Overview of XC3SD1800A-4FGG676I FPGA
The XC3SD1800A-4FGG676I is a powerful Field Programmable Gate Array (FPGA) from AMD (formerly Xilinx), belonging to the renowned Spartan-3A DSP family. This advanced programmable logic device combines high-performance digital signal processing capabilities with cost-effective design, making it an ideal solution for demanding embedded applications, telecommunications systems, and DSP-intensive projects.
As part of the Spartan-3A DSP series, this FPGA delivers exceptional flexibility and performance for engineers developing next-generation digital systems. The device is manufactured using proven 90nm process technology, ensuring reliable operation and optimal power efficiency.
Key Features and Specifications
Core FPGA Specifications
| Specification |
Value |
| Part Number |
XC3SD1800A-4FGG676I |
| Manufacturer |
AMD (Xilinx) |
| Product Family |
Spartan-3A DSP |
| System Gates |
1.8 Million (1,800,000) |
| Logic Cells |
37,440 Cells |
| CLBs (Configurable Logic Blocks) |
4,160 |
| Maximum Operating Frequency |
667 MHz |
| Process Technology |
90nm CMOS |
| Core Voltage |
1.2V nominal (1.14V – 1.26V) |
Memory and DSP Resources
| Resource Type |
Specification |
| Total RAM Bits |
1,548,288 bits |
| Block RAM |
Enhanced for DSP applications |
| XtremeDSP DSP48A Slices |
Integrated DSP blocks |
| Distributed RAM |
Available throughout fabric |
Physical and Environmental Specifications
| Parameter |
Details |
| Package Type |
676-Pin Fine-Pitch Ball Grid Array (FBGA) |
| Package Dimensions |
27mm x 27mm |
| Mounting Type |
Surface Mount Technology (SMT) |
| Number of I/O Pins |
519 user I/O |
| Operating Temperature Range |
-40°C to +100°C (Junction Temperature) |
| RoHS Compliance |
ROHS3 Compliant |
| Product Status |
Active |
Technical Capabilities and Performance
Digital Signal Processing Excellence
The XC3SD1800A-4FGG676I integrates dedicated XtremeDSP DSP48A slices that enable high-performance mathematical operations essential for DSP applications. These hardware multipliers and accumulators deliver superior performance compared to soft logic implementations, making this Xilinx FPGA perfect for:
- High-speed filtering operations
- FFT (Fast Fourier Transform) implementations
- Video and image processing algorithms
- Software-defined radio (SDR) applications
- Motor control systems
- Advanced digital communications
Enhanced Memory Architecture
With over 1.5 million RAM bits distributed across the device, designers can implement complex buffering schemes, large lookup tables, and sophisticated data processing pipelines. The memory architecture provides optimal balance between logic resources and storage capacity.
I/O Flexibility and Standards Support
The 519 user I/O pins support multiple voltage standards and interface protocols:
| I/O Standard |
Supported Voltages |
| LVTTL |
3.3V |
| LVCMOS |
3.3V, 2.5V, 1.8V, 1.5V, 1.2V |
| HSTL |
High-Speed Transceiver Logic |
| SSTL |
Stub Series Terminated Logic |
This comprehensive I/O support enables seamless integration with diverse system components, memory interfaces, and communication protocols.
Application Areas
Telecommunications and Networking
The XC3SD1800A-4FGG676I excels in telecommunications infrastructure:
- Base station signal processing
- Protocol conversion and bridging
- Network packet processing
- Channel coding and decoding
- Modulation/demodulation systems
Industrial Automation and Control
Manufacturing and process control applications benefit from:
- Real-time control systems
- Motion control and robotics
- Machine vision processing
- Sensor fusion algorithms
- Industrial communication protocols (EtherCAT, PROFINET, etc.)
Medical and Imaging Systems
Advanced medical equipment leverages the FPGA’s capabilities for:
- Ultrasound beam forming
- Medical imaging processing
- Patient monitoring systems
- Laboratory instrumentation
- Diagnostic equipment signal processing
Aerospace and Defense
Mission-critical applications utilize this FPGA for:
- Radar signal processing
- Electronic warfare systems
- Navigation and guidance
- Secure communications
- Avionics control systems
Design and Development Support
Development Tools Compatibility
| Tool Suite |
Description |
| Vivado Design Suite |
Modern FPGA design environment with advanced synthesis |
| ISE Design Suite |
Legacy support for Spartan-3A DSP family |
| IP Core Libraries |
Pre-verified IP for common functions |
| ChipScope Pro |
Integrated logic analyzer for debugging |
Programming and Configuration
The device supports multiple configuration modes:
- Master Serial Mode
- Slave Serial Mode
- Master SelectMAP Mode
- Slave SelectMAP Mode
- JTAG Configuration
- Boundary-Scan Testing
Technical Comparison Table
XC3SD1800A vs Similar FPGAs
| Feature |
XC3SD1800A-4FGG676I |
XC3SD3400A (Higher Density) |
XC3S2000 (Standard Spartan-3) |
| Logic Cells |
37,440 |
53,712 |
46,080 |
| System Gates |
1.8M |
3.4M |
2.0M |
| DSP Slices |
DSP48A Enhanced |
DSP48A Enhanced |
Limited |
| Block RAM |
1,548,288 bits |
Higher |
1,728,000 bits |
| Max Frequency |
667 MHz |
667 MHz |
630 MHz |
| I/O Pins (676 pkg) |
519 |
519 |
489 |
Ordering Information and Package Details
Part Number Breakdown
XC3SD1800A-4FGG676I
- XC3SD = Spartan-3A DSP family
- 1800A = 1.8M system gates variant
- 4 = Speed grade (-4 = standard commercial)
- FGG676 = Fine-pitch BGA, 676 pins
- I = Industrial temperature range (-40°C to +100°C)
Available Speed Grades
| Speed Grade |
Performance Level |
Typical Applications |
| -4 |
Standard |
General-purpose, cost-sensitive designs |
| -5 |
Enhanced |
Higher performance requirements |
Power Consumption and Thermal Management
Power Requirements
| Parameter |
Specification |
| Core Voltage (VCCINT) |
1.14V – 1.26V (nominal 1.2V) |
| I/O Supply Voltages (VCCO) |
1.2V to 3.3V (depending on I/O standard) |
| Auxiliary Supply (VCCAUX) |
2.5V |
| Typical Power Consumption |
Application-dependent (design-specific) |
Thermal Considerations
With junction temperatures rated from -40°C to +100°C, proper thermal management ensures reliable operation:
- Heat sink attachment recommended for high-utilization designs
- Thermal vias in PCB design for heat dissipation
- Air flow considerations in enclosure design
- Junction temperature monitoring through internal sensors
Why Choose XC3SD1800A-4FGG676I?
Advantages Over ASICs
- No NRE Costs: Eliminate expensive mask costs and lengthy fabrication cycles
- Rapid Prototyping: Immediate implementation and testing of design changes
- Field Upgradability: Update functionality without hardware replacement
- Lower Risk: Modify designs based on real-world testing and requirements
- Time-to-Market: Significantly faster development and deployment
Proven Xilinx FPGA Technology
The Spartan-3A DSP family builds upon decades of FPGA innovation, offering:
- Mature, well-documented architecture
- Extensive third-party IP ecosystem
- Comprehensive development tool support
- Large community of experienced designers
- Proven reliability in production environments
Design Resources and Support
Available Documentation
- Complete datasheet with electrical specifications
- User guide with detailed architecture information
- Application notes for common design patterns
- PCB layout guidelines and recommendations
- Power estimation tools and calculators
CAD Model Resources
Download free design models for seamless PCB integration:
- Altium Designer symbols and footprints
- EAGLE library components
- KiCad schematic symbols and PCB modules
- OrCAD design elements
- 3D STEP models for mechanical verification
Quality and Reliability
Manufacturing Standards
| Standard |
Compliance |
| RoHS |
ROHS3 Compliant (lead-free) |
| Quality System |
ISO 9001 certified manufacturing |
| Reliability Testing |
Full qualification per JEDEC standards |
| ESD Protection |
Built-in protection on all I/O pins |
Anti-Static Handling
All devices ship with proper ESD protection:
- Anti-static packaging materials
- Moisture sensitivity level (MSL) rating
- Proper handling and storage guidelines
- ESD workstation recommendations
Pricing and Availability
The XC3SD1800A-4FGG676I is available through authorized distributors worldwide. Pricing varies based on:
- Order quantity (volume discounts available)
- Lead time requirements
- Distribution channel
- Current market conditions
Typical Lead Time: 30 weeks (manufacturer standard)
Packaging Options: Tray packaging for production volumes
Getting Started with XC3SD1800A-4FGG676I
Recommended Development Flow
- Requirements Definition: Specify system requirements and interface standards
- Architecture Design: Partition functionality between hardware and software
- HDL Coding: Implement design using VHDL or Verilog
- Simulation: Verify functionality using behavioral and timing simulation
- Synthesis: Generate gate-level netlist optimized for Spartan-3A DSP
- Implementation: Place and route design within FPGA fabric
- Timing Analysis: Verify timing constraints are met
- Programming: Configure device and perform hardware validation
- System Integration: Test complete system with target interfaces
Evaluation and Development Boards
While specific evaluation boards vary, typical development platforms include:
- Reference designs demonstrating key features
- Breakout boards for prototyping
- Starter kits with example projects
- Educational platforms for learning FPGA design
Frequently Asked Questions
Q: What design tools are compatible with this FPGA?
The XC3SD1800A-4FGG676I is supported by both Xilinx ISE Design Suite (legacy) and can be migrated to Vivado Design Suite workflows. ISE provides native support optimized for Spartan-3A DSP architecture.
Q: Can I use this FPGA for beginners’ projects?
While this is a production-grade device, it can be used for advanced learning projects. However, beginners might start with smaller Spartan devices or development boards with better documentation and examples.
Q: What is the difference between speed grades?
Speed grade -4 represents the standard performance tier, while -5 offers enhanced timing performance for designs requiring higher operating frequencies.
Q: How does this compare to modern FPGA families?
The Spartan-3A DSP offers proven technology with extensive legacy support. Modern families like Artix-7 or Spartan-7 provide better power efficiency and higher performance but may require design migration.
Conclusion
The XC3SD1800A-4FGG676I represents an excellent balance of performance, features, and cost-effectiveness for DSP-intensive applications. With 1.8 million system gates, dedicated DSP48A slices, and 519 I/O pins in a compact 676-pin FBGA package, this Xilinx FPGA delivers the resources needed for complex digital signal processing, communications, and control applications.
Whether you’re developing telecommunications equipment, industrial automation systems, medical devices, or aerospace applications, the XC3SD1800A-4FGG676I provides the programmable logic resources and DSP acceleration to meet demanding performance requirements while maintaining design flexibility.
For technical support, detailed datasheets, pricing information, and ordering details, contact authorized AMD/Xilinx distributors or visit official semiconductor distributor websites.
