The XC3S5000-5FG900C is a high-performance Field-Programmable Gate Array (FPGA) from the AMD Xilinx Spartan®-3 family. Engineered for cost-sensitive, high-volume applications, this device delivers 5 million system gates, 74,880 logic cells, and a maximum frequency of 725 MHz — all within a compact 900-Pin FBGA package. Whether you are designing broadband access equipment, home networking solutions, or embedded industrial systems, the XC3S5000-5FG900C offers the programmability and performance you need.
What Is the XC3S5000-5FG900C?
The XC3S5000-5FG900C is the flagship density device in the Xilinx Spartan-3 FPGA series. Manufactured on advanced 90nm CMOS process technology, it features a 1.2V core supply voltage and is housed in a 900-Ball Fine-Pitch Ball Grid Array (FBGA) package. It is part of the broader family of Xilinx FPGA solutions that span consumer electronics, communications, and industrial automation.
The “5” speed grade in the part number indicates this is the fastest commercial-temperature variant in its class, operating from 0°C to 85°C (TJ), making it ideal for commercial and industrial-grade designs.
XC3S5000-5FG900C Key Specifications
General Overview Table
| Parameter |
Value |
| Manufacturer |
AMD Xilinx |
| Part Number |
XC3S5000-5FG900C |
| Series |
Spartan®-3 |
| Part Status |
Active (Last Time Buy) |
| Technology |
90nm CMOS |
| Core Voltage |
1.2V (1.14V – 1.26V) |
| Speed Grade |
-5 (Fastest Commercial) |
| Max Frequency |
725 MHz |
| Operating Temperature |
0°C ~ 85°C (TJ) |
| Mounting Type |
Surface Mount |
| Package / Case |
900-BBGA (FBGA) |
| Package Dimensions |
31mm × 31mm |
| Terminal Pitch |
1.0 mm |
| RoHS Status |
Non-RoHS Compliant |
XC3S5000-5FG900C Logic Resources & Architecture
Logic Capacity Table
| Resource |
Quantity |
| System Gates |
5,000,000 |
| Logic Cells (CLBs) |
74,880 |
| Flip-Flops |
74,880 |
| Total Block RAM Bits |
1,916,928 |
| Block RAM (kB) |
234 kB |
| Dedicated Multipliers |
104 |
| Digital Clock Managers (DCMs) |
4 |
| Maximum User I/O |
633 |
I/O and Connectivity
| I/O Parameter |
Value |
| Number of User I/O Pins |
633 |
| I/O Standards Supported |
LVCMOS, LVTTL, HSTL, SSTL, LVDS, and more |
| SelectIO™ Interface |
Yes |
| JTAG Boundary Scan |
Yes |
| Dedicated Configuration Pins |
Yes |
XC3S5000-5FG900C Package Information
Package Details Table
| Package Attribute |
Detail |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| JEDEC Code |
S-PBGA-B900 |
| Pin Count |
900 |
| Ball Grid Dimensions |
30 × 30 array |
| Body Size |
31mm × 31mm |
| Ball Pitch |
1.0 mm |
| Ball Height |
40 mils |
| Mounting |
Surface Mount (SMT) |
XC3S5000-5FG900C Features & Architecture
#### Configurable Logic Blocks (CLBs)
The XC3S5000-5FG900C contains 74,880 logic cells organized into Configurable Logic Blocks (CLBs). Each CLB includes four-input Look-Up Tables (LUTs) and flip-flops capable of handling complex combinational and sequential logic functions. The CLB array provides maximum routing flexibility and high logic density.
#### Block RAM
With 1,916,928 total RAM bits (approximately 234 kB), the XC3S5000-5FG900C provides extensive on-chip memory for buffering, lookup tables, and FIFO implementations. Block RAMs can be configured as single-port or dual-port memories for maximum design flexibility.
#### Dedicated Multipliers
The device includes 104 dedicated 18×18-bit hardware multipliers, enabling high-speed DSP operations such as FIR filtering, FFT computation, and digital signal processing without consuming CLB resources.
#### Digital Clock Manager (DCM)
Four on-chip Digital Clock Managers (DCMs) provide advanced clock control capabilities including frequency synthesis, phase shifting, and duty cycle correction. The DCM is derived from the proven Virtex-II platform technology.
#### SelectIO™ Interface
The SelectIO interface supports a wide range of I/O standards, making the XC3S5000-5FG900C compatible with modern memory interfaces and high-speed serial communication protocols.
XC3S5000-5FG900C Ordering & Availability
Part Number Decoder
| Part Number Segment |
Meaning |
| XC3S |
Spartan-3 Series |
| 5000 |
5,000,000 System Gates |
| -5 |
Speed Grade (fastest commercial) |
| FG |
Fine-Pitch Ball Grid Array |
| 900 |
900-Pin Package |
| C |
Commercial Temperature (0°C to 85°C) |
Ordering Information Table
| Part Number |
Speed Grade |
Package |
Temperature Range |
| XC3S5000-4FG900C |
-4 |
900-FBGA |
Commercial |
| XC3S5000-5FG900C |
-5 |
900-FBGA |
Commercial |
| XC3S5000-4FG900I |
-4 |
900-FBGA |
Industrial |
| XC3S5000-4FG676C |
-4 |
676-FBGA |
Commercial |
Applications of the XC3S5000-5FG900C
The XC3S5000-5FG900C is specifically engineered for cost-sensitive, high-volume applications. Its rich feature set and large gate count make it suitable for a broad range of use cases:
- Broadband Access Equipment – DSL modems, cable modems, and optical network units
- Home Networking – Wi-Fi routers, Ethernet switches, and gateway devices
- Display & Projection Systems – LCD controllers, video scalers, and image processing pipelines
- Industrial Automation – Motor control, PLC interfaces, and sensor processing
- Communications Infrastructure – Wireless base stations, protocol bridges, and line cards
- Automotive Electronics – Body control modules and infotainment systems
- Test & Measurement – Logic analyzers, oscilloscopes, and data acquisition systems
- Consumer Electronics – Set-top boxes, digital cameras, and portable media devices
XC3S5000-5FG900C vs. Alternatives
Spartan-3 Family Comparison
| Device |
Gates |
Logic Cells |
Max I/O |
Block RAM |
| XC3S50 |
50K |
1,728 |
124 |
12 kB |
| XC3S200 |
200K |
4,320 |
173 |
30 kB |
| XC3S1000 |
1M |
17,280 |
391 |
120 kB |
| XC3S2000 |
2M |
46,080 |
565 |
192 kB |
| XC3S5000 |
5M |
74,880 |
633 |
234 kB |
The XC3S5000-5FG900C is the highest-density member of the Spartan-3 family, offering maximum resources for logic-intensive applications.
Why Choose the XC3S5000-5FG900C?
The XC3S5000-5FG900C is a proven, field-tested FPGA that combines high logic capacity with cost efficiency. Unlike mask-programmed ASICs, this FPGA eliminates high NRE (Non-Recurring Engineering) costs, accelerates time-to-market, and supports in-field design updates with no hardware replacement required.
Key advantages include:
- High Gate Density – 5 million gates for complex logic implementations
- Fast Speed Grade – The -5 speed grade delivers up to 725 MHz performance
- Rich I/O – 633 user I/O pins with support for multiple I/O standards
- Large On-Chip Memory – 234 kB of block RAM for data buffering and storage
- DSP Capability – 104 dedicated multipliers for high-throughput math operations
- Flexible Clocking – 4 DCMs for advanced clock management
- Cost-Effective – Derived from Virtex-II technology at Spartan pricing
Frequently Asked Questions (FAQ)
Q: What is the XC3S5000-5FG900C? A: It is a Xilinx Spartan-3 FPGA with 5 million system gates, 74,880 logic cells, and 633 I/O pins in a 900-pin FBGA package, running at up to 725 MHz with a 1.2V core supply.
Q: What is the operating temperature range of the XC3S5000-5FG900C? A: The “C” suffix denotes a commercial temperature range of 0°C to 85°C (TJ).
Q: Is the XC3S5000-5FG900C RoHS compliant? A: No, the XC3S5000-5FG900C is non-RoHS compliant. If lead-free compliance is required, consult the manufacturer for alternative variants.
Q: What development tools support the XC3S5000-5FG900C? A: Xilinx ISE Design Suite (WebPACK and full versions) fully supports the XC3S5000-5FG900C, including synthesis, place-and-route, and programming via JTAG.
Q: What is the difference between XC3S5000-4FG900C and XC3S5000-5FG900C? A: The -5 speed grade (XC3S5000-5FG900C) is faster, supporting up to 725 MHz, compared to the -4 speed grade (XC3S5000-4FG900C) which tops out at approximately 630 MHz.
Conclusion
The XC3S5000-5FG900C is one of the most capable and cost-effective FPGAs in the Xilinx Spartan-3 family. With 5 million system gates, 633 I/O pins, 234 kB of block RAM, 104 hardware multipliers, and a 725 MHz speed grade, it is the go-to solution for high-density programmable logic designs. Its 900-pin FBGA package provides broad routing flexibility while maintaining a compact PCB footprint.
For engineers seeking a robust, proven, and highly capable FPGA solution, the XC3S5000-5FG900C delivers exceptional value across communications, industrial, consumer, and automotive applications.