The XC3S5000-4FGG676C is a high-density, cost-optimized Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-3 family. Manufactured on a 90nm CMOS process node and housed in a compact 676-pin Fine-pitch Ball Grid Array (FBGA) package, this device delivers 5 million system gates alongside a rich set of embedded logic, memory, and clock management resources — making it one of the most capable members of the Spartan-3 generation for volume-driven digital design.

Whether you are building broadband access equipment, industrial control systems, display processors, or digital television hardware, the XC3S5000-4FGG676C offers the performance, flexibility, and competitive cost profile that engineers demand. For those exploring the full range of programmable logic solutions, Xilinx FPGA options span from entry-level to high-performance, covering virtually every application domain.

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What Is the XC3S5000-4FGG676C? Decoding the Part Number

Understanding the part number helps engineers quickly identify the device variant:

The “FGG” designation confirms this is the Pb-free (RoHS-compliant) variant of the 676-pin BGA package, distinguishing it from the standard “FG” package. The commercial “C” suffix indicates operation within 0°C to +85°C (TJ), suitable for the vast majority of industrial and consumer electronics environments.

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XC3S5000-4FGG676C Key Specifications at a Glance

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Architecture Deep Dive: What Makes the XC3S5000-4FGG676C Powerful

Configurable Logic Blocks (CLBs) and Logic Cells

The XC3S5000-4FGG676C contains 74,880 logic cells organized into 9,360 CLBs. Each CLB consists of four slices, and each slice contains two 4-input Look-Up Tables (LUTs), two storage elements (flip-flops or latches), fast carry logic, and wide multiplexers. The LUTs in left-hand slices can additionally be configured as 16-bit distributed RAM or shift registers (SRL16), greatly expanding flexible memory options without consuming block RAM resources.

Block RAM — Up to 1,728 Kbits of On-Chip Storage

The device integrates 96 true dual-port 18 Kbit block RAM modules, totaling 1,728 Kbits. Each block RAM can be independently configured as single-port or dual-port memory with widths from 1 to 36 bits. This hierarchical SelectRAM™ memory architecture supports efficient data buffering, FIFOs, lookup tables, and local storage for embedded processor designs.

Dedicated 18×18 Multipliers — 104 Blocks for DSP Acceleration

With 104 dedicated 18×18 hardware multipliers, the XC3S5000-4FGG676C provides hard-wired multiply capability for DSP operations such as filtering, correlation, and fast Fourier transforms. Each multiplier delivers pipelined multiplication without consuming CLB resources, significantly improving throughput for signal-processing workloads.

Digital Clock Managers (DCMs) — Precision Clock Control

Four on-chip DCMs provide:

• Clock skew elimination across the device
• Frequency synthesis (multiply and divide input clocks)
• High-resolution phase shifting (fine and coarse)
• Clock mirroring for board-level clock distribution

Eight global clock lines ensure low-skew clock delivery to every flip-flop and block RAM in the device.

SelectIO™ I/O Interface Standards

The 676-pin package exposes up to 489 user I/O pins with comprehensive multi-standard support:

This broad I/O flexibility allows the XC3S5000-4FGG676C to interface directly with DDR/DDR2 memory, high-speed serial links, video interfaces, and a wide variety of processor buses.

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Package Information: FBGA-676

The compact 27×27mm BGA footprint enables dense PCB placement, a key advantage for space-constrained designs. The 1.0mm ball pitch is manageable with standard PCB manufacturing processes, balancing high pin density with assembly yield.

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Ordering Information and Variant Comparison

The XC3S5000 is available in multiple speed grades, temperature ranges, and package options. The table below outlines the most common variants:

For applications requiring extended temperature operation, the XC3S5000-4FGG676I (Industrial grade) covers –40°C to +100°C junction temperature and is a pin-compatible substitute.

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Supported I/O Standards in Detail

Single-Ended Signal Standards (18 Supported)

The XC3S5000-4FGG676C supports 18 single-ended standards including LVTTL and LVCMOS at voltages from 1.5V to 3.3V, along with PCI, GTL, GTL+, HSTL Classes I–IV, and SSTL Classes I and II. This makes it straightforward to connect to legacy 3.3V logic, modern low-voltage interfaces, and memory buses in the same design.

Differential Signal Standards (8 Supported)

Eight differential standards include LVDS (Low Voltage Differential Signaling), RSDS (Reduced Swing Differential Signaling), BLVDS, LVPECL, LVDSEXT, RSDSEXT, and compatible variants. LVDS and RSDS are especially valuable for high-speed, noise-immune data links commonly used in display interfaces, backplane communications, and sensor front-ends.

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XC3S5000-4FGG676C Applications

The XC3S5000-4FGG676C is well-suited to a broad spectrum of applications owing to its combination of high logic density, substantial on-chip memory, dedicated DSP multipliers, and versatile I/O:

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Development Tools and Ecosystem

Xilinx ISE Design Suite

The XC3S5000-4FGG676C is supported by Xilinx ISE Design Suite (the appropriate toolchain for Spartan-3 generation devices). ISE provides synthesis, implementation, timing analysis, and device programming through iMPACT. Designers working with this device should use ISE 14.7, the final version of ISE and the recommended tool for all Spartan-3 targets.

Hardware Description Languages (HDL) Support

Configuration Methods

The XC3S5000-4FGG676C supports multiple configuration interfaces, including Master Serial, Slave Serial, Master SPI, Master BPI (parallel NOR flash), Slave Parallel (SelectMAP), and JTAG. The JTAG port is IEEE 1149.1/1532 compliant, enabling in-circuit programming and boundary-scan testing.

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Absolute Maximum Ratings

Always refer to the official Xilinx DS099 datasheet for complete electrical specifications before design finalization.

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Recommended Operating Conditions

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Frequently Asked Questions (FAQs)

What is the XC3S5000-4FGG676C?

The XC3S5000-4FGG676C is a 5-million gate FPGA from Xilinx’s Spartan-3 family. It features 74,880 logic cells, 1,728 Kbits of block RAM, 104 dedicated 18×18 multipliers, 4 DCMs, and up to 489 user I/O pins in a 676-pin Pb-free FBGA package. It operates on a 1.2V core supply and is rated for commercial temperatures (0°C to +85°C).

What is the difference between XC3S5000-4FGG676C and XC3S5000-4FG676C?

The only difference is the package finish. The FGG variant is Pb-free (lead-free) and RoHS-compliant, while the standard FG variant uses conventional tin-lead solder balls. Both are electrically and functionally identical and are pin-compatible.

What design software is used for XC3S5000-4FGG676C?

Xilinx ISE Design Suite 14.7 is the recommended toolchain. The Spartan-3 family is not supported by the newer Vivado Design Suite, which targets Xilinx 7-series and later devices.

Is the XC3S5000-4FGG676C still in production?

The Spartan-3 family has reached end-of-life for new designs, though inventory remains available through distribution channels. Engineers starting new designs should evaluate the Spartan-6 or Spartan-7 families for an upgrade path. Existing designs using this device continue to be supported in maintenance mode.

What are compatible alternative parts?

Pin-compatible and functionally similar alternatives include:

• XC3S5000-4FGG676I — same device, industrial temperature grade
• XC3S4000-4FGG676C — lower gate count (4M gates), same package
• XC6SLX75-3FGG676C — Spartan-6, higher performance upgrade path