The XC3S5000-4FG1156C is a high-capacity Field-Programmable Gate Array from Xilinx’s Spartan-3 family, now part of the AMD portfolio. Designed for cost-sensitive, high-volume applications, this FPGA delivers 5,000,000 system gates in a 1156-pin Fine-Pitch Ball Grid Array (FBGA) package. Whether you are building broadband access equipment, digital television systems, or industrial control hardware, the XC3S5000-4FG1156C provides the logic density, I/O flexibility, and clock management performance required for demanding designs.

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What Is the XC3S5000-4FG1156C?

The XC3S5000-4FG1156C belongs to the Xilinx Spartan-3 series — an eight-member FPGA family that spans 50,000 to 5,000,000 system gates. The “XC3S5000” designation refers to the largest device in the family: 5 million system gates. The “-4” speed grade indicates a commercial-grade operating speed, and the “FG1156” suffix identifies the 1156-pin FBGA package. The “C” suffix confirms a commercial temperature range (0°C to +85°C).

This device is manufactured on 90nm process technology and operates at a core supply voltage of 1.2V, making it well suited for modern, power-aware system designs. It is sourced and distributed by Rochester Electronics LLC as a certified, fully authorized component.

If you are evaluating Xilinx FPGA solutions for your next project, the XC3S5000-4FG1156C stands out as one of the densest and most capable devices in the cost-optimized Spartan-3 portfolio.

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XC3S5000-4FG1156C Key Specifications

The table below summarizes the core electrical and physical specifications of the XC3S5000-4FG1156C.

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XC3S5000-4FG1156C Part Number Decoder

Understanding the part number helps engineers quickly identify the exact variant they need.

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Architecture and Logic Resources

Configurable Logic Blocks (CLBs) and Slices

The XC3S5000-4FG1156C contains 8,320 CLBs, each composed of four slices. Each slice includes two 4-input Look-Up Tables (LUTs) and two flip-flops, giving designers a flexible building block for combinational and sequential logic. The total slice count reaches 33,280, which translates to industry-leading logic density within the Spartan-3 family.

Block RAM and Distributed RAM

For data storage within the FPGA fabric, the XC3S5000-4FG1156C provides:

• Block RAM: 1,916,928 bits (~234 KB) organized in 18Kb dual-port RAM blocks — ideal for FIFOs, lookup tables, and line buffers.
• Distributed RAM: 520,000 bits embedded within the LUT fabric — suitable for small, fast memories close to logic resources.

Dedicated Multiplier Blocks

With 104 dedicated 18×18-bit multipliers, the XC3S5000-4FG1156C handles DSP-intensive workloads without consuming general logic resources. These multipliers support high-speed arithmetic operations used in signal processing, image processing, and communications filtering.

Digital Clock Managers (DCMs)

The device features 24 Digital Clock Managers, enabling sophisticated clock synthesis, deskewing, phase shifting, and frequency multiplication. This rich clock management capability is essential for multi-clock-domain designs common in video, networking, and industrial control systems.

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I/O Capabilities and Package Details

Pin Configuration

Supported I/O Standards

The XC3S5000-4FG1156C supports a broad range of single-ended and differential I/O standards, allowing seamless interfacing with external memories, ASICs, processors, and bus systems:

• Single-ended: LVTTL, LVCMOS 3.3V/2.5V/1.8V/1.5V/1.2V, PCI, SSTL2/SSTL3, HSTL
• Differential: LVDS, BLVDS, LVPECL, RSDS, Mini-LVDS

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Power Supply Requirements

The multi-rail power architecture allows I/O banks to operate at different voltage levels simultaneously, supporting mixed-voltage system designs without external level translators.

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Configuration Options

The XC3S5000-4FG1156C supports multiple configuration interfaces to suit different system architectures:

After power-up, configuration data can be loaded in under 100ms using standard Platform Flash devices, minimizing system startup latency.

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Typical Applications

The XC3S5000-4FG1156C is well suited for a wide range of application domains where high logic density and flexible I/O are required:

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XC3S5000-4FG1156C vs. Related Variants

Designers evaluating the XC3S5000 family can choose from several package and speed grade options. The table below compares the most common variants.

Note: The XC3S5000-4FG1156C offers the highest I/O count (up to 784 user I/Os) among all XC3S5000 package variants, making it the preferred choice for I/O-intensive designs.

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Ordering and Availability

As a legacy Xilinx component, the XC3S5000-4FG1156C is primarily available through authorized distributors and certified aftermarket sources. Rochester Electronics is an authorized source for long-lifecycle and end-of-life Xilinx components, ensuring authenticity and traceability.

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Design Tools and Support

Xilinx Spartan-3 devices including the XC3S5000-4FG1156C are supported by:

• Xilinx ISE Design Suite — The primary design environment for all Spartan-3 devices, supporting HDL synthesis, place-and-route, timing analysis, and bitstream generation.
• ModelSim / iSim — For RTL and gate-level simulation.
• ChipScope Pro — For in-system logic analysis via JTAG.
• CORE Generator — For instantiating optimized IP cores (memory controllers, FIFOs, DSP blocks, etc.).

Note: The Xilinx Vivado Design Suite does not support Spartan-3 devices. ISE Design Suite version 14.7 is the recommended and final supported toolchain for XC3S5000 designs.

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Frequently Asked Questions (FAQ)

What is the XC3S5000-4FG1156C used for?

The XC3S5000-4FG1156C is used in applications requiring high logic density and large I/O counts, including digital television equipment, broadband networking hardware, industrial automation systems, and embedded co-processing platforms.

What is the difference between XC3S5000-4FG1156C and XC3S5000-5FGG1156C?

The primary difference is the speed grade. The -4 variant operates at up to 630 MHz while the -5 variant reaches up to 725 MHz. Both share the same 1156-pin FBGA package and silicon architecture.

Is the XC3S5000-4FG1156C RoHS compliant?

No. As a legacy Xilinx component, the XC3S5000-4FG1156C is not RoHS compliant. Engineers with strict environmental compliance requirements should verify with their authorized distributor regarding available lead-free options or consider successor families.

What software tools support the XC3S5000-4FG1156C?

The device is supported by Xilinx ISE Design Suite 14.7, which is the final release supporting Spartan-3. Vivado does not support this device family.

Can the XC3S5000-4FG1156C implement a soft processor?

Yes. The device can implement the MicroBlaze soft processor core, enabling full embedded system designs including CPU, memory, and peripheral IP within the FPGA fabric.

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Summary

The XC3S5000-4FG1156C is one of the most capable devices in the Xilinx Spartan-3 family, combining 5 million system gates, 74,880 logic cells, 234 KB of block RAM, 104 dedicated multipliers, and 24 Digital Clock Managers in a proven 90nm silicon platform. Its 1156-pin FBGA package maximizes available user I/O, making it an ideal fit for I/O-rich designs in consumer electronics, industrial systems, and broadband communications.

For engineers and procurement teams sourcing this component, ensure purchases are made through authorized distributors such as Rochester Electronics to guarantee authenticity, proper documentation, and reliable supply chain traceability.