated for complex operations |
| Pipeline Stages |
Multiple |
Optimized throughput |
Memory Architecture and Resources
The XC3SD1800A-4FGG676C features a hierarchical memory system designed for efficient data storage and processing:
| Memory Type |
Capacity |
Configuration |
| Block RAM |
1,548 Kb (1.51 MB) |
84 blocks of 18 Kb each |
| Distributed RAM |
244 Kb |
CLB-based memory |
| Total RAM |
1,792 Kb |
Combined memory resources |
| Block RAM Speed |
250 MHz |
Enhanced with output registers |
XC3SD1800A-4FGG676C Package and Pin Configuration
FBGA676 Package Details
| Package Specification |
Value |
Notes |
| Package Code |
FGG676 |
Fine-pitch Ball Grid Array |
| Total Pins |
676 |
High-density interconnect |
| Body Size |
27mm x 27mm |
Industry-standard footprint |
| Ball Pitch |
1.0mm |
Fine-pitch technology |
| User I/O |
519 pins |
Configurable interface pins |
| Differential Pairs |
227 pairs |
High-speed signaling support |
Electrical Characteristics of XC3SD1800A-4FGG676C
Power and Operating Requirements
| Parameter |
Minimum |
Typical |
Maximum |
Unit |
| Core Voltage (VCCINT) |
1.14 |
1.20 |
1.26 |
V |
| Auxiliary Voltage (VCCAUX) |
2.375 |
2.50 |
2.625 |
V |
| I/O Voltage (VCCO) |
1.2 |
– |
3.3 |
V |
| Operating Temp (Commercial) |
0 |
– |
+85 |
°C |
| Junction Temperature |
0 |
– |
+85 |
°C (TJ) |
Key Features and Capabilities
Clock Management and Distribution
The XC3SD1800A-4FGG676C provides sophisticated clocking resources:
- Digital Clock Managers (DCMs): 8 dedicated blocks for clock synthesis and phase shifting
- Global Clock Networks: 8 low-skew distribution networks
- Regional Clocks: 8 additional clocks per device half
- Clock Frequency Range: DC to 320 MHz on global networks
Advanced I/O Standards Support
| I/O Standard |
Voltage Range |
Application |
| LVDS |
2.5V |
High-speed differential signaling |
| SSTL |
1.8V, 2.5V |
Memory interfaces |
| HSTL |
1.5V, 1.8V |
High-speed transceiver logic |
| LVCMOS |
1.2V – 3.3V |
General purpose I/O |
| LVTTL |
3.3V |
Legacy interface support |
Target Applications for XC3SD1800A-4FGG676C
Digital Signal Processing Applications
The XC3SD1800A-4FGG676C excels in compute-intensive DSP workloads:
- Digital Filters: FIR, IIR, and adaptive filtering implementations
- FFT Processors: High-speed Fast Fourier Transform engines
- Communications: Software-defined radio, baseband processing
- Audio Processing: Multi-channel audio mixing and effects
- Image Processing: Real-time video filtering and enhancement
Industrial and Embedded Systems
- Motor Control: Advanced field-oriented control algorithms
- Test Equipment: Signal generators, oscilloscopes, logic analyzers
- Data Acquisition: High-speed sampling and processing systems
- Industrial Automation: PLC controllers, motion control
- Medical Devices: Ultrasound processing, patient monitoring
Networking and Telecommunications
- Ethernet Switches: Layer 2/3 packet processing
- Wireless Infrastructure: Base station controllers, backhaul equipment
- Network Security: Firewall acceleration, encryption engines
- Optical Networking: SONET/SDH framing, OTN processing
Development Tools and Software Support
Design Software Compatibility
| Tool |
Version |
Support Level |
| Xilinx ISE Design Suite |
14.7 |
Full support |
| Xilinx Vivado |
Limited |
Legacy device support |
| System Generator |
All versions |
MATLAB/Simulink integration |
| ChipScope Pro |
Included |
On-chip debugging |
Programming and Configuration
- Configuration Modes: Master/Slave Serial, JTAG, SelectMAP
- Configuration Memory: SPI Flash, Parallel Flash, PROM
- Bitstream Size: Approximately 11.7 Mbits
- Configuration Time: 100-300ms typical
Performance Benchmarks
Processing Capabilities
| Operation |
Performance |
Units |
| MAC Operations |
21 GMACS |
84 DSP48A × 250 MHz |
| Peak Multiply Rate |
21 billion/sec |
18×18 multiplications |
| Memory Bandwidth |
64 GB/s |
Combined block RAM |
| I/O Bandwidth |
32 Gbps |
High-speed transceivers |
Design Considerations
Thermal Management
The XC3SD1800A-4FGG676C requires proper thermal design for reliable operation:
- Thermal Resistance (θJA): Package-dependent, typically 20-30°C/W
- Power Consumption: Design-dependent, 2-8W typical
- Cooling Requirements: Heatsink recommended for high-utilization designs
- Temperature Monitoring: Internal diode for junction temperature sensing
PCB Layout Guidelines
Critical Design Factors:
- Maintain power plane integrity with dedicated VCCINT and VCCAUX planes
- Implement proper decoupling with 0.1µF and 10µF capacitors near each power pin
- Route high-speed signals with controlled impedance traces
- Provide adequate ground return paths for signal integrity
- Follow Xilinx PCB design guidelines for optimal performance
Comparison with Other Spartan-3A DSP Devices
| Feature |
XC3SD1800A |
XC3SD3400A |
| System Gates |
1.8 Million |
3.4 Million |
| Logic Cells |
37,440 |
53,712 |
| DSP48A Slices |
84 |
126 |
| Block RAM |
1,548 Kb |
2,268 Kb |
| User I/O (Max) |
519 |
519 |
Quality and Reliability
Manufacturing Standards
- Process Technology: 90nm CMOS
- Operating Lifetime: > 10 years at rated conditions
- MTBF: > 1 million hours
- Quality Certification: ISO 9001, automotive-grade options available
Environmental Compliance
- RoHS Compliant: Lead-free packaging
- Halogen-Free: Available options
- REACH Compliant: EU chemical regulations
- Conflict-Free: Responsible sourcing certified
Ordering Information and Part Number Decode
XC3SD1800A-4FGG676C Part Number Breakdown
- XC3SD1800A: Device family and gate count
- 4: Speed grade (-4 = fastest commercial)
- FG: Package type (Fine-pitch Grid array)
- G: Ball assignment
- 676: Total ball count
- C: Commercial temperature grade (0°C to +85°C)
Available Variants
- XC3SD1800A-4FGG676C: Commercial temperature, -4 speed
- XC3SD1800A-5FGG676C: Commercial temperature, -5 speed
- XC3SD1800A-4FGG676I: Industrial temperature (-40°C to +100°C)
Why Choose XC3SD1800A-4FGG676C
The XC3SD1800A-4FGG676C delivers unmatched value for DSP-intensive applications requiring high performance and flexibility. Its combination of dedicated DSP blocks, substantial memory resources, and extensive I/O capabilities makes it the ideal choice for next-generation embedded systems, telecommunications equipment, and industrial control applications.
Key Advantages
- Cost-Effective Performance: Lowest cost per MAC operation in its class
- Proven Technology: Mature 90nm process with extensive deployment history
- Design Flexibility: Reprogrammable architecture enables field upgrades
- Rich Ecosystem: Extensive IP cores, reference designs, and development tools
- Long-Term Support: Established product with ongoing availability
Getting Started with XC3SD1800A-4FGG676C
Development Resources
Evaluation Boards:
- Spartan-3A DSP 1800A Starter Kit
- Digilent Nexys 3 Spartan-3A DSP Board
- Custom third-party development platforms
Documentation:
- Complete datasheet with electrical specifications
- User guide with design guidelines and constraints
- Application notes for common implementations
- IP core documentation and reference manuals
Support:
- Xilinx Community Forums
- Technical support hotline
- Local distributor technical assistance
- Online training resources and webinars
Conclusion
The XC3SD1800A-4FGG676C represents the culmination of Xilinx’s expertise in DSP-optimized FPGA architecture. Whether you’re developing advanced telecommunications systems, high-performance industrial controllers, or next-generation medical devices, this versatile FPGA provides the processing power, flexibility, and reliability required for mission-critical applications. With its proven track record, comprehensive tool support, and cost-effective pricing, the XC3SD1800A-4FGG676C continues to be the preferred choice for engineers worldwide.
