Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC3S5000-5FG900C: Xilinx Spartan-3 FPGA – Complete Datasheet & Specifications

Product Details

The XC3S5000-5FG900C is a high-performance Field-Programmable Gate Array (FPGA) from the AMD Xilinx Spartan®-3 family. Engineered for cost-sensitive, high-volume applications, this device delivers 5 million system gates, 74,880 logic cells, and a maximum frequency of 725 MHz — all within a compact 900-Pin FBGA package. Whether you are designing broadband access equipment, home networking solutions, or embedded industrial systems, the XC3S5000-5FG900C offers the programmability and performance you need.


What Is the XC3S5000-5FG900C?

The XC3S5000-5FG900C is the flagship density device in the Xilinx Spartan-3 FPGA series. Manufactured on advanced 90nm CMOS process technology, it features a 1.2V core supply voltage and is housed in a 900-Ball Fine-Pitch Ball Grid Array (FBGA) package. It is part of the broader family of Xilinx FPGA solutions that span consumer electronics, communications, and industrial automation.

The “5” speed grade in the part number indicates this is the fastest commercial-temperature variant in its class, operating from 0°C to 85°C (TJ), making it ideal for commercial and industrial-grade designs.


XC3S5000-5FG900C Key Specifications

General Overview Table

Parameter Value
Manufacturer AMD Xilinx
Part Number XC3S5000-5FG900C
Series Spartan®-3
Part Status Active (Last Time Buy)
Technology 90nm CMOS
Core Voltage 1.2V (1.14V – 1.26V)
Speed Grade -5 (Fastest Commercial)
Max Frequency 725 MHz
Operating Temperature 0°C ~ 85°C (TJ)
Mounting Type Surface Mount
Package / Case 900-BBGA (FBGA)
Package Dimensions 31mm × 31mm
Terminal Pitch 1.0 mm
RoHS Status Non-RoHS Compliant

XC3S5000-5FG900C Logic Resources & Architecture

Logic Capacity Table

Resource Quantity
System Gates 5,000,000
Logic Cells (CLBs) 74,880
Flip-Flops 74,880
Total Block RAM Bits 1,916,928
Block RAM (kB) 234 kB
Dedicated Multipliers 104
Digital Clock Managers (DCMs) 4
Maximum User I/O 633

I/O and Connectivity

I/O Parameter Value
Number of User I/O Pins 633
I/O Standards Supported LVCMOS, LVTTL, HSTL, SSTL, LVDS, and more
SelectIO™ Interface Yes
JTAG Boundary Scan Yes
Dedicated Configuration Pins Yes

XC3S5000-5FG900C Package Information

Package Details Table

Package Attribute Detail
Package Type Fine-Pitch Ball Grid Array (FBGA)
JEDEC Code S-PBGA-B900
Pin Count 900
Ball Grid Dimensions 30 × 30 array
Body Size 31mm × 31mm
Ball Pitch 1.0 mm
Ball Height 40 mils
Mounting Surface Mount (SMT)

XC3S5000-5FG900C Features & Architecture

#### Configurable Logic Blocks (CLBs)

The XC3S5000-5FG900C contains 74,880 logic cells organized into Configurable Logic Blocks (CLBs). Each CLB includes four-input Look-Up Tables (LUTs) and flip-flops capable of handling complex combinational and sequential logic functions. The CLB array provides maximum routing flexibility and high logic density.

#### Block RAM

With 1,916,928 total RAM bits (approximately 234 kB), the XC3S5000-5FG900C provides extensive on-chip memory for buffering, lookup tables, and FIFO implementations. Block RAMs can be configured as single-port or dual-port memories for maximum design flexibility.

#### Dedicated Multipliers

The device includes 104 dedicated 18×18-bit hardware multipliers, enabling high-speed DSP operations such as FIR filtering, FFT computation, and digital signal processing without consuming CLB resources.

#### Digital Clock Manager (DCM)

Four on-chip Digital Clock Managers (DCMs) provide advanced clock control capabilities including frequency synthesis, phase shifting, and duty cycle correction. The DCM is derived from the proven Virtex-II platform technology.

#### SelectIO™ Interface

The SelectIO interface supports a wide range of I/O standards, making the XC3S5000-5FG900C compatible with modern memory interfaces and high-speed serial communication protocols.


XC3S5000-5FG900C Ordering & Availability

Part Number Decoder

Part Number Segment Meaning
XC3S Spartan-3 Series
5000 5,000,000 System Gates
-5 Speed Grade (fastest commercial)
FG Fine-Pitch Ball Grid Array
900 900-Pin Package
C Commercial Temperature (0°C to 85°C)

Ordering Information Table

Part Number Speed Grade Package Temperature Range
XC3S5000-4FG900C -4 900-FBGA Commercial
XC3S5000-5FG900C -5 900-FBGA Commercial
XC3S5000-4FG900I -4 900-FBGA Industrial
XC3S5000-4FG676C -4 676-FBGA Commercial

Applications of the XC3S5000-5FG900C

The XC3S5000-5FG900C is specifically engineered for cost-sensitive, high-volume applications. Its rich feature set and large gate count make it suitable for a broad range of use cases:

  • Broadband Access Equipment – DSL modems, cable modems, and optical network units
  • Home Networking – Wi-Fi routers, Ethernet switches, and gateway devices
  • Display & Projection Systems – LCD controllers, video scalers, and image processing pipelines
  • Industrial Automation – Motor control, PLC interfaces, and sensor processing
  • Communications Infrastructure – Wireless base stations, protocol bridges, and line cards
  • Automotive Electronics – Body control modules and infotainment systems
  • Test & Measurement – Logic analyzers, oscilloscopes, and data acquisition systems
  • Consumer Electronics – Set-top boxes, digital cameras, and portable media devices

XC3S5000-5FG900C vs. Alternatives

Spartan-3 Family Comparison

Device Gates Logic Cells Max I/O Block RAM
XC3S50 50K 1,728 124 12 kB
XC3S200 200K 4,320 173 30 kB
XC3S1000 1M 17,280 391 120 kB
XC3S2000 2M 46,080 565 192 kB
XC3S5000 5M 74,880 633 234 kB

The XC3S5000-5FG900C is the highest-density member of the Spartan-3 family, offering maximum resources for logic-intensive applications.


Why Choose the XC3S5000-5FG900C?

The XC3S5000-5FG900C is a proven, field-tested FPGA that combines high logic capacity with cost efficiency. Unlike mask-programmed ASICs, this FPGA eliminates high NRE (Non-Recurring Engineering) costs, accelerates time-to-market, and supports in-field design updates with no hardware replacement required.

Key advantages include:

  • High Gate Density – 5 million gates for complex logic implementations
  • Fast Speed Grade – The -5 speed grade delivers up to 725 MHz performance
  • Rich I/O – 633 user I/O pins with support for multiple I/O standards
  • Large On-Chip Memory – 234 kB of block RAM for data buffering and storage
  • DSP Capability – 104 dedicated multipliers for high-throughput math operations
  • Flexible Clocking – 4 DCMs for advanced clock management
  • Cost-Effective – Derived from Virtex-II technology at Spartan pricing

Frequently Asked Questions (FAQ)

Q: What is the XC3S5000-5FG900C? A: It is a Xilinx Spartan-3 FPGA with 5 million system gates, 74,880 logic cells, and 633 I/O pins in a 900-pin FBGA package, running at up to 725 MHz with a 1.2V core supply.

Q: What is the operating temperature range of the XC3S5000-5FG900C? A: The “C” suffix denotes a commercial temperature range of 0°C to 85°C (TJ).

Q: Is the XC3S5000-5FG900C RoHS compliant? A: No, the XC3S5000-5FG900C is non-RoHS compliant. If lead-free compliance is required, consult the manufacturer for alternative variants.

Q: What development tools support the XC3S5000-5FG900C? A: Xilinx ISE Design Suite (WebPACK and full versions) fully supports the XC3S5000-5FG900C, including synthesis, place-and-route, and programming via JTAG.

Q: What is the difference between XC3S5000-4FG900C and XC3S5000-5FG900C? A: The -5 speed grade (XC3S5000-5FG900C) is faster, supporting up to 725 MHz, compared to the -4 speed grade (XC3S5000-4FG900C) which tops out at approximately 630 MHz.


Conclusion

The XC3S5000-5FG900C is one of the most capable and cost-effective FPGAs in the Xilinx Spartan-3 family. With 5 million system gates, 633 I/O pins, 234 kB of block RAM, 104 hardware multipliers, and a 725 MHz speed grade, it is the go-to solution for high-density programmable logic designs. Its 900-pin FBGA package provides broad routing flexibility while maintaining a compact PCB footprint.

For engineers seeking a robust, proven, and highly capable FPGA solution, the XC3S5000-5FG900C delivers exceptional value across communications, industrial, consumer, and automotive applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.