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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC3S50-5TQG144C: Xilinx Spartan-3 FPGA – Full Specs & Product Guide

Product Details

The XC3S50-5TQG144C is a high-performance, cost-efficient Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-3 family. Designed for high-volume, I/O-intensive applications, this device delivers 50,000 system gates in a compact 144-pin TQFP package. Whether you are developing embedded systems, consumer electronics, or industrial control applications, the XC3S50-5TQG144C offers a proven, flexible, and affordable programmable logic solution.

As part of the broader Xilinx FPGA product portfolio, the Spartan-3 series stands out for its mature 90nm process technology, low power consumption, and extensive I/O flexibility — making the XC3S50-5TQG144C an excellent choice for both new designs and legacy system support.


What Is the XC3S50-5TQG144C?

The XC3S50-5TQG144C is a member of the Xilinx Spartan-3 FPGA family, a family that spans densities from 50K to 5 million system gates. The “XC3S50” designates the 50K-gate device in the family, “-5” indicates the high-performance speed grade, “TQG” refers to the Pb-free 144-pin Thin Quad Flat Pack (TQFP) package, and “C” indicates the commercial temperature range (0°C to +85°C).

This FPGA is manufactured on a 90nm CMOS process and operates at a core voltage of 1.2V, making it suitable for modern low-power digital designs.


XC3S50-5TQG144C Key Specifications

The table below summarizes the primary technical specifications of the XC3S50-5TQG144C:

Parameter Value
Manufacturer Xilinx (now AMD)
Part Number XC3S50-5TQG144C
FPGA Family Spartan-3
System Gates 50,000
Logic Cells 1,728
CLB Array 16 × 12
CLBs (Total) 192
Flip-Flops 1,536
Distributed RAM 12 Kbits
Block RAM 72 Kbits
Multipliers (18×18) 4
DCMs (Digital Clock Managers) 2
Max User I/O Pins 97
Speed Grade -5 (High Performance)
Package Type TQG144 (Pb-free 144-pin TQFP)
Process Technology 90nm
Core Supply Voltage (VCCINT) 1.2V
Auxiliary Supply (VCCAUX) 2.5V
Operating Temperature 0°C to +85°C (Commercial)
Maximum Clock Frequency 725 MHz

XC3S50-5TQG144C Pin Configuration & Package Details

The TQG144 package is a 144-pin Thin Quad Flat Pack (TQFP) with lead-free (Pb-free) construction, denoted by the “G” in the package code. This package is widely used in space-constrained PCB designs where a fine-pitch SMD component is required.

Package Attribute Detail
Package Type TQFP (Thin Quad Flat Pack)
Pin Count 144
Pb-Free / RoHS Compliant Yes (indicated by “G” suffix)
Mounting Type Surface Mount
Max User I/O 97
I/O Banks 4
Configuration Pins Dedicated (not included in user I/O count)

Spartan-3 Internal Architecture Overview

Understanding the internal architecture of the XC3S50-5TQG144C helps engineers make full use of its capabilities. The Spartan-3 architecture consists of five main programmable functional elements:

Configurable Logic Blocks (CLBs)

The XC3S50-5TQG144C contains 192 CLBs arranged in a 16×12 array. Each CLB contains four slices, and each slice contains two 4-input Look-Up Tables (LUTs), two storage elements (flip-flops or latches), and carry/control logic. CLBs are the primary resource for implementing custom combinational and sequential logic.

Block RAM

The device includes 72 Kbits of block RAM organized as a single column of 18-Kbit dual-port RAM blocks. Each RAM block supports independent read and write operations on two ports simultaneously, enabling efficient data buffering and FIFO implementations.

Dedicated Multipliers

Four 18×18-bit dedicated multipliers are embedded directly in the FPGA fabric. These hardware multipliers enable high-speed arithmetic operations for DSP-adjacent applications without consuming CLB resources.

Digital Clock Managers (DCMs)

Two Digital Clock Managers provide advanced clock control features including frequency synthesis, phase shifting, and clock deskewing. DCMs support a wide range of clocking topologies and are essential for timing closure in complex designs.

Input/Output Blocks (IOBs)

The 97 user-configurable IOBs support a wide variety of single-ended and differential I/O standards, enabling the XC3S50-5TQG144C to interface with a broad range of external devices and buses.


Supported I/O Standards

The XC3S50-5TQG144C supports an extensive set of I/O standards, enabling seamless integration into mixed-voltage and high-speed system designs.

I/O Standard Category Standards Supported
Single-Ended LVCMOS33, LVCMOS25, LVCMOS18, LVCMOS15, LVTTL, PCI, GTLP
Differential LVDS, RSDS, BLVDS, DIFF_HSTL, DIFF_SSTL
High-Speed HSTL Class I/III, SSTL18 Class I/II, SSTL2 Class I/II

Note: DCI (Digitally Controlled Impedance) signal standards are not supported in Bank 5 of any Spartan-3 FPGA in the TQ144 package.


XC3S50-5TQG144C Ordering Information Decoded

The part number encodes critical product information. Here is a breakdown:

Code Segment Meaning
XC Xilinx product prefix
3S Spartan-3 family
50 50K system gates density
-5 High-performance speed grade (fastest in family)
TQG Pb-free 144-pin Thin Quad Flat Pack (TQFP)
144 144 total pin count
C Commercial temperature range (0°C to +85°C)

For industrial temperature applications (-40°C to +100°C), the equivalent part number uses the suffix “I” instead of “C.”


Applications & Use Cases

The XC3S50-5TQG144C is well-suited for a wide range of applications where a balance of cost, I/O flexibility, and programmable logic density is required:

Application Segment Example Use Cases
Consumer Electronics Set-top boxes, digital cameras, home networking devices
Industrial Automation Motor control, sensor interfaces, PLC co-processors
Communications Protocol bridges, serial interface controllers, UART/SPI/I2C logic
Embedded Systems Glue logic, bus arbitration, custom peripheral interfaces
Prototyping & Education FPGA development boards, academic research, logic experimentation
Automotive Low-risk legacy interface adaptation (commercial grade)

Design Tools & Development Support

Xilinx (now AMD) provides comprehensive tooling for designing with the XC3S50-5TQG144C:

  • ISE Design Suite – The legacy Xilinx Integrated Synthesis Environment (ISE) provides full support for Spartan-3 design, including synthesis, implementation, simulation, and bitstream generation. ISE is the primary recommended tool for this device family.
  • VHDL / Verilog / SystemVerilog – All standard HDL languages are supported for design entry.
  • ModelSim / ISim – Functional and timing simulation can be performed to validate designs before programming.
  • JTAG Configuration – The device is programmed via a standard JTAG interface (IEEE 1149.1), enabling in-circuit programming and debugging.

The newer Vivado Design Suite does not support Spartan-3 devices. Use ISE 14.7 for all XC3S50-based designs.


Configuration Modes

The XC3S50-5TQG144C supports multiple configuration modes, providing flexibility for different system architectures:

Configuration Mode Description
Master Serial FPGA drives a serial Flash to load configuration data
Slave Serial An external processor drives configuration data serially
Master SPI Uses SPI Flash memory for configuration
Master BPI (Parallel) Uses parallel NOR Flash for faster configuration
JTAG IEEE 1149.1 boundary scan for programming and debug

XC3S50-5TQG144C vs. Related Part Numbers

Engineers often compare this part against similar variants. The table below highlights key differences:

Part Number Speed Grade Temp Range Package Gates Notes
XC3S50-5TQG144C -5 (High) Commercial (0–85°C) 144 TQFP Pb-free 50K This product
XC3S50-4TQG144C -4 (Standard) Commercial (0–85°C) 144 TQFP Pb-free 50K Lower speed grade
XC3S50-5TQG144I -5 (High) Industrial (–40–100°C) 144 TQFP Pb-free 50K Industrial temp range
XC3S50-5VQG100C -5 (High) Commercial (0–85°C) 100 VQFP Pb-free 50K Smaller package, fewer I/Os
XC3S50A-5TQG144C -5 (High) Commercial (0–85°C) 144 TQFP Pb-free 50K Spartan-3A family (enhanced)

Electrical Characteristics Summary

Parameter Min Typical Max Unit
VCCINT (Core Voltage) 1.14 1.20 1.26 V
VCCAUX (Auxiliary Voltage) 2.375 2.5 2.625 V
VCCO (I/O Bank Voltage) 1.14 3.465 V
Operating Temp (Commercial) 0 +85 °C
Junction Temp (Tj max) 125 °C

Why Choose the XC3S50-5TQG144C?

The XC3S50-5TQG144C offers several compelling advantages for engineers and procurement teams:

Cost Efficiency – The Spartan-3 family was architected for high-volume, cost-sensitive markets. The 50K-gate density provides significant programmable logic capability at a competitive price point compared to ASICs or larger FPGA families.

Mature, Stable Platform – Based on proven 90nm technology with years of production history, this device offers supply chain stability and well-understood electrical behavior for long-lifecycle programs.

High-Performance Speed Grade – The -5 speed grade is the fastest offered in the Spartan-3 family, supporting system clock frequencies up to 725 MHz and minimizing timing closure challenges.

Pb-Free Compliance – The “G” in the package code confirms RoHS-compliant, lead-free construction, meeting global environmental regulations for electronics manufacturing.

Broad I/O Standard Support – With 97 user I/Os and support for both single-ended and differential standards across multiple voltage levels, the XC3S50-5TQG144C adapts to diverse system interface requirements.


Frequently Asked Questions (FAQ)

Q: Is the XC3S50-5TQG144C still in production? A: Xilinx (AMD) has indicated Spartan-3 as recommended for new designs in some documentation; however, this is a mature product family. Always verify current production and last-time-buy status with your distributor before committing to large volume orders.

Q: What design tool should I use for the XC3S50-5TQG144C? A: Use Xilinx ISE Design Suite 14.7, the final version of ISE. Vivado does not support Spartan-3 devices.

Q: What is the difference between XC3S50-5TQG144C and XC3S50A-5TQG144C? A: The XC3S50A is from the enhanced Spartan-3A sub-family, which offers additional features such as dual VCCAUX supply support, configuration improvements, and slightly different cell counts (1,584 cells vs. 1,728). The core XC3S50 (non-A) and Spartan-3A are not pin-compatible, so they cannot be used as drop-in replacements.

Q: How is the XC3S50-5TQG144C configured? A: The device is configured via JTAG or from an external non-volatile memory source (SPI Flash, BPI Flash, or serial PROM) at power-up. Configuration is stored in SRAM-based configuration latches, so the bitstream must be reloaded at every power cycle unless an external configuration memory is used.

Q: What is the maximum I/O count for the TQ144 package? A: The TQ144 package supports up to 97 user I/O pins for the XC3S50 device density.


Summary

The XC3S50-5TQG144C is a mature, reliable, and cost-effective FPGA from the Xilinx Spartan-3 family. With 50K system gates, 1,728 logic cells, 72 Kbits of block RAM, four 18×18 multipliers, and two DCMs — all in a compact 144-pin Pb-free TQFP package — it remains a strong solution for high-volume embedded and interface applications. Its -5 high-performance speed grade and broad I/O standard support make it equally suitable for performance-critical glue logic and I/O expansion roles.

For engineers seeking a proven programmable logic device with a well-established ecosystem of tools and documentation, the XC3S50-5TQG144C delivers reliable results.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.