Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC3SD1800A-4CS484LI: High-Performance Spartan-3A DSP FPGA for Advanced Digital Signal Processing

Product Details

The XC3SD1800A-4CS484LI is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-3A DSP family. This programmable logic device delivers exceptional digital signal processing capabilities, making it the ideal solution for high-volume, cost-sensitive applications requiring robust performance and flexibility.

Product Overview: XC3SD1800A-4CS484LI FPGA Specifications

The XC3SD1800A-4CS484LI combines advanced 90nm process technology with impressive computational resources, offering engineers a versatile platform for implementing complex digital designs. This Xilinx FPGA delivers outstanding performance-per-dollar value in embedded systems and signal processing applications.

Key Technical Specifications

Parameter Specification Details
Part Number XC3SD1800A-4CS484LI Lead-Free, Industrial Grade
Product Family Spartan-3A DSP Extended Spartan-3A Series
Logic Cells 37,440 Cells 1.8 Million System Gates
DSP Slices XtremeDSP DSP48A Advanced DSP Processing
RAM Capacity 189 KB (1,548,288 bits) Embedded Block RAM
I/O Pins 309 User I/O High Connectivity
Package Type 484-Pin LCSBGA 19mm x 19mm BGA
Operating Voltage 1.2V Core Low Power Design
Temperature Range -40°C to +100°C Industrial Temperature Grade
Speed Grade -4 250 MHz Block RAM/DSP Performance
Technology Node 90nm CMOS Proven Manufacturing Process

Advanced Features and Capabilities

Digital Signal Processing Excellence

The XC3SD1800A-4CS484LI FPGA incorporates XtremeDSP DSP48A slices, providing dedicated hardware acceleration for demanding signal processing tasks. These enhanced DSP blocks deliver:

  • High-speed multiply-accumulate (MAC) operations at 250 MHz
  • 18×18 bit multipliers with extended precision
  • Pre-adders for efficient FIR filter implementations
  • Cascade connections for building larger DSP functions

Memory Architecture

Memory Type Capacity Performance
Block RAM 1,548,288 bits (189 KB) 250 MHz clock frequency
Distributed RAM Flexible LUT-based Integrated with logic fabric
Configuration Memory SRAM-based In-system reprogrammable

Programmable Logic Resources

The FPGA’s logic fabric consists of:

  • 4,160 Configurable Logic Blocks (CLBs)
  • 37,440 Logic Cells for complex combinational and sequential logic
  • 1.8 Million System Gates equivalent capacity
  • Dedicated carry chains for arithmetic operations
  • Fast look-up table (LUT) based logic implementation

Technical Performance Specifications

Clock Management and Timing

Clock Feature Specification
Digital Clock Managers (DCM) 4 DCMs for clock synthesis
Maximum Frequency 667 MHz (fabric dependent)
DSP/Block RAM Speed 250 MHz guaranteed
Phase-Locked Loop Integrated PLL functionality
Clock Distribution Low-skew global routing

Power Consumption Characteristics

The XC3SD1800A-4CS484LI features optimized power management:

  • Core voltage: 1.2V for reduced power consumption
  • I/O voltage: Supports 1.2V to 3.3V standards
  • Low static power dissipation
  • Dynamic power scaling based on resource utilization
  • Sleep modes for energy-efficient operation

Primary Applications and Use Cases

Telecommunications and Networking

The XC3SD1800A-4CS484LI excels in communication infrastructure:

  • Wireless base station processing
  • Software-defined radio (SDR) implementations
  • Protocol converters and bridges
  • Network packet processing
  • Digital up/down converters

Industrial Automation and Control

Ideal for industrial applications requiring:

  • Motor control algorithms
  • Machine vision processing
  • Industrial protocol implementations
  • Real-time control systems
  • Sensor data acquisition and processing

Digital Signal Processing Applications

Perfect for DSP-intensive tasks:

  • Audio/video processing and encoding
  • Image processing and enhancement
  • Adaptive filtering implementations
  • FFT/IFFT processing
  • Digital beamforming

Consumer Electronics

Suitable for cost-sensitive consumer products:

  • Digital television equipment
  • Display and projection systems
  • Home networking devices
  • Broadband access equipment
  • Set-top boxes

Package and Pinout Information

LCSBGA-484 Package Details

Package Characteristic Value
Package Type LCSBGA (Low-profile Chip Scale BGA)
Total Pins 484
Package Dimensions 19mm x 19mm
Ball Pitch 0.8mm
Package Height Low-profile design
Thermal Performance Enhanced thermal dissipation

Pin Distribution

  • 309 User I/O pins for general purpose connectivity
  • Dedicated configuration pins
  • Power and ground pins distributed for optimal signal integrity
  • Multi-standard I/O support (LVTTL, LVCMOS, LVDS, etc.)

Development and Programming Support

Design Tools Compatibility

The XC3SD1800A-4CS484LI is fully supported by:

  • ISE Design Suite – Complete FPGA development environment
  • Vivado Design Suite – Next-generation design tools
  • EDK (Embedded Development Kit) – For embedded processor integration
  • ChipScope Pro – On-chip debugging and analysis
  • IP Core libraries – Pre-verified design modules

Configuration Options

Multiple configuration methods supported:

  • JTAG boundary scan programming
  • Master/Slave Serial configuration
  • Parallel configuration modes
  • SPI Flash configuration
  • Platform Flash PROM support

Quality and Reliability Standards

Manufacturing Quality

  • RoHS Compliant – Lead-free manufacturing
  • Moisture Sensitivity Level: MSL 3 (168 hours)
  • Tested to Xilinx quality standards
  • Industrial temperature grade (-40°C to +100°C)
  • Extended product lifecycle support

Reliability Features

  • Built-in configuration memory error detection
  • SEU (Single Event Upset) mitigation capabilities
  • Readback and verification support
  • Built-in self-test (BIST) capabilities

Comparison with Related Spartan-3A DSP Devices

Part Number Logic Cells DSP Slices Block RAM I/O Count
XC3SD1800A 37,440 84 DSP48A 189 KB 309
XC3SD3400A 53,712 126 DSP48A 270 KB 469

Technical Support and Documentation

Available Resources

  • Comprehensive datasheets with AC/DC specifications
  • Application notes for design implementation
  • Reference designs and example projects
  • Technical support from AMD Xilinx
  • Active user community and forums

Why Choose the XC3SD1800A-4CS484LI?

Key Advantages

  1. Cost-Effective DSP Processing – Exceptional price-to-performance ratio for signal processing applications
  2. Proven 90nm Technology – Mature, reliable manufacturing process
  3. Flexible Architecture – Reconfigurable platform adapts to changing requirements
  4. Comprehensive Tool Support – Industry-standard development tools and IP libraries
  5. Wide Temperature Range – Industrial-grade operation from -40°C to +100°C
  6. Low Power Consumption – 1.2V core voltage reduces system power requirements

Design Flexibility Benefits

  • In-system reprogrammability eliminates hardware redesign costs
  • Field upgradeable firmware capabilities
  • Rapid prototyping and time-to-market advantages
  • No NRE costs compared to ASIC development
  • Concurrent hardware/software development

Technical Implementation Guidelines

PCB Design Considerations

When implementing the XC3SD1800A-4CS484LI in your design:

  • Follow Xilinx PCB design guidelines for signal integrity
  • Provide adequate power supply decoupling (0.1µF and 10µF capacitors)
  • Implement proper thermal management for sustained operation
  • Use appropriate termination for high-speed I/O signals
  • Consider controlled impedance routing for critical signals

Power Supply Requirements

Supply Rail Voltage Purpose
VCCINT 1.2V Core logic power
VCCAUX 2.5V/3.3V Auxiliary circuits
VCCO 1.2V – 3.3V I/O bank power

Ordering and Availability Information

The XC3SD1800A-4CS484LI is available through authorized distributors and direct from AMD Xilinx. The part number breakdown:

  • XC3SD1800A – Device family and density
  • -4 – Speed grade
  • CS484 – Package type (CSBGA, 484 pins)
  • L – Low-profile package variant
  • I – Industrial temperature range (-40°C to +100°C)

Summary: XC3SD1800A-4CS484LI Technical Specifications

The XC3SD1800A-4CS484LI represents an optimal balance of DSP performance, logic capacity, and cost-effectiveness. With 37,440 logic cells, 84 DSP48A slices, and 189 KB of block RAM in a compact 484-pin LCSBGA package, this FPGA delivers the computational resources needed for demanding signal processing applications.

Whether you’re developing telecommunications equipment, industrial control systems, consumer electronics, or embedded processing solutions, the XC3SD1800A-4CS484LI provides the programmable logic capabilities, DSP acceleration, and flexibility required for successful product development.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.