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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC3SD1800A-4CSG484C: High-Performance AMD Spartan-3A DSP FPGA for Advanced Digital Signal Processing

Product Details

Overview of XC3SD1800A-4CSG484C FPGA

The XC3SD1800A-4CSG484C is a powerful field-programmable gate array (FPGA) from AMD’s renowned Spartan-3A DSP family. This advanced FPGA delivers exceptional performance for digital signal processing, embedded systems, and complex logic applications. With 1.8 million system gates and 37,440 logic cells, the XC3SD1800A-4CSG484C provides engineers with the computational power needed for demanding applications in telecommunications, industrial automation, and consumer electronics.

Originally designed by Xilinx (now part of AMD), this Xilinx FPGA continues to be a trusted solution for designers seeking reliable, high-performance programmable logic devices.

Key Technical Specifications

Core Features Table

Specification Details
Part Number XC3SD1800A-4CSG484C
Manufacturer AMD (formerly Xilinx)
Product Family Spartan-3A DSP
System Gates 1,800,000 (1.8M)
Logic Cells/Elements 37,440
LABs/CLBs 4,160
DSP48 Slices 84 dedicated slices
Maximum Operating Frequency 667 MHz
Process Technology 90nm CMOS

Memory and I/O Specifications

Parameter Value
Total RAM Bits 1,548,288 (189 KB)
Block RAM 3,456 Kbits
Number of I/O Pins 309
I/O Standards Supported LVCMOS, LVTTL, HSTL, SSTL, True LVDS, RSDS, mini-LVDS
I/O Output Drive Current 24 mA

Power and Environmental Specifications

Parameter Specification
Supply Voltage 1.2V nominal (1.14V – 1.26V range)
Operating Temperature Range 0°C to 85°C (Commercial Extended)
Package Type 484-FBGA, CSPBGA
Package Dimensions 19mm x 19mm
Mounting Type Surface Mount
RoHS Compliance RoHS3 Compliant, Lead-Free

Advanced DSP Capabilities

Digital Signal Processing Features

The XC3SD1800A-4CSG484C excels in DSP applications thanks to its 84 dedicated DSP48 slices. These optimized hardware blocks enable:

  • High-speed arithmetic operations for real-time signal processing
  • Efficient FIR filter implementations with minimal resource usage
  • FFT processing for frequency domain analysis
  • Complex mathematical computations at 667 MHz performance
  • Low-latency data path operations critical for time-sensitive applications

Memory Architecture

With nearly 1.55 million RAM bits distributed across the device, the XC3SD1800A-4CSG484C offers flexible memory solutions:

  • Distributed RAM for small, fast memory requirements
  • Block RAM organized as 3,456 Kbits for larger data buffers
  • Dual-port memory configurations for simultaneous read/write operations
  • Efficient data storage for algorithm implementation

Package and Pin Configuration

CSG484 Package Details

The 484-pin CSPBGA (Chip Scale Ball Grid Array) package provides:

  • Compact 19mm x 19mm footprint for space-constrained designs
  • Superior thermal performance with efficient heat dissipation
  • Excellent signal integrity for high-speed applications
  • Ball pitch optimized for reliable PCB assembly
  • 309 user I/O pins for flexible connectivity

Pin Configuration Overview

Pin Type Count
User I/O Pins 309
Power Pins Multiple VCCINT, VCCAUX, VCCO
Ground Pins Distributed GND
Configuration Pins JTAG, SPI, SelectMAP
Total Package Pins 484

Target Applications

Industrial and Commercial Applications

The XC3SD1800A-4CSG484C is ideal for:

Telecommunications

  • Software-defined radio (SDR) implementations
  • Base station signal processing
  • Protocol converters and bridges
  • Digital up/down converters

Industrial Automation

  • Machine vision systems with real-time image processing
  • Motor control algorithms with precise PWM generation
  • Industrial communication protocols (EtherCAT, PROFINET, Modbus)
  • PLC functionality with programmable logic

Consumer Electronics

  • Audio/video processing and codec implementations
  • Display controllers for LCD/OLED panels
  • Digital camera processing pipelines
  • Set-top box applications

Data Acquisition Systems

  • High-speed ADC interfaces with data buffering
  • Sensor fusion algorithms combining multiple inputs
  • Real-time data logging with compression
  • Signal conditioning and filtering

Development Tools and Support

Design Software Compatibility

The XC3SD1800A-4CSG484C is supported by:

  • Xilinx ISE Design Suite – Legacy but proven development environment
  • VHDL and Verilog hardware description languages
  • IP Core libraries with pre-verified functions
  • Embedded development tools for soft processor cores

Programming and Configuration

Multiple configuration methods supported:

  • JTAG boundary scan for in-system programming
  • SPI serial flash for automatic configuration at power-up
  • SelectMAP parallel configuration for faster load times
  • Slave serial mode for daisy-chain configurations

Performance Advantages

Speed Grade -4 Benefits

The -4 speed grade designation indicates:

  • Enhanced performance over slower speed grades (-3, -2)
  • Higher maximum operating frequencies for critical paths
  • Reduced propagation delays through logic and routing
  • Optimal balance between performance and power consumption

Competitive Advantages

Feature Advantage
1.8M Gates Sufficient resources for complex designs
84 DSP Slices Dedicated hardware accelerates DSP algorithms
90nm Technology Mature, reliable process node
309 I/O Pins Extensive connectivity options
667 MHz Operation High-speed real-time processing

Quality and Reliability

Manufacturing Standards

  • RoHS3 compliant meeting latest environmental regulations
  • Lead-free (Pbfree) construction for eco-friendly designs
  • Industrial temperature range (0°C to 85°C) for harsh environments
  • Rigorous testing per AMD/Xilinx quality standards

Supply Chain Information

  • Product Status: Active
  • Manufacturer Lead Time: Approximately 30 weeks
  • Packaging: Anti-static tray packaging
  • ESD Protection: Full electrostatic discharge protection during shipping

Getting Started Guide

Design Checklist

  1. Power Supply Design: Implement proper 1.2V core and I/O voltage regulation
  2. Decoupling: Place bypass capacitors close to power pins
  3. Thermal Management: Ensure adequate cooling for high-utilization designs
  4. Clock Distribution: Use dedicated clock resources for optimal performance
  5. I/O Planning: Assign pins according to bank voltage requirements

Recommended PCB Guidelines

  • Minimum 6-layer PCB for signal integrity
  • Controlled impedance traces for high-speed signals
  • Adequate ground planes for power distribution
  • Via-in-pad technology for BGA mounting

Pricing and Availability

The XC3SD1800A-4CSG484C is available through authorized distributors worldwide. Pricing varies based on:

  • Order quantity (volume discounts available)
  • Lead time requirements (expedited vs. standard)
  • Distribution channel (authorized vs. franchised)

Educational institutions may qualify for special academic pricing programs.

Alternative and Compatible Devices

Speed Grade Variants

Part Number Speed Grade Key Difference
XC3SD1800A-5CSG484C -5 Faster performance
XC3SD1800A-4CSG484C -4 Balanced performance (this device)
XC3SD1800A-3CSG484C -3 Lower cost option

Package Alternatives

Other Spartan-3A DSP devices in different packages:

  • XC3SD1800A-4FGG676 – Larger 676-pin package with more I/O
  • XC3SD1800A-4FG484 – Standard FBGA variant

Frequently Asked Questions

What is the operating frequency of the XC3SD1800A-4CSG484C?

The maximum operating frequency is 667 MHz, though actual performance depends on design complexity and routing.

Is the XC3SD1800A-4CSG484C RoHS compliant?

Yes, this device is fully RoHS3 compliant and uses lead-free construction.

What development tools are required?

Xilinx ISE Design Suite is the primary development environment for this Spartan-3A DSP device.

Can this FPGA be used for motor control applications?

Absolutely. The dedicated DSP slices and high I/O count make it excellent for advanced motor control algorithms.

What is the difference between speed grades?

Higher speed grades (-5, -6) offer faster maximum frequencies but at higher cost. The -4 grade provides excellent performance-to-cost ratio.

Conclusion

The XC3SD1800A-4CSG484C represents a mature, proven FPGA solution from AMD’s Spartan-3A DSP family. With 1.8 million gates, 84 DSP slices, and 667 MHz performance, it delivers the computational power needed for demanding embedded applications. Whether you’re implementing telecommunications infrastructure, industrial automation systems, or consumer electronics products, this FPGA provides the flexibility, performance, and reliability required for successful product development.

For designers seeking a cost-effective FPGA with robust DSP capabilities, the XC3SD1800A-4CSG484C continues to be an excellent choice backed by extensive ecosystem support and proven design heritage.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.