The XC3S5000-4FG900C is a high-density, cost-optimized Field Programmable Gate Array (FPGA) manufactured by AMD Xilinx, part of the industry-proven Spartan-3 family. Designed for high-volume, cost-sensitive applications, this device delivers 5 million system gates, 74,880 logic cells, and a robust 900-pin Fine-Pitch Ball Grid Array (FBGA) package — making it one of the most capable devices in its class. Whether you are developing communications infrastructure, embedded systems, or consumer electronics, the XC3S5000-4FG900C offers the logic density, I/O flexibility, and programmable performance to meet demanding design requirements.
If you are looking for a reliable source to buy or learn more about Xilinx FPGA products, the XC3S5000-4FG900C is an excellent starting point for high-density programmable logic designs.
What Is the XC3S5000-4FG900C?
The XC3S5000-4FG900C is a member of the Xilinx Spartan-3 FPGA family, which was architected to deliver maximum logic density at the lowest possible cost. It is built on an advanced 90nm process technology, operates at a core voltage of 1.2V, and is housed in a 900-pin FBGA (Fine-Pitch Ball Grid Array) package with a commercial temperature grade (0°C to +85°C).
The “4” in the part number denotes the speed grade, which determines the internal propagation delays and maximum operating frequency. The “FG900” designates the FG (Fine-pitch) 900-pin BGA package, and the “C” suffix confirms it is a commercial-grade device.
Key Specifications at a Glance
| Parameter |
Value |
| Manufacturer |
AMD Xilinx (formerly Xilinx, Inc.) |
| Part Number |
XC3S5000-4FG900C |
| FPGA Family |
Spartan-3 |
| System Gates |
5,000,000 (5M) |
| Logic Cells |
74,880 |
| CLB Slices |
33,280 |
| Internal Clock Speed |
630 MHz |
| Process Technology |
90nm |
| Core Supply Voltage (VCCINT) |
1.2V |
| Package Type |
F-BGA (Fine-Pitch Ball Grid Array) |
| Pin Count |
900 |
| User I/O Pins |
784 (max) |
| Block RAM |
1,872 Kbits (104 x 18Kbit blocks) |
| Dedicated Multipliers |
104 |
| Digital Clock Managers (DCMs) |
8 |
| Temperature Grade |
Commercial (0°C to +85°C) |
| RoHS Compliance |
Yes (standard) |
XC3S5000-4FG900C Logic Resources
Configurable Logic Blocks (CLBs)
The XC3S5000-4FG900C contains 33,280 CLB slices, organized in pairs of slices per CLB. Each slice includes:
- Two 4-input Look-Up Tables (LUTs) for implementing logic functions
- Two flip-flops or latches for sequential logic
- Fast carry logic for efficient arithmetic operations
- Wide-function multiplexers (F5MUX, F6MUX, F7MUX, F8MUX)
- Support for Distributed RAM and 16-bit shift registers (SRL16)
This architecture allows designers to implement a wide range of digital functions, from simple Boolean gates to complex state machines and DSP pipelines.
Block RAM
The device provides 1,872 Kbits of block RAM distributed across 104 dedicated 18-Kbit RAM blocks. Each block RAM can be configured as:
| Block RAM Configuration |
Description |
| True Dual-Port RAM |
Independent read/write on both ports |
| Simple Dual-Port RAM |
One read port, one write port |
| Single-Port RAM |
Single bidirectional port |
| ROM |
Read-only configuration |
| FIFO |
First-In, First-Out buffer |
Block RAM columns are distributed across the device, with each 18-Kbit block paired with a dedicated 18×18-bit multiplier for efficient DSP operations.
Dedicated Multipliers
The XC3S5000-4FG900C includes 104 dedicated 18×18-bit multipliers, each physically paired with a block RAM for maximum computational throughput. These hardware multipliers are critical for:
- Digital Signal Processing (DSP) algorithms
- FIR and IIR filter implementations
- Fast Fourier Transform (FFT) engines
- Video and image processing pipelines
- Arithmetic-intensive embedded control loops
I/O Architecture and Supported Standards
I/O Overview
| I/O Parameter |
Value |
| Total Package Pins |
900 |
| Maximum User I/O |
784 |
| I/O Banks |
8 |
| Differential I/O Pairs |
Up to 376 |
| Dedicated Configuration Pins |
Included |
SelectIO™ Supported Standards
The XC3S5000-4FG900C supports Xilinx’s SelectIO™ technology, providing compatibility with a broad range of single-ended and differential I/O standards:
| Standard Type |
Supported Standards |
| Single-Ended |
LVCMOS 3.3V / 2.5V / 1.8V / 1.5V, LVTTL, PCI, GTL, GTLP |
| Differential |
LVDS, BLVDS, LVPECL, RSDS, HSTL, SSTL |
| Memory Interface |
DDR SDRAM, SSTL2, SSTL18 |
| Bus Standards |
PCI (3.3V), AGP |
Each I/O bank has its own VCCO supply pin for flexible multi-voltage operation. This feature makes the XC3S5000-4FG900C particularly well suited for mixed-voltage system designs.
Digitally Controlled Impedance (DCI)
The device supports DCI (Digitally Controlled Impedance), which automatically matches the output drive impedance to the transmission line, eliminating the need for external termination resistors in high-speed bus interfaces.
Digital Clock Manager (DCM)
The XC3S5000-4FG900C features 8 Digital Clock Managers (DCMs), positioned at the ends of the block RAM columns. Each DCM provides:
- Delay-Locked Loop (DLL) for clock deskewing and duty-cycle correction
- Digital Frequency Synthesis (DFS) for multiplication and division of input clock frequencies
- Phase shifting — coarse (90°, 180°, 270°) and fine (1/256th of a clock period)
- Clock feedback to eliminate clock distribution delays
DCMs can be cascaded to generate multiple derived clock domains from a single input reference, greatly simplifying complex multi-clock system designs.
Configuration and Programming
Configuration Modes
The XC3S5000-4FG900C supports multiple configuration modes to suit different system architectures:
| Configuration Mode |
Description |
| Master Serial |
FPGA drives the configuration clock; uses external SPI Flash |
| Slave Serial |
External master drives configuration |
| Master Parallel (SelectMAP) |
Parallel 8-bit byte-wide configuration |
| Slave Parallel (SelectMAP) |
Byte-wide slave mode for processor-driven config |
| JTAG (Boundary Scan) |
IEEE 1149.1-compliant in-system programming and debug |
Configuration Memory Size
The XC3S5000 requires approximately 20Mbit of configuration data. Suitable external storage devices include standard SPI Serial Flash, Platform Flash XL, or BPI (Byte-wide Peripheral Interface) Flash memories.
JTAG Support
All Spartan-3 devices, including the XC3S5000-4FG900C, support full IEEE 1149.1 JTAG boundary scan, which enables:
- In-circuit programming and reconfiguration
- Functional debugging via ChipScope Pro
- Production test and verification
Ordering Information and Part Number Decoder
Understanding the part number helps identify the exact variant you need:
| Field |
Code |
Meaning |
| Device Family |
XC3S |
Xilinx Spartan-3 |
| Gate Count |
5000 |
5 million system gates |
| Speed Grade |
-4 |
Speed Grade 4 (commercial speed) |
| Package |
FG |
Fine-Pitch Ball Grid Array (FBGA) |
| Pin Count |
900 |
900 total package pins |
| Temperature |
C |
Commercial (0°C to +85°C) |
Full Part Number: XC3S5000-4FG900C
For industrial temperature range applications (–40°C to +100°C), the equivalent part is the XC3S5000-4FG900I.
Absolute Maximum Ratings
| Parameter |
Maximum Value |
| VCCINT (Core Supply) |
–0.5V to +1.5V |
| VCCO (I/O Supply) |
–0.5V to +4.0V |
| VCCAUX (Auxiliary Supply) |
–0.5V to +3.0V |
| Input Voltage (any pin) |
–0.5V to VCCO + 0.5V |
| Storage Temperature |
–65°C to +150°C |
| Junction Temperature |
+125°C |
Note: Exceeding absolute maximum ratings may cause permanent device damage. Always operate within recommended operating conditions for reliable long-term performance.
Recommended Operating Conditions
| Parameter |
Min |
Typical |
Max |
Unit |
| VCCINT |
1.14 |
1.20 |
1.26 |
V |
| VCCO (3.3V bank) |
3.135 |
3.3 |
3.465 |
V |
| VCCO (2.5V bank) |
2.375 |
2.5 |
2.625 |
V |
| VCCO (1.8V bank) |
1.71 |
1.8 |
1.89 |
V |
| VCCAUX |
2.375 |
2.5 |
2.625 |
V |
| Commercial Temp (Tj) |
0 |
— |
+85 |
°C |
Typical Applications for XC3S5000-4FG900C
The XC3S5000-4FG900C is used across a wide range of industries and application domains:
Communications and Networking
- Gigabit Ethernet MAC and PHY interfaces
- Packet processing and protocol bridging
- SONET/SDH framing and mapping
- Wireless baseband processing
Consumer Electronics
- High-definition video display controllers
- Set-top box signal processing
- Digital television (DTV) front-end processing
- Home networking and broadband access equipment
Embedded Systems and Industrial Automation
- Custom processor cores (soft-core CPU integration)
- Real-time control systems
- Machine vision and image capture
- Robotics and motion control
Test and Measurement
- Arbitrary waveform generation
- Digital data acquisition front-ends
- Protocol analyzers
- Automated test equipment (ATE) logic
Automotive and Aerospace
- ADAS processing and sensor fusion
- In-vehicle network bridging
- Radar and lidar signal processing (with radiation-tolerant variants)
Development Tools and Design Support
Xilinx (now AMD) provides a comprehensive ecosystem of tools for designing with the XC3S5000-4FG900C:
| Tool |
Description |
| ISE Design Suite |
Primary design tool for Spartan-3 (synthesis, implementation, bitstream) |
| XST (Xilinx Synthesis Technology) |
HDL synthesis for VHDL and Verilog |
| ChipScope Pro |
In-system logic analyzer for debugging |
| CORE Generator |
IP core generation for common functions |
| PlanAhead |
Floorplanning and physical design exploration |
| ModelSim / Questa |
HDL simulation (third-party, Xilinx-supported) |
Note: The Vivado Design Suite does not support the Spartan-3 family. Designers should use ISE Design Suite 14.7 (the final ISE release), which is available free of charge from AMD’s website and runs on Windows and Linux.
XC3S5000-4FG900C vs. Other Spartan-3 Variants
| Part Number |
Gates |
Package |
Pins |
I/O |
Temp Grade |
Speed |
| XC3S5000-4FG900C |
5M |
FBGA |
900 |
784 |
Commercial |
-4 |
| XC3S5000-4FG900I |
5M |
FBGA |
900 |
784 |
Industrial |
-4 |
| XC3S5000-5FG900C |
5M |
FBGA |
900 |
784 |
Commercial |
-5 (faster) |
| XC3S5000-4FG676C |
5M |
FBGA |
676 |
596 |
Commercial |
-4 |
| XC3S4000-4FG676C |
4M |
FBGA |
676 |
512 |
Commercial |
-4 |
The XC3S5000-4FG900C offers the largest I/O count in the standard Spartan-3 5M-gate family (FG900 package), making it ideal for designs that require a high number of external interface pins.
Frequently Asked Questions (FAQ)
Q: What is the maximum user I/O count for the XC3S5000-4FG900C? A: The device supports up to 784 user-configurable I/O pins in the 900-pin FBGA package.
Q: What core voltage does the XC3S5000-4FG900C require? A: The recommended core supply voltage (VCCINT) is 1.2V, with a tolerance of ±5% (1.14V–1.26V).
Q: Is the XC3S5000-4FG900C RoHS compliant? A: Yes. The standard (non-G) version ships in conventional packaging. A lead-free (Pb-free) variant with a “G” suffix in the package code is also available for full RoHS compliance.
Q: What design tools support the XC3S5000-4FG900C? A: Xilinx ISE Design Suite 14.7 is the correct tool for all Spartan-3 devices. The Vivado suite does not support this family.
Q: Can the XC3S5000-4FG900C be used in industrial temperature environments? A: For industrial temperature range (–40°C to +100°C), select the XC3S5000-4FG900I instead.
Q: What configuration memory is recommended for use with this device? A: Xilinx Platform Flash XL (XCF32P or XCF32PVO48C) is the preferred Xilinx-branded configuration memory. Standard SPI Flash devices from Micron, Spansion, or Winbond are also widely used.
Summary
The XC3S5000-4FG900C is the flagship device of the Xilinx Spartan-3 family, offering an outstanding combination of logic density (5M gates / 74,880 cells), high-speed performance (630 MHz internal clock), broad I/O support (784 user pins), and a mature, well-documented toolchain. Its 90nm process, 1.2V core operation, and 900-pin FBGA package make it a proven choice for designers building cost-sensitive, high-volume digital systems.
With 104 block RAMs, 104 hardware multipliers, and 8 Digital Clock Managers, it provides the resources needed for complex multi-functional designs — all within a single programmable device.
